SHARE

Core i3-3xxx Models (Mobile)

As their desktop counterparts, the Core i3-3xxx models targeted to mobile computers are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i3 processors. They can use either the BGA1023 pinout or the socket G2 pinout. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3, DDR3L, and DDR3L-RS memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).

All models have an integrated DirectX 11 video controller with 12 execution units (Intel HD 4000 graphics).

As stated before, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SR12P 3229Y 1.4 GHz 2 Yes HD 4000 350 MHz 850 MHz 22 nm 3 MiB 13 105 BGA1023
SR0XF 3227U 1.9 GHz 2 Yes HD 4000 350 MHz 1.1 GHz 22 nm 3 MiB 17 105 G2
SR0N9 3217U 1.8 GHz 2 Yes HD 4000 350 MHz 1.05 GHz 22 nm 3 MiB 17 105 BGA1023
SR0T4 3110M 2.4 GHz 2 Yes HD 4000 650 MHz 1 GHz  22 nm 3 MiB 35 90 G2
SR0N2 3110M 2.4 GHz 2 Yes HD 4000 650 MHz 1 GHz 22 nm 3 MiB 35 105 BGA1023
SR0N1 3110M 2.4 GHz 2 Yes HD 4000 650 MHz 1 GHz 22 nm 3 MiB 35 90 G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.