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Core i5-4xxx Models (Mobile)

The fourth-generation Core i3 processors targeted to mobile computers are based on the Haswell microarchitecture.

These processors support AVX2 instructions, not available on previous models.

The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port SATA-600 controller. On these models, the PCI Express controller supports only one x4 connection or four x1 connections. On the other models, the PCI Express controller supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).

Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 processing units), HD 4400 (codenamed “GT2”, 20 processing units), HD 4600 (codenamed “GT2”, 20 processing units), HD 5000 (codenamed “GT3”, 40 processing units), and Iris 5100 (codenamed “GT3”, 40 processing units).

The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.

Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Turbo Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SR17Q 4402E 1.6 GHz 2.7 GHz 2 Yes HD 4600 NA NA 22 nm 3 MiB 25 100 FCBGA1364
SR17M 4400E 2.7 GHz 3.3 GHz 2 Yes HD 4600 400 MHz 1 GHz 22 nm 3 MiB 37 100 FCBGA1364
SR16L 4350U 1.4 GHz 2.9 GHz 2 Yes HD 5000 200 MHz 1.1 GHz 22 nm 3 MiB 15 100 FCBGA1168
NA 4330M 2.8 GHz 3.5 GHz 2 Yes HD 4600 400 MHz 1.25 GHz 22 nm 3 MiB 37 100 NA
NA 4302Y 1.6 GHz 2.3 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 NA
NA 4300M 2.6 GHz 3.3 GHz 2 Yes HD 4600 400 MHz 1.25 GHz 22 nm 3 MiB 37 100 NA
SR1ED 4300U 1.9 GHz 2.9 GHz 2 Yes HD 4400 200 MHz 1.1 GHz 22 nm 3 MiB 15 100 FCBGA1168
SR192 4300Y 1.6 GHz 2.3 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168
SR189 4288U 2.6 GHz 3.1 GHz 2 Yes Iris 5100 200 MHz 1.2 GHz 22 nm 3 MiB 28 100 FCBGA1168
SR18A 4358U 2.4 GHz 2.9 GHz 2 Yes Iris 5100 200 MHz 1.1 GHz 22 nm 3 MiB 28 100 FCBGA1168
SR16M 4250U 1.3 GHz 2.6 GHz 2 Yes HD 5000 200 MHz 1 GHz 22 nm 3 MiB 15 100 FCBGA1168
SR191 4210Y 1.5 GHz 1.9 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168
NA 4202Y 1.6 GHz 2.0 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 NA
SR15G 4200H 2.8 GHz 3.4 GHz 2 Yes HD 4600 400 MHz 1.15 GHz 22 nm 3 MiB 47 100 FCBGA1364
SR1HA 4200M 2.5 GHz 3.1 GHz 2 Yes HD 4600 400 MHz 1.15 GHz 22 nm 3 MiB 37 100 FCPGA946
SR170 4200U 1.6 GHz 2.6 GHz 2 Yes HD 4400 200 MHz 1 GHz 22 nm 3 MiB 15 100 FCBGA1168
SR18T 4200Y 1.4 GHz 1.9 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

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Gabriel Torres is a Brazilian best-selling ICT expert, with 24 books published. He started his online career in 1996, when he launched Clube do Hardware, which is one of the oldest and largest websites about technology in Brazil. He created Hardware Secrets in 1999 to expand his knowledge outside his home country.