Core i5-3xxx Models (Mobile)
As their desktop counterparts, the Core i5-3xxx models targeted to mobile computers are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They can use either the BGA1023 pinout or the socket S2 pinout. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3, DDR3L, and DDR3L-RS memories. They also have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models have an integrated DirectX 11 video controller with 12 execution units (Intel HD 4000 graphics). This is one of the main differences between the mobile and the desktop models, since desktop models use the Intel HD 2500 graphics (six execution units). On “M” models, the graphics engine works at 650 MHz with 1.2 GHz at “boost” mode, while on “U” models, the graphics engine works at 350 MHz with a “boost” mode of 1.15 GHz on 34xx models or 1.05 GHz on 33xx models. All models support three displays (previous generations support two).
Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.
|sSpec||Model||Clock||Turbo Boost||Cores||HT||Video||Video Clock||Video Boost||Tech.||L3 Cache||TDP (W)||Max. Temp. (°C)*||Package|
|SR0N7||3427U||1.8 GHz||2.8 GHz||2||Yes||HD 4000||350 MHz||1.15 GHz||22 nm||3 MiB||17||105||BGA1023|
|SR0MV||3360M||2.8 GHz||3.5 GHz||2||Yes||HD 4000||650 MHz||1.2 GHz||22 nm||3 MiB||35||105||G2|
|SR0MW||3360M||2.8 GHz||3.5 GHz||2||Yes||HD 4000||650 MHz||1.2 GHz||22 nm||3 MiB||35||105||BGA1023|
|SR0MX||3320M||2.6 GHz||3.3 GHz||2||Yes||HD 4000||650 MHz||1.2 GHz||22 nm||3 MiB||35||105||G2|
|SR0MY||3320M||2.6 GHz||3.3 GHz||2||Yes||HD 4000||650 MHz||1.2 GHz||22 nm||3 MiB||35||105||BGA1023|
|SR0N8||3317U||1.7 GHz||2.6 GHz||2||Yes||HD 4000||350 MHz||1.05 GHz||22 nm||3 MiB||17||105||BGA1023|
|SR0MZ||3210M||2.5 GHz||3.1 GHz||2||Yes||HD 4000||650 MHz||1.2 GHz||22 nm||3 MiB||35||105||G2|
|NA||3210M||2.5 GHz||3.1 GHz||2||Yes||HD 4000||650 MHz||1.2 GHz||22 nm||3 MiB||35||105||BGA1023|
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.