All Mobile Celeron Models | Hardware Secrets

Introduction

Since the launch of Pentium II, each top-shelf Intel CPU series has its value counterpart named Celeron. In this tutorial, you can check the characteristics of every mobile Celeron released to date.

By the way, if you want a list of the desktop Celeron models, check out our All Celeron Models tutorial.

Mobile models, however, are not idhentical to the desktop ones.

Early Mobile Celeron models (based on Pentium II and Pentium III architecture) were very similar to the desktop ones, but with lower voltage, thus consuming less power and dissipating less heat. The following models were based on Pentium M, Core Solo or Core Duo, always features like L2 memory cache, external bus speed and internal clock rate reduced in comparison to their desktop counterparts. The official name of these models is Celeron M. Note there were no desktop Celeron models base on this architecture.

The most recent models are based on Core 2 Duo and Core i3 architectures, some of them with two processing cores, some with only one. There are ultra low voltage models, focusing on low power consuption, and others with higher voltage and clock rates, aimed on laptops with higher performance (but still on the value segment). These models are named Mobile Celeron.

In the next pages you can have an idea of all mobile Celeron models launched to date and their characteristics.

Mobile Celeron (Pentium II and III)

First mobile Celeron models were based on Pentium II and Pentium III processors, operating, however, with a lower voltage, and thus with lower power consuption and heat dissipation.

The main characteristics of first Mobile Celeron models are:

Based on Pentium II and Pentium III with Mendocino (0.25 µm), Coppermine (0.18 µm) or Tualatin (0.13 µm) cores
Manufacturing technology: 0.25 µm (250 nm), 0.18 µm (180 nm) or 0.13 µm (130 nm)
L1 Cache: 32 KB total, 16 KB for instructions and 16 KB for data
L2 Cache: 128 KB on 0.25 µm and 0.18 µm models, 256 KB on 0.13 µm models
External clock: 66 MHz, 100 MHz or 133 MHz
Packaging/socket: PGA2, micro-PGA2, FC-PGA, socket 495, socket 479, socket 478, micro-FCPGA or micro-FCBGA
Support to SSE instructions

In the table below we list all Mobile Celeron models based on Pentium II and Pentium III CPUs that were released.

sSpec	Internal Clock	External Clock	L2 Cache	Voltage (V)	TDP (W)	Technology
SL6HA	1.33 GHz	133 MHz	256 KB	1.5	19	130 µm
SL64K	1.20 GHz	133 MHz	256 KB	1.45	24.4	130 µm
SL63Z	1.20 GHz	133 MHz	256 KB	1.5	24.4	130 µm
SL64L	1.13 GHz	133 MHz	256 KB	1.5	23.8	130 µm
SL642	1.13 GHz	133 MHz	256 KB	1.5	24.4	130 µm
SL64M	1.06 GHz	133 MHz	256 KB	1.5	23.2	130 µm
SL643	1.06 GHz	133 MHz	256 KB	1.45	23.2	130 µm
SL6AB	1.00 GHz	133 MHz	256 KB	1.5	-	130 µm
SL6B3	1.00 GHz	133 MHz	256 KB	1.4	-	130 µm
SL6B4	733 MHz	133 MHz	256 KB	1.15	-	130 µm
SL5SR	933 MHz	133 MHz	128 KB	1.7	24.6	180 µm
SL5SK	933 MHz	133 MHz	128 KB	1.7	20.6	180 µm
SL5SU	933 MHz	133 MHz	128 KB	1.7	24.6	180 µm
SL5T2	866 MHz	133 MHz	128 KB	1.7	23.3	180 µm
SL5Q3	866 MHz	133 MHz	128 KB	1.7	23.3	180 µm
SL5Q2	866 MHz	133 MHz	128 KB	1.7	23.3	180 µm
SL5T3	800 MHz	133 MHz	128 KB	1.7	22	180 µm
SL5SQ	800 MHz	133 MHz	128 KB	1.7	22	180 µm
SL5ST	800 MHz	133 MHz	128 KB	1.7	22	180 µm
SL5SP	733 MHz	133 MHz	128 KB	1.7	20.6	180 µm
SL5SS	733 MHz	133 MHz	128 KB	1.7	20.6	180 µm
SL5PX	900 MHz	100 MHz	128 KB	1.7	24	180 µm
SL5PY	900 MHz	100 MHz	128 KB	1.7	24	180 µm
SL57Y	850 MHz	100 MHz	128 KB	1.6	18.8	180 µm
SL585	850 MHz	100 MHz	128 KB	1.6	18.8	180 µm
SL5CB	800 MHz	100 MHz	128 KB	1.6	17.6	180 µm
SL584	800 MHz	100 MHz	128 KB	1.6	17.6	180 µm
SL57X	800 MHz	100 MHz	128 KB	1.6	17.6	180 µm
SL58K	750 MHz	100 MHz	128 KB	1.6	15.8	180 µm
SL56Q	750 MHz	100 MHz	128 KB	1.6	15.8	180 µm
SL53U	750 MHz	100 MHz	128 KB	1.6	15.8	180 µm
SL53C	750 MHz	100 MHz	128 KB	1.6	15.8	180 µm
SL56P	750 MHz	100 MHz	128 KB	1.6	15.8	180 µm
SL55Q	750 MHz	100 MHz	128 KB	1.6	15.8	180 µm
SL4GU	700 MHz	100 MHz	128 KB	1.6	15	180 µm
SL4GX	700 MHz	100 MHz	128 KB	1.6	15	180 µm
SL4PY	700 MHz	100 MHz	128 KB	-	23	180 µm
SL63F	650 MHz	100 MHz	256 KB	1.1	7	130 µm
SL4PX	650 MHz	100 MHz	128 KB	-	14	180 µm
SL4JG	650 MHz	100 MHz	128 KB	1.6	14	180 µm
SL4AE	650 MHz	100 MHz	128 KB	1.6	14	180 µm
SL4JW	650 MHz	100 MHz	128 KB	1.6	14	180 µm
SL4AD	650 MHz	100 MHz	128 KB	1.6	14	180 µm
SL4JV	600 MHz	100 MHz	128 KB	1.6	13	180 µm
SL4PW	600 MHz	100 MHz	128 KB	1.6	13	180 µm
SL4MU	600 MHz	100 MHz	128 KB	-	13	180 µm
SL5DS	600 MHz	100 MHz	128 KB	1.1	6.4	180 µm
SL4AR	600 MHz	100 MHz	128 KB	1.6	13	180 µm
SL4AP	600 MHz	100 MHz	128 KB	1.6	13	180 µm
SL4JF	600 MHz	100 MHz	128 KB	1.6	13	180 µm
SL582	600 MHz	100 MHz	128 KB	1.35	8.7	180 µm
SL3ZF	550 MHz	100 MHz	128 KB	1.6	18.4	180 µm
SL3ZE	550 MHz	100 MHz	128 KB	1.6	18.4	180 µm
SL4JE	550 MHz	100 MHz	128 KB	1.6	11.9	180 µm
SL4MT	550 MHz	100 MHz	128 KB	1.6	11.9	180 µm
SL4JD	500 MHz	100 MHz	128 KB	1.6	11.2	180 µm
SL4ZR	500 MHz	100 MHz	128 KB	1.1	5	180 µm
SL4PV	500 MHz	100 MHz	128 KB	1.6	11.2	180 µm
SL4JU	500 MHz	100 MHz	128 KB	1.6	11.2	180 µm
SL4JT	500 MHz	100 MHz	128 KB	1.6	11.2	180 µm
SL46Y	500 MHz	100 MHz	128 KB	-	11.2	180 µm
SL43Z	500 MHz	100 MHz	128 KB	1.35	7.9	180 µm
SL45A	500 MHz	100 MHz	128 KB	1.35	7.9	180 µm
SL3PC	500 MHz	100 MHz	128 KB	1.6	16.8	180 µm
SL43Q	500 MHz	100 MHz	128 KB	1.6	16.8	180 µm
SL43R	500 MHz	100 MHz	128 KB	1.6	16.8	180 µm
SL3PE	500 MHz	100 MHz	128 KB	1.6	16.8	180 µm
SL43U	450 MHz	100 MHz	128 KB	1.6	15.5	180 µm
SL43T	450 MHz	100 MHz	128 KB	1.6	15.5	180 µm
SL4JS	450 MHz	100 MHz	128 KB	1.6	15.5	180 µm
SL4PT	450 MHz	100 MHz	128 KB	1.6	15.5	180 µm
SL3PD	450 MHz	100 MHz	128 KB	1.6	15.5	180 µm
SL3PF	450 MHz	100 MHz	128 KB	1.6	15.5	180 µm
SL4JC	450 MHz	100 MHz	128 KB	1.6	15.5	180 µm
SL43W	400 MHz	100 MHz	128 KB	1.35	10.1	180 µm
SL3UL	400 MHz	100 MHz	128 KB	1.35	10.1	180 µm
SL4AB	667 MHz	66 MHz	128 KB	1.65	17.5	180 µm
SL3KD	466 MHz	66 MHz	128 KB	1.9	20.7	250 µm
SL3KC	466 MHz	66 MHz	128 KB	1.9	20.7	250 µm
SL3KB	433 MHz	66 MHz	128 KB	1.9	19.4	250 µm
SL3KA	433 MHz	66 MHz	128 KB	1.9	19.4	250 µm
SL3GQ	400 MHz	66 MHz	128 KB	1.6	13.8	250 µm
SL3GR	400 MHz	66 MHz	128 KB	1.6	13.8	250 µm
SL3C7	366 MHz	66 MHz	128 KB	1.6	13.1	250 µm
SL3HQ	366 MHz	66 MHz	128 KB	1.6	13.1	250 µm
SL3HP	300 MHz	66 MHz	128 KB	1.6	11.8	250 µm
SL3HN	300 MHz	66 MHz	128 KB	1.6	11.1	250 µm
SL3AH	300 MHz	66 MHz	128 KB	1.6	11.1	250 µm
SL3C8	300 MHz	66 MHz	128 KB	1.6	11.8	250 µm
SL3HM	266 MHz	66 MHz	128 KB	1.6	9.8	250 µm
SL3DQ	266 MHz	66 MHz	128 KB	1.5	9.8	250 µm

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

Mobile Celeron (Pentium 4)

Mobile Celeron models based on Pentium 4 have an external bus of 400 MHz (100 MHz transferring four data units by clock cycle, i.e., Quad Data Rate, a.k.a. QDR), 256 KB L2 cache and were manufactured with 0.13 µm (130 nm) technology. For a more detailed explanation on those CPUs microarchitecture, read out Inside Pentium 4 Architecture tutorial.

Their main characteristics are:

Based on Pentium 4 with Northwood core
Manufacturing technology: 0.13 µm
L1 Cache: 12k micro instructions (µops)
L2 Cache: 256 KB
External Clock: 400 MHz (100 MHz QDR)
Socket: 478
Maximum temperature: 100^oC
Support for SSE2 instructions

In the table below we list all Mobile Celeron models based on Pentium 4 processors that were released.

sSpec	Internal Clock	Voltage (V)	TDP (W)
SL75J	2.4 GHz	1.3	35
SL73Y	2.2 GHz	1.3	35
SL6ZW	2.2 GHz	1.3	35
SL6VJ	2.0 GHz	1.3	32
SL6QH	2.0 GHz	1.3	32
SL6VH	1.8 GHz	1.3	30
SL6J4	1.8 GHz	1.3	30
SL6VG	1.7 GHz	1.3	30
SL6J3	1.7 GHz	1.3	30
SL6J2	1.6 GHz	1.3	30
SL6M5	1.5 GHz	1.3	30
SL6FN	1.5 GHz	1.3	30
SL6M4	1.4 GHz	1.3	30
SL6FM	1.4 GHz	1.3	30

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

Celeron M 300 Series

Celeron M 300 series models are based on Pentium M, but with only half L2 cache in comparison with this other CPU. Some models are based on Banias core, manufactured under 0.13 µm (130 nm) technology and with 512 KB L2 cache, while others are based on Dothan core, manufactured under 90 nm technology and with 1 MB or 512 KB L2 cache. All models work with a 400 MHz external bus (100 MHz transferring four data units per clock cycle, i.e., Quad Data Rate or QDR). To learn more about the architecture used by these CPUs, read our Inside Pentium M Architecture tutorial.

Main characteristics of Celeron M 300 series are:

Based on Pentium M with Banias (0.13 µm) or Dothan (90 nm) cores
Manufacturing technology: 0.13 µm (130 nm) or 90 nm
L1 Cache: 32 KB for instructions and 32 KB for data
L2 Cache: 512 KB or 1 MB
External Clock: 400 MHz (100 MHz QDR)
Packaging: micro-FCPGA or micro-FCBGA
Maximum temperature: 100^oC
Support for SSE2 instructions

In the table below we list all Celeron M 300 series models that were released.

sSpec	Model	Internal Clock	L2 Cache	Tech.	Voltage (V)	TDP (W)	Packaging
SL8MH	390	1.7 GHz	1 MB	90 nm	1.004 - 1.292	27	micro-FCBGA
SL8MP	390	1.7 GHz	1 MB	90 nm	1.25 - 1.4	27	micro-FCPGA
SL8MV	390	1.7 GHz	1 MB	90 nm	1.004 - 1.292	27	micro-FCBGA
SL8LV	383	1.0 GHz	1 MB	90 nm	0.876 - 0.956	5.5	micro-FCBGA
SL8MN	380	1.6 GHz	1 MB	90 nm	0.988 - 1.292	21	micro-FCPGA
SL8MG	380	1.6 GHz	1 MB	90 nm	1.004 - 1.292	21	micro-FCBGA
SL89S	373J	1.0 GHz	512 KB	90 nm	0.94	5.5	micro-FCBGA
SL8A4	373J	1.0 GHz	512 KB	90 nm	0.94	5.5	micro-FCBGA
SL8LW	373	1.0 GHz	512 KB	90 nm	-	5.5	micro-FCBGA
SL8LQ	373	1.0 GHz	512 KB	90 nm	0.876 - 0.956	5.5	micro-FCBGA
SL8MF	370	1.5 GHz	1 MB	90 nm	1.004 - 1.292	21	micro-FCBGA
SL8MM	370	1.5 GHz	1 MB	90 nm	0.988 - 1.292	21	micro-FCPGA
SL8MT	370	1.5 GHz	1 MB	90 nm	0.988 - 1.292	21	micro-FCBGA
SL86J	370	1.5 GHz	1 MB	90 nm	1.26	21	micro-FCPGA
SL86P	370	1.5 GHz	1 MB	90 nm	1.26	21	micro-FCBGA
SL86Q	360	1.4 GHz	1 MB	90 nm	1.26	21	micro-FCBGA
SL8ML	360	1.4 GHz	1 MB	90 nm	1.004 - 1.292	21	micro-FCPGA
SL86K	360	1.4 GHz	1 MB	90 nm	1.26	21	micro-FCPGA
SL7LS	360	1.4 GHz	1 MB	90 nm	1.26	21	micro-FCPGA
SL7LR	360	1.4 GHz	1 MB	90 nm	1.26	21	micro-FCBGA
SL7QX	353	900 MHz	512 KB	90 nm	-	5	micro-FCBGA
SL7F7	353	900 MHz	512 KB	90 nm	0.956 - 1.052	5	micro-FCBGA
SL8MK	350	1.3 GHz	1 MB	90 nm	1.3	21	micro-FCPGA
SL7R9	350	1.3 GHz	1 MB	90 nm	1.26	21	micro-FCBGA
SL7RA	350	1.3 GHz	1 MB	90 nm	1.26	21	micro-FCBGA
SL86L	350	1.3 GHz	1 MB	90 nm	1.26	21	micro-FCPGA
SL8MD	350	1.3 GHz	1 MB	90 nm	1.004 - 1.292	21	micro-FCBGA
SL7ME	340	1.5 GHz	512 KB	0.13 µm	0.956 - 1.052	24.5	micro-FCPGA
SL6N7	320	1.3 GHz	512 KB	0.13 µm	1.324	24.5	micro-FCPGA
SL8FM	320	1.3 GHz	512 KB	0.13 µm	-	24.5	micro-FCBGA
SL6NM	320	1.3 GHz	512 KB	0.13 µm	1.324	24.5	micro-FCBGA
SL79T	310	1.2 GHz	512 KB	0.13 µm	1.324	24.5	micro-FCBGA
SL79S	310	1.2 GHz	512 KB	0.13 µm	1.356	24.5	micro-FCPGA

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

Celeron M 400 Series

Celeron M 400 series processors are based on Core Solo (Yonah core), but with half L2 cache (compared to Core Solo) and no Enhanced Speedstep technology. It is a CPU based on Pentium M microarchitecture manufactured under 65 nm technology, with 1 MB L2 cache and 533 MHz external bus (133 MHz transferring four data units per clock cycle, i.e., Quad Data Rate or QDR).

Celeron M 400 series main characteristics are:

Based on Core Solo with Yonah core
Manufacturing technology: 65 nm
L1 Cache: 32 KB for instructions and 32 KB for data
L2 Cache: 1 MB
External clock: 533 MHz (133 MHz QDR)
Packaging: micro-FCPGA or micro-FCBGA
Maximum temperature: 100^oC
Support for SSE3 instructions

In the table below we list all Celeron M 400 series models that were released.

sSpec	Model	Internal Clock	Voltage (V)	TDP (W)	Packaging
SL9KX	450	2.0 GHz	1.0 - 1.3	27	micro-FCPGA
SL9L8	443	1.2 GHz	0.95 - 0.975	5.5	micro-FCBGA
SL9KW	440	1.86 GHz	1.0 - 1.3	27	micro-FCPGA
SL9KV	430	1.73 GHz	1.0 - 1.3	27	micro-FCPGA
SL92F	430	1.73 GHz	1.0 - 1.3	27	micro-FCPGA
SL8XW	423	1.06 GHz	0.85 - 1.1	5.5	micro-FCBGA
SL8VZ	420	1.6 GHz	1.0 - 1.3	27	micro-FCPGA
SL8W2	410	1.46 GHz	1.0 - 1.3	27	micro-FCPGA

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

Mobile Celeron 500 Series

Mobile Celeron 500 series units are based on Core 2 Duo (Core architecture), but with only one processing core (Meron core), being manufactured under 65 nm technology, having 1 MB L2 cache and external clock rate of 533 MHz or 667 MHz (133 MHz or 166 MHz transferring four data units per clock cycle, respectively). If you want to learn more about the architecture used by these processors, check out our Inside Intel Core Microarchitecture tutorial.

Mobile Celeron 500 series main characteristics are:

Base on Core 2 Duo
Merom core
Only one processing core
Manufacturing technology: 65 nm
L1 Cache: 32 KB for instructions and 32 KB for data
L2 Cache: 1 MB
External clock: 533 MHz (133 MHz QDR) or 667 MHz (166 MHz QDR)
Packaging: micro-FCPGA
Maximum temperature: 100^oC
Support for SSE3 instructions

In the table below we list all Mobile Celeron 500 series models that were released.

sSpec	Model	Internal Clock	External Clock	Voltage (V)	TDP (W)
SLB6L	585	2.16 GHz	667 MHz	1.075 - 1.175	31
SLB6M	575	2.0 GHz	667 MHz	1.075 - 1.175	31
SLA2D	560	2.13 GHz	533 MHz	1.1 - 1.25	31
SLA2E	550	2.0 GHz	533 MHz	1.1 - 1.25	27
SLA2F	540	1.86 GHz	533 MHz	1.1 - 1.25	27 - 31
SL9VA	530	1.73 GHz	533 MHz	1.125 - 1.255	26
SLA2G	530	1.73 GHz	533 MHz	1.1 - 1.25	27
SLAHP	523	930 MHz	533 MHz	0.85 - 1.1	5.5
SL9WT	520	1.6 GHz	533 MHz	0.95 - 1.3	30
SL9WN	520	1.6 GHz	533 MHz	1.1 - 1.25	26

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

Mobile Celeron 700 Series

Mobile Celeron 700 series models are based on 45-nm Core 2 Duo (Core architecture), but with only one processing core. They are aimed to netbooks and low-power laptops, and have 1 MB L2 cache and external clock rate of 800 MHz (200 MHz transferring four data units per clock cycle). If you want to learn more about the architecture used by these processors, check out our Penryn Core New Features tutorial.

Mobile Celeron 700 series main characteristics are:

Base on Core 2 Duo
Penryn core
Only one processing core
Manufacturing technology: 45 nm
L1 Cache: 32 KB for instructions and 32 KB for data
L2 Cache: 1 MB
External clock: 800 MHz (200 MHz QDR)
Packaging: micro-FCBGA
Maximum temperature: 100^oC
Support for SSE4.1 instructions

In the table below we list the only Mobile Celeron 700 series model launched so far.

sSpec	Model	Internal Clock	Voltage (V)	TDP (W)
SLGEV	743	1.3 GHz	-	10
SLGAM	723	1.2 GHz	1.05 - 1.15	10
SLGAS	723	1.2 GHz	1.05 - 1.15	10
SLGAN	722	1.2 GHz	0.775 - 1.1	5.5
SLGAT	722	1.2 GHz	0.775 - 1.1	5.5

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

Mobile Celeron 900 Series

Mobile Celeron 900 series processors are based on 45-nm Core 2 Duo (Core architecture), but with only one processing core. They have 1 MB L2 cache and external clock rate of 800 MHz (200 MHz transferring four data units per clock cycle). If you want to learn more about those processors architecture, check out our Penryn Core New Features tutorial.

Mobile Celeron series 900 main characteristics are:

Base on Core 2 Duo
Penryn core
Only one processing core
Manufacturing technology: 45 nm
L1 Cache: 32 KB for instructions and 32 KB for data
L2 Cache: 1 MB
External clock: 800 MHz (200 MHz QDR)
Packaging: micro-FCPGA
Maximum temperature: 105^oC
Support for SSE4.1 instructions

In the table below we list the only Mobile Celeron 900 series model launched so far.

sSpec	Model	Internal Clock	Voltage (V)	TDP (W)
SLGLQ	900	2.2 GHz	1.0 - 1.25	35

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

Mobile Celeron T1000 Series

Mobile Celeron T1000 series units are based on 65-nm Core 2 Duo, with two processing cores. If you want to learn more about the architecture used by these processors, check out our Inside Intel Core Microarchitecture tutorial.

Mobile Celeron T1000 series main characteristics are:

Base on Core 2 Duo
Meron core
Two processing cores
Manufacturing technology: 65 nm
L1 Cache: 32 KB for instructions and 32 KB for data
L2 Cache: 512 KB or 1 MB
External clock: 533 MHz (133 MHz QDR) ou 667 MHz (166 MHz QDR)
Packaging: micro-FCPGA
Maximum temperature: 100^oC
Support for SSE3 instructions

In the table below we list all Mobile Celeron series T1000 models released to date.

sSpec	Model	Internal Clock	External clock	L2 Cache	Voltage (V)	TDP (W)
SLB6H	T1700	1.83 GHz	667 MHz	1 MB	1.075 - 1.175	35
SLB6J	T1600	1.66 GHz	667 MHz	1 MB	1.075 - 1.175	35
SLAQK	T1500	1.86 GHz	533 MHz	512 KB	1.075 - 1.175	35
SLAQL	T1400	1.73 GHz	533 MHz	512 KB	1.075 - 1.175	35

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

Mobile Celeron T3000 Series

Mobile Celeron T3000 series models are based on 45-nm Core 2 Duo (Core architecture) with two processing cores. They have 1 MB L2 cache and external clock rate of 800 MHz (200 MHz transferring four data units per clock cycle). If you want to learn more about the architecture used by these processors check out our Penryn Core New Features tutorial.

Mobile Celeron T3000 series main characteristics are:

Base on Core 2 Duo
Penryn core
Two processing cores
Manufacturing technology: 45 nm
L1 Cache: 32 KB for instructions and 32 KB for data
L2 Cache: 1 MB
External clock: 800 MHz (200 MHz QDR)
Packaging: micro-FCPGA or micro-FCBGA
Maximum temperature: 105^oC
Support for SSE4.1 instructions

In the table below we list all Mobile Celeron T3000 series models released to date.

sSpec	Model	Internal Clock	Voltage (V)	TDP (W)	Packaging
SLG92	T3300	2.0 GHz	-	35	micro-FCPGA
SLGJW	T3300	2.0 GHz	-	35	micro-FCPGA
SLGEY	T3100	1.9 GHz	1.0 - 1.25	35	micro-FCPGA
SLGVS	T3100	1.9 GHz	1.0 - 1.25	35	micro-FCBGA
SLGMY	T3000	1.8 GHz	1.0 - 1.25	35	micro-FCBGA

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

Mobile Celeron SU2000 Series

Mobile Celeron SU2000 series are low-TDP processors based on 45-nm Core 2 Duo with two processing cores. They have 1 MB L2 cache and external clock rate of 800 MHz (200 MHz transferring four data units per clock cycle). If you want to learn more about the architecture used by these processors, check out our Penryn Core New Features tutorial.

Mobile Celeron SU2000 series main characteristics are:

Based on Core 2 Duo
Penryn core
Two processing cores
Manufacturing technology: 45 nm
L1 Cache: 32 KB for instructions and 32 KB for data
L2 Cache: 1 MB
External clock: 800 MHz (200 MHz QDR)
Packaging: micro-FCBGA
Maximum temperature: 100^oC
Support for SSE4.1 instructions

In the table below we list all Mobile Celeron SU2000 series models released to date.

sSpec	Model	Internal Clock	Voltage (V)	TDP (W)
SLGYW	SU2300	1.2 GHz	1.05 - 1.15	10
SLGSB	SU2300	1.2 GHz	1.05 - 1.15	10

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

Mobile Celeron U3000 Series

The Mobile Celeron U3000 series is based on the 32 nm Core i3, with two processing cores, but without support to Turbo Boost and Hyper-Threading thechnologies. It has a 2 MB L3 cache and DMI bus at 2 GB/s, besides integrated memory and video controllers. For more information about this architecture, read our Inside Intel Nehalem Microarchitecture tutorial.

The main characteristics of the Mobile Celeron U3000 series are:

Based on Core i3
Arrandale core
Two processing cores
Manufacturing technology: 32 nm
L1 Cache: 32 KB for instructions and 32 KB for data
L2 Cache: 256 KB per core
L3 Cache: 2 MB
DMI bus (2 GB/s)
Integrated PCI Express 2.0 controller (one x16 lane)
Integrated memory controller supporting up to 8 GB in dual-channel architecture
Support for DDR3 memories up to 800 MHz
Integrated Graphics Adapter, running at 500 MHz
Socket: BGA1288
Maximum temperature: 105 ^oC
SSE4.1 and SSE4.2 instruction sets

In the table below we list the Mobile Celeron U3000 series model released to date. TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

sSpec	Model	Internal Clock	Voltage (V)	TDP (W)
SLBUE	U3400	1.06 GHz	-	18

Mobile Celeron P4000 Series

The Mobile Celeron P4000 series is based on the 32 nm Core i3, with two processing cores, but without support to Turbo Boost and Hyper-Threading thechnologies. It has a 2 MB L3 cache and DMI bus at 2 GB/s, besides integrated memory and video controllers. For more information about this architecture, read our Inside Intel Nehalem Microarchitecture tutorial.

The main characteristics of the Mobile Celeron P4000 series are:

Based on Core i3
Arrandale core
Two processing cores
Manufacturing technology: 32 nm
L1 Cache: 32 KB for instructions and 32 KB for data
L2 Cache: 256 KB per core
L3 Cache: 2 MB
DMI bus (2 GB/s)
Integrated PCI Express 2.0 controller (one x16 or two x8 lanes)
Integrated memory controller supporting up to 8 GB in dual-channel architecture
Support for DDR3 memories up to 1066 MHz
Integrated Graphics Adapter, running at 667 MHz
Socket: BPA988 or BGA1288
Maximum temperature: 90 ^oC
SSE4.1 and SSE4.2 instruction sets

In the table below we list the Mobile Celeron P4000 series models released to date. TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

sSpec	Model	Internal Clock	Voltage (V)	TDP (W)	Package
SLBQB	P4505	1.86 GHz	-	35	1288
SLBNL	P4500	1.86 GHz	-	35	988

Originally at http://www.hardwaresecrets.com/article/All-Mobile-Celeron-Models/947

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