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Core i3-23xx Models (Mobile)

The second-generation Core i3 processors targeted to laptops, which use the Sandy Bridge microarchitecture, can use two different pinouts, BGA1023 or socket G2, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). They also have an integrated DirectX 10.1 video controller running at 350 MHz with 1 GHz “boost” clock on models with a TDP of 17 W, or 650 MHz with 1.15 GHz “boost” clock on models with a TDP of 35 W, all with 12 processing cores (HD 3000 graphics engine). These processors support two video monitors.

As mentioned previously, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)*

Package

NA 2377M 1.5 GHz 2 Yes HD 3000 350 MHz 1 GHz 32 nm 3 MiB 17 100 BGA1023
SR0DP 2370M 2.4 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85 G2
SR0CV 2367M 1.4 GHz 2 Yes HD 3000 350 MHz 1 GHz 32 nm 3 MiB 17 100 BGA1023
NA 2357M 1.3 GHz 2 Yes HD 3000 350 MHz 1 GHz 32 nm 3 MiB 17 100

BGA1023

SR0DN 2350M 2.3 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85 G2
SR04L 2330M 2.2 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 100

BGA1023

SR04J 2330M 2.2 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85

G2

SR02V 2330E 2.2 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 100

G2

NA 2328M 2.2 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 100 BGA1023
NA 2328M 2.2 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85 G2
SR09S 2312M 2.1 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85 G2
SR04S 2310M 2.1 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85

G2

SR04R 2310M 2.1 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 100

BGA1023

SR077 2310E 2.1 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 100

BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.