[nextpage title=”Introduction”]
Sempron is an AMD CPU targeted to the entry-level market, i.e., to users that don’t need a high processing power and are more worried with price than performance. Sempron main competitor is Celeron from Intel and you can read our tutorial Sempron vs. Celeron D for a technical comparison between these two CPUs.
Sempron is available with five socket types: 462, 754, AM2, AM3 and S1 (this one for laptops only). Sempron processors based on socket 462 are simpler versions of Athlon XP, while Sempron processors based on socket 754, socket AM2 and socket S1 are simpler versions of Athlon 64. AM3 versions derive from Athlon II X2 processor, but with only one processing core.
Watch out: since socket-462 Sempron processors use a totally different architecture from other Sempron processors, it is not possible to compare them directly.
The “PR” (Performance Rating) system used by Sempron can only be used to compare models using the same socket type. It is not possible to compare Sempron’s PR rating with Athlon XP’s or Athlon 64’s. For example, a Sempron 3000+ isn’t necessarily faster than an Athlon XP 2800+ or than an Athlon 64 2800+. By the same token a socket-462 Sempron 3000+ isn’t necessarily faster than a socket-754 Sempron 2800+. As we said, we can only use this naming scheme to compare Sempron models based on the same socket. We can say for sure, for example, that a socket-754 Sempron 3000+ is faster than a Sempron 2800+ also based on socket 754.
Let’s talk now about the features of each Sempron line (socket 462, socket 754, socket AM2, socket AM3 and socket S1), where we listed all Sempron models released to date.
[nextpage title=”Socket 462 Sempron”]
Sempron processors based on socket 462 are, in fact, Athlon XP processors with a 333 MHz external bus (166 MHz transferring two data per clock cycle) and 256 KB of L2 memory cache (or 512 KB on 3000+ model). Click here for a full comparison between socket-462 Sempron and Athlon XP.
This Sempron line has the same features of Athlon XP processors, like:
- 64 KB instruction L1 memory cache and 64 KB data L1 memory cache.
- 256 KB or 512 KB L2 memory cache.
- Support for MMX, 3DNow!, SSE and SSE2 instructions (no SSE3).
- 130 nm manufacturing process.
In the table below we list all Sempron socket 462 models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.
OPN (Tray) | OPN (Box) | Model | Clock | TDP | L2 Cache | Max. Temp. (º C) | Voltage |
SDA3000DUT4D | SDA3000BOX | 3000+ | 2 GHz | 62 W | 512 KB | 90 | 1.6 V |
SDC2800DUT3D | SDC2800BOX | 2800+ | 2 GHz | 62 W | 256 KB | 90 | 1.6 V |
SDA2800DUT3D | SDA2800BOX | 2800+ | 2 GHz | 62 W | 256 KB | 90 | 1.6 V |
SDA2600DUT3D | SDA2600BOX | 2600+ | 1.833 GHz | 62 W | 256 KB | 90 | 1.6 V |
SDA2500DUT3D | SDA2500BOX | 2500+ | 1.75 GHz | 62 W | 256 KB | 90 | 1.6 V |
SDC2400DUT3D | SDC2400BOX | 2400+ | 1.667 GHz | 62 W | 256 KB | 90 | 1.6 V |
SDA2400DUT3D | SDA2400BOX | 2400+ | 1.667 GHz | 62 W | 256 KB | 90 | 1.6 V |
SDA2300DUT3D | SDA2300BOX | 2300+ | 1.583 GHz | 62 W | 256 KB | 90 | 1.6 V |
SDC2200DUT3D | SDC2200BOX | 2200+ | 1.5 GHz | 62 W | 256 KB | 90 | 1.6 V |
SDA2200DUT3D | SDA2200BOX | 2200+ | 1.5 GHz | 62 W | 256 KB | 90 | 1.6 V |
[nextpage title=”Socket 754 Sempron”]
Sempron processors based on socket 754 are in fact Athlon 64 processors with less L2 memory cache and without the 64-bit extensions. However, Sempron models launched recently are coming with 64-bit technology support.
The main specifications for Sempron processors based on socket 754 include:
- 64 KB instruction L1 memory cache and 64 KB data L1 memory cache
- 128 KB or 256 KB L2 memory cache
- HyperTransport bus running at 800 MHz (3.2 GB/s). This clock may also be referred as “1,600 MHz”.
- DDR single channel memory configuration.
- SSE3 instruction set on models that have the 64-bit extensions enabled.
- 90 nm manufacturing process.
In the table below we list all Sempron socket 754 models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.
OPN (Tray) | OPN (Box) | Model | Clock | TDP | 64-bit | SSE3 | L2 Cache | Max. Temp. (º C) | Voltage |
SDA3400AIO3BX | SDA3400BXBOX | 3400+ | 2 GHz | 62 W | Yes | Yes | 256 KB | 69 | 1.4 V |
SDA3300AIO2BO | SDA3300BOBOX | 3300+ | 2 GHz | 62 W | Yes | Yes | 128 KB | 69 | 1.4 V |
SDA3300AIO2BX | SDA3300BXBOX | 3300+ | 2 GHz | 62 W | Yes | Yes | 128 KB | 69 | 1.4 V |
SDA3300AIO2BA | SDA3300BABOX | 3300+ | 2 GHz | 62 W | No | No | 128 KB | 70 | 1.4 V |
SDA3300AIO2BA | SDA3300CVBOX | 3300+ | 2 GHz | 62 W | No | No | 128 KB | 70 | 1.4 V |
SDA3100AIO3BA | SDA3100CVBOX | 3100+ | 1.8 GHz | 62 W | No | No | 256 KB | 70 | 1.4 V |
SDA3100AIP3AX | SDA3100AXBOX | 3100+ | 1.8 GHz | 62 W | No | No | 256 KB | 70 | 1.4 V |
SDA3100AIO3BA | SDA3100BABOX | 3100+ | 1.8 GHz | 62 W | No | No | 256 KB | 70 | 1.4 V |
SDA3100AIO3BO | SDA3100BOBOX | 3100+ | 1.8 GHz | 62 W | Yes | Yes | 256 KB | 69 | 1.4 V |
SDA3100AIO3BX | SDA3100BXBOX | 3100+ | 1.8 GHz | 62 W | Yes | Yes | 256 KB | 69 | 1.4 V |
SDA3000AIO2BA | SDA3000CVBOX | 3000+ | 1.8 GHz | 62 W | No | No | 128 KB | 70 | 1.4 V |
SDA3000AIO2BO | SDA3000BOBOX | 3000+ | 1.8 GHz | 62 W | Yes | Yes | 128 KB | 69 | 1.4 V |
SDA3000AIO2BX | SDA3000BXBOX | 3000+ | 1.8 GHz | 62 W | Yes | Yes | 128 KB | 69 | 1.4 V |
SDA3000AIP2AX | SDA3000AXBOX | 3000+ | 1.8 GHz | 62 W | No | No | 128 KB | 70 | 1.4 V |
SDA3000AIO2BA | SDA3000BABOX | 3000+ | 1.8 GHz | 62 W | No | No | 128 KB | 70 | 1.4 V |
SDA2800AIO3BA | SDA2800BABOX | 2800+ | 1.6 GHz | 62 W | No | No | 256 KB | 70 | 1.4 V |
SDA2800AIO3BA | SDA2800CVBOX | 2800+ | 1.6 GHz | 62 W | No | No | 256 KB | 70 | 1.4 V |
SDA2800AIO3BO | SDA2800BOBOX | 2800+ | 1.6 GHz | 62 W | Yes | Yes | 256 KB | 69 | 1.4 V |
SDA2800AIO3BX | SDA2800BXBOX | 2800+ | 1.6 GHz | 62 W | Yes | Yes | 256 KB | 69 | 1.4 V |
SDA2600AIO2BA | SDA2600BABOX | 2600+ | 1.6 GHz | 62 W | No | No | 128 KB | 70 | 1.4 V |
SDA2600AIO2BA | SDA2600CVBOX | 2600+ | 1.6 GHz | 62 W | No | No | 128 KB | 70 | 1.4 V |
SDA2600AIO2BX | SDA2600BXBOX | 2600+ | 1.6 GHz | 62 W | Yes | Yes | 128 KB | 69 | 1.4 V |
SDA2600AIO2BO | SDA2600BOBOX | 2600+ | 1.6 GHz | 62 W | Yes | Yes | 128 KB | 69 | 1.4 V |
SDA2500AIO3BX | SDA2500BXBOX | 2500+ | 1.4 GHz | 62 W | Yes | Yes | 256 KB | 69 | 1.4 V |
[nextpage title=”Socket AM2 Sempron”]
Contrary to socket 754 Sempron processors, which can only work under single channel configurarion, socket AM2 Sempron CPUs can use dual channel config, doubling the memory transfer rate if you use two or four memory modules in your PC. Keep in mind that socket 754 Sempron processors accept only DDR memories, while socket AM2 Sempron processors accept only DDR2 memories.
The main specifications for Sempron processors based on socket AM2 include:
- 64 KB instruction L1 memory cache and 64 KB data L1 memory cache
- 128 KB or 256 KB L2 memory cache
- HyperTransport bus running at 800 MHz (3.2 GB/s). This clock may also be referred as “1,600 MHz.”
- Memory controller supporting DDR2-400, DDR2-533 and DDR2-667 memories under dual channel configuration, meaning that the CPU accesses the memory 128 bits per time, if two or four memory modules are used.
- SSE3 instruction set.
- 64-bit instructions.
- 90 nm or 65 nm manufacturing process.
Recently AMD started using a new numbering system for their processors. This new system is more complicated than the previous one and will only be adopted by new processors, i.e., processors that were already launched with the old numbering system won’t have their model number replaced, keeping the old naming.
This new numbering system uses a five-character format: XX-####, where XX are letters and #### are numbers. The two letters indicate the processor class, with the second letter indicating the CPU thermal dissipation (TDP). The first number after the dash indicates the processor series and informs the CPU features. The three last numbers indicate the position of the CPU within its series and class. The higher this number, the more features the CPU has – usually indicating a higher performance within its class and series.
In the table below we list all Sempron socket AM2 models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.
OPN (Tray) | OPN (Box) | Model | Clock | TDP | L2 Cache | Max. Temp. (°C) | Voltage | Tech. |
SDH1300IAA4DP | SDH1300DPBOX | LE-1300 | 2.3 GHz | 45 W | 512 KB | 75 | 1.2 V / 1.30 V / 1.35 V | 65 nm |
SDH1250IAA4DP | SDH1250DPBOX | LE-1250 | 2.2 GHz | 45 W | 512 KB | 75 | 1.2 V / 1.45 V / 1.40 V | 65 nm |
SDH1200IAA4DE | SDH1200DPBOX | LE-1200 | 2.1 GHz | 45 W | 512 KB | 65 | 1.2 V / 1.45 V / 1.40 V | 65 nm |
SDH1150IAA3DE |
SDH1150DEBOX |
LE-1150 |
2.0 GHz |
45 W |
256 KB |
75 | 1.2 V / 1.45 V / 1.40 V |
65 nm |
SDH1100IAA3DE | SDH1100DPBOX | LE-1100 | 1.9 GHz | 45 W | 256 KB | 65 | 1.2 V / 1.45 V / 1.40 V | 65 nm |
SDA3800IAA3CN | SDA3800CNBOX | 3800+ | 2.2 GHz | 62 W | 256 KB | 55-69 | 1.25 / 1.35 / 1.40 V | 90 nm |
SDA3600IAA3CN | SDA3600CNBOX | 3600+ | 2.0 GHz | 62 W | 256 KB | 55-69 | 1.25 / 1.35 / 1.40 V | 90 nm |
SDA3500IAA2CN | SDA3500CNBOX | 3500+ | 2.0 GHz | 62 W | 128 KB | 55-69 | 1.25 / 1.35 / 1.40 V | 90 nm |
SDD3500IAA2CN | SDD3500CBNOX | 3500+ | 2.0 GHz | 35 W | 128 KB | 78 | 1.20 / 1.25 V | 90 nm |
SDA3400IAA3CN | SDA3400CNBOX | 3400+ | 1.8 GHz | 62 W | 256 KB | 55-69 | 1.25 / 1.35 / 1.40 V | 90 nm |
SDA3400IAA3CW | SDA3400CWBOX | 3400+ | 1.8 GHz | 62 W | 256 KB | 55-69 | 1.35 / 1.40 V | 90 nm |
SDD3400IAA3CN | SDD3400CBNOX | 3400+ | 1.8 GHz | 35 W | 256 KB | 78 | 1.20 / 1.25 V | 90 nm |
SDA3200IAA2CN | SDA3200CNBOX | 3200+ | 1.8 GHz | 62 W | 128 KB | 55-69 | 1.25 / 1.35 / 1.40 V | 90 nm |
SDD3200IAA2CN | SDD3200CNBOX | 3200+ | 1.8 GHz | 35 W | 128 KB | 78 | 1.20 / 1.25 V | 90 nm |
SDA3200IAA2CW | SDA3200CWBOX | 3200+ | 1.8 GHz | 62 W | 128 KB | 55-69 | 1.35 / 1.40 V | 90 nm |
SDA3000IAA3CN | SDA3000CNBOX | 3000+ | 1.6 GHz | 62 W | 256 KB | 55-69 | 1.25 / 1.35 / 1.40 V | 90 nm |
SDD3000IAA3CN | SDD3000CNBOX | 3000+ | 1.6 GHz | 35 W | 256 KB | 78 | 1.20 / 1.25V | 90 nm |
SDA2800IAA2CN | SDA2800CNBOX | 2800+ | 1.6 GHz | 62 W | 128 KB | 55-69 | 1.25 / 1.35 / 1.40 V | 90 nm |
[nextpage title=”Socket AM3 Sempron”]
Like socket AM2 versions, AM3 Sempron CPU is compatible with dual channel memory architecture, doubling the memory transfer rate as long as you use an even number of memory modules on your computer. Socket AM2 and AM2+ CPUs work only with DDR2 memories, but socket AM3 processors can work with both DDR2 and DDR3 memories, depending on which kind of motherboard you install them (socket AM2+ or socket AM3, respectively). This way these processors are also compatible with socket AM2+ motherboards and even with some socket AM2 ones.
Socket AM3 Sempron main features are:
- 64 KB L1 instruction cache and 64 KB L1 data cache.
- 1 MB L2 memory cache.
- One processing core.
- HyperTransport bus running at 2 GHz MHz (8 GB/s). This clock may also be referred as “4,000 MHz.”
- Memory controller supporting DDR2 memories when installed on socket AM2+ motherboards or DDR3 when installed on socket AM3 boards.
- SSE4a instruction set.
- 64-bit instructions.
- 45 nm manufacturing process.
In the table below we list the only Sempron socket AM3 model released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.
OPN (Tray) | OPN (Box) | Model | Clock | TDP | L2 Cache | Max. Temp. (°C) | Voltage |
Techn. |
SDX140HBK13GQ | SDX140HBGQBOX | 140 | 2.7 GHz | 45 W | 1 MB | 65 | – | 45 nm |
[nextpage title=”Sempron For Laptops”]
Besides Turion 64 and Athlon 64 Mobile, AMD also has launched Sempron models targeted to the mobile market, which are based on the socket AM2 version of Sempron.
The main specifications for Sempron processors targeted to laptops include:
- Socket S1 (the same socket used by Turion 64 X2)
- 64 KB instruction L1 memory cache and 64 KB data L1 memory cache
- 256 KB or 512 KB L2 memory cache
- HyperTransport bus running at 800 MHz (3.2 GB/s). This clock may also be referred as “1,600 MHz”.
- Memory controller supporting DDR2-400, DDR2-533 and DDR2-667 memories under dual channel configuration, meaning that the CPU accesses the memory 128 bits per time, if two or four memory modules are used.
- SSE3 instruction set.
- 64-bit instructions.
- 90 nm or 65 nm manufacturing process.
- PowerNow technology.
- Enhanced Virus Protection technology.
In the table below we list all Sempron socket S1 models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.
OPN | Model | Clock | TDP | L2 Cache |
Tech. |
SMD4000HAX4DN | 4000+ | 2.2 GHz | 31 W | 512 KB |
65 nm |
SMD3800HAX3CM | 3800+ | 2.2 GHz | 31 W | 256 KB |
90 nm |
SMD3800HAX3DN | 3800+ | 2.2 GHz | 31 W | 256 KB |
65 nm |
SMS3600HAX3CM | 3600+ | 2.0 GHz | 25 W | 256 KB |
90 nm |
SMS3600HAX3DN | 3600+ | 2.0 GHz | 25 W | 256 KB |
65 nm |
SMS3500HAX4CM | 3500+ | 1.8 GHz | 25 W | 512 KB |
90 nm |
SMS3400HAX3CM | 3400+ | 1.8 GHz | 25 W | 256 KB |
90 nm |
SMS3200HAX4CM | 3200+ | 1.6 GHz | 25 W | 512 KB |
90 nm |
SMSI40SAM12GG | SI-40 | 2.0 GHz | 25 W | 512 KB | 65 nm |
SMG210UOAX3DX | 210U | 1.5 GHz | 15 W | 256 KB | 65 nm |
SMF200UOAX3DV | 200U | 1.0 GHz | 8 W | 256 KB | 65 nm |
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