SHARE

Core i5-2xxx Models (Mobile)

The second-generation Core i5 targeted to laptops, which use the Sandy Bridge microarchitecture, can use two different pinouts, BGA1023 or socket G2, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz with a 1.2 GHz “boost” clock on models with a TDP of 17 W, or 650 MHz with a 1.3 GHz “boost” clock on models with a TDP of 35 W, all with 12 processing cores (HD 3000 graphics engine).

All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SR0CS 2557M 1.7 GHz 2.7 GHz 2 Yes HD 3000 350 MHz 1.2 GHz 32 nm 3 MiB 17 100 BGA1023
SR044 2540M 2.6 GHz 3.3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
SR046 2540M 2.6 GHz 3.3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
SR03W 2537M 1.4 GHz 2.3 GHz 2 Yes HD 3000 350 MHz 1.2 GHz 32 nm 3 MiB 17 100 BGA1023
SR048 2520M 2.5 GHz 3.2 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
NA 2520M 2.5 GHz 3.2 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
SR02U 2510E 2.5 GHz 3.1 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
SR0D6 2467M 1.6 GHz 2.3 GHz 2 Yes HD 3000 350 MHz 1.2 GHz 32 nm 3 MiB 17 100 BGA1023
SR0CH 2450M 2.5 GHz 3.1 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
SR06Z 2450M 2.5 GHz 3.1 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
SR04Z 2450M 2.5 GHz 3.1 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
NA 2435M 2.4 GHz 3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
NA 2435M 2.4 GHz 3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
SR04W 2430M 2.4 GHz 3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
NA 2430M 2.4 GHz 3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
SR04B 2410M 2.3 GHz 2.9 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
SR04G 2410M 2.3 GHz 2.9 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

1
2
3
4
5
6
7
8
9
Gabriel Torres is a Brazilian best-selling ICT expert, with 24 books published. He started his online career in 1996, when he launched Clube do Hardware, which is one of the oldest and largest websites about technology in Brazil. He created Hardware Secrets in 1999 to expand his knowledge outside his home country.