BGA
By Gabriel Torres on January 13, 2006 Page 1 of 1

Ball Grid Array

BGA is integrated circuit packaging standard based on PGA where the pins are small balls. It is soldered to the printed circuit board thru SMT technology. This kind of packaging is used by motherboard chipsets and some memory chips used by video cards. Is also known as PBGA (Plastic Ball Grid Array).

BGA
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Figure 1: BGA packaging.

BGA
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Figure 2: Example of a chip using BGA packaging (motherboard chipset).

BGA
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Figure 3: Another example of a chip using BGA packaging (video memory).


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