CQFP
By
Gabriel Torres
on June 30, 2005
Ceramic Quad Flat Package
Integrated circuit packaging standard very similar to LCC. Its terminals are soldered directly to the printed circuit board, not requiring a socket like LCC. It is soldered to the printed circuit board with a technique called SMT. The material used is ceramic.
Originally at http://www.hardwaresecrets.com/dictionary/term/49