Introduction

The Core i7 is a CPU series manufactured by Intel aimed at high-range computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.

By the way, the correct name of this line of processors is “Core i7,” not “Intel i7.”

Currently, there are three different generations of Core i7 processors available. In the tables below, we describe the main differences between these generations and the model series within each generation.

Model	8xx	9xx	6xx	7xx	8xx and 9xx
Market	Desktop	Desktop	Mobile	Mobile	Mobile
Generation	First	First	First	First	First
Microarchitecture	Nehalem	Nehalem	Nehalem	Nehalem	Nehalem
Manufacturing Process	45 nm	45 nm or 32 nm	32 nm	45 nm	45 nm
Number of Cores	4	4 or 6	2	4	4
Hyper-Threading	Yes	Yes	Yes	Yes	Yes
L1 cache (per core)	32 kB+32 kB	32 kB+32 kB	32 kB+32kB	32 kB+32 kB	32 kB+32 kB
L2 cache (per core)	256 kB	256 kB	256 kB	256 kB	256 kB
L3 cache (total)	8 MB	8 MB or 12 MB	4 MB	6 MB	8 MB
DMI bus	1 GB/s	No	1 GB/s	1 GB/s	1 GB/s
Memory (DDR3)	1066, 1333	1066	800, 1066†	1066, 1333	1066, 1333
Memory Channels	2	3	2	2	2
DDR3L and DDR3L-RS	No	No	No	No	No
Graphics Engine	No	No	HD Graphics	No	No
DirectX	No	No	10	No	No
Graphics Processors	No	No	6	No	No
Graphics Base Clock	No	No	166, 266 or 500 MHz	No	No
Graphics Boost Clock	No	No	500, 566 or 766 MHz	No	No
Displays Supported	None	None	2	None	None
PCIe Controller	2.0	No	2.0	2.0	2.0
PCIe Configuration	1x16, 2x8	NA	1x16	1x16	1x16
Turbo Boost	1.0	1.0	1.0	1.0	1.0
EM64T	Yes	Yes	Yes	Yes	Yes
Virtualization	Yes	Yes	Yes	Yes	Yes
SSE4.2	Yes	Yes	Yes	Yes	Yes
AES-NIS	No	On 32 nm models	Yes	No	No
AVX	No	No	No	No	No
Base Clock	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz
Pinout	LGA1156	LGA1366	G1 or BGA1288	G1	G1

† Except for “UM” and “UE” models, which only support DDR3-800 memory.

Model	2xxx	38xx	39xx	2xxx
Market	Desktop	Desktop	Desktop	Mobile
Generation	Second	Second	Second	Second
Microarchitecture	Sandy Bridge	Sandy Bridge	Sandy Bridge	Sandy Bridge
Manufacturing Process	32 nm	32 nm	32 nm	32 nm
Number of Cores	4	4	6	2 or 4
Hyper-Threading	Yes	Yes	Yes	Yes
L1 cache (per core)	32 kB+32 kB	32 kB+32 kB	32 kB+32 kB	32 kB+32kB
L2 cache (per core)	256 kB	256 kB	256 kB	256 kB
L3 cache (total)	8 MB	10 MB	12 MB or 15 MB	4 MB, 6 MB or 8 MB
DMI bus	2 GB/s	2 GB/2	2 GB/s	2 GB/s
Memory (DDR3)	1066, 1333	1066, 1333, 1600	1066, 1333, 1600	1066, 1333, 1600
Memory Channels	2	4	4	2
DDR3L and DDR3L-RS	No	No	No	No
Graphics Engine	HD 2000 or HD 3000	No	No	HD 3000
DirectX	10.1	No	No	10.1
Graphics Processors	6 or 12	No	No	12
Graphics Base Clock	850 MHz	No	No	350, 500 or 650 MHz
Graphics Boost Clock	1.35 GHz	No	No	950 MHz, 1 GHz, 1.1 GHz, 1.2 GHz or 1.3 GHz
Displays Supported	2	No	None	2
PCIe Controller	2.0	3.0	3.0	2.0
PCIe Configuration	1x16, 2x8	40 lanes‡	40 lanes‡	1x16, 2x8, 1x8, 2x4
Turbo Boost	2.0	2.0	2.0	2.0
EM64T	Yes	Yes	Yes	Yes
Virtualization	Yes	Yes	Yes	Yes
SSE4.2	Yes	Yes	Yes	Yes
AES-NIS	Yes	Yes	Yes	Yes
AVX	Yes	Yes	Yes	Yes
Base Clock	100 MHz	100 MHz	100 MHz	100 MHz
Pinout	LGA1155	LGA2011	LGA2011	G2, BGA1023 or BGA1224

‡ There are three ports, two of them supporting 1x16, 2x8, 4x4, 8x2, and 16x1 speeds, and one of them supporting 1x8, 4x2, and 8x1 speeds. The “best” configuration allowed is x16/x16/x8, however other configurations are supported, such as x8/x8/x8/x8/x8.

Model	37xx	3xxx
Market	Desktop	Mobile
Generation	Third	Third
Microarchitecture	Ivy Bridge	Ivy Bridge
Manufacturing Process	22 nm	22 nm
Number of Cores	4	2 or 4
Hyper-Threading	Yes	Yes
L1 cache (per core)	32 kB+32kB	32 kB+32 kB
L2 cache (per core)	256 kB	256 kB
L3 cache (total)	8 MB	4 MB, 6 MB or 8 MB
DMI bus	2 GB/s	2 GB/s
Memory (DDR3)	1333, 1600	1333, 1600
Memory Channels	2	2
DDR3L and DDR3L-RS	No	Yes
Graphics Engine	HD 4000	HD 4000
DirectX	11	11
Graphics Processors	12	12
Graphics Base Clock	650 MHz	350 MHz or 650 MHz
Graphics Boost Clock	1.15 GHz	1.1, 1.2, 1.25, 1.3 or 1.35 GHz
Displays Supported	3	3
PCIe Controller	3.0	3.0*
PCIe Configuration	1x16, 2x8, 1x8, 2x4	1x16, 2x8, 1x8, 2x4
Turbo Boost	2.0	2.0
EM64T	Yes	Yes
Virtualization	Yes	Yes
SSE4.2	Yes	Yes
AES-NIS	Yes	Yes
AVX	Yes	Yes
Base Clock	100 MHz	100 MHz
Pinout	LGA1155	G2, BGA1023 or BGA1224

* Except for “U” models, which have a PCI Express 2.0 controller.

Let’s now take a detailed look at all Core i7 models launched so far.

First-Generation Core i7 Desktop Models

In the table below, we listed all Core i7-8xx and Core i7-9xx CPU models. These are desktop models based on the Nehalem microarchitecture. They are also called first-generation Core i7 processors.

The 8xx models are based on socket LGA1156 and support 1,066 MHz and 1,333 MHz DDR3 memories under dual-channel architecture. These models have an integrated PCI Express 2.0 controller supporting one x16 datapath or two x8 datapaths. On these CPUs, communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s by Intel).

The 9xx models are based on socket LGA1366 and support 1,066 MHz memories under triple-channel architecture. These models don’t have an integrated PCI Express controller and they talk to the motherboard chipset using a QPI bus working at 2.4 GHz (4.8 GB/s) on the “regular” models or at 3.2 GHz (6.4 GB/s) on the “Extreme” models, which are listed in a separate table below.

The first-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.

sSpec	Model	Clock	Turbo Boost	Cores	HT	Video	L3 Cache	Tech.	TDP (W)	Max. Temp. (oC)*	Socket
SLBYU	980	3.33 GHz	3.60 GHz	6	Yes	No	12 MB	32 nm	130	68.8	LGA1366
SLBVF	970	3.20 GHz	3.46 GHz	6	Yes	No	12 MB	32 nm	130	67.9	LGA1366
SLBEU	960	3.20 GHz	3.46 GHz	4	Yes	No	8 MB	45 nm	130	67.9	LGA1366
SLBEN	950	3.06 GHz	3.32 GHz	4	Yes	No	8 MB	45 nm	130	67.9	LGA1366
SLBCK	940	2.93 GHz	3.20 GHz	4	Yes	No	8 MB	45 nm	130	67.9	LGA1366
SLBKP	930	2.80 GHz	3.06 GHz	4	Yes	No	8 MB	45 nm	130	67.9	LGA1366
SLBEJ	920	2.66 GHz	2.93 GHz	4	Yes	No	8 MB	45 nm	130	67.9	LGA1366
SLBCH	920	2.66 GHz	2.93 GHz	4	Yes	No	8 MB	45 nm	130	67.9	LGA1366
SLBPS	880	3.06 GHz	3.74 GHz	4	Yes	No	8 MB	45 nm	95	72.7	LGA1156
SLBS2	875K	2.93 GHz	3.60 GHz	4	Yes	No	8 MB	45 nm	95	72.7	LGA1156
SLBQ7	870S	2.66 GHz	3.60 GHz	4	Yes	No	8 MB	45 nm	82	NA	LGA1156
SLBJG	870	2.93 GHz	3.60 GHz	4	Yes	No	8 MB	45 nm	95	72.7	LGA1156
SLBLG	860s	2.53 GHz	3.46 GHz	4	Yes	No	8 MB	45 nm	82	76.7	LGA1156
SLBJJ	860	2.80 GHz	3.46 GHz	4	Yes	No	8 MB	45 nm	95	72.7	LGA1156

In the table below, you will find all first-generation Core i7 Extreme models for desktops. These models have the QPI bus running at a higher clock rate (3.2 GHz, 6.4 GB/s) and come with their clock multiplier and Turbo Boost options unlocked, providing additional overclocking options.

sSpec	Model	Internal Clock	Turbo Boost	Cores	HT	Video	L3 Cache	Tech.	TDP (W)	Max. Temp. (oC)*	Socket
SLBVZ	990X	3.46 GHz	3.73 GHz	6	Yes	No	12 MB	32 nm	130	67.9	LGA1366
SLBUZ	980X	3.33 GHz	3.60 GHz	6	Yes	No	12 MB	32 nm	130	67.9	LGA1366
SLBEQ	975	3.33 GHz	3.60 GHz	4	Yes	No	8 MB	45 nm	130	67.9	LGA1366
SLBCJ	965	3.20 GHz	3.46 GHz	4	Yes	No	8 MB	45 nm	130	67.9	LGA1366

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

First-Generation Core i7 Mobile Models

The first-generation Core i7 processors targeted to laptops are based on the Nehalem microarchitecture. They can use two different pinouts, G1 or BGA1288, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories on models 6xx (except for models “UM” and “UE,” which only support DDR3-800 memories), and 1,066 MHz and 1,333 MHz DDR3 memories on models 7xx, 8xx, and 9xx. They have an integrated PCI Express 2.0 controller, supporting one x16 connection. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The 6xx models have an integrated DirectX 10 video controller running at 166 MHz with a 500 MHz “boost” clock on “UM” and “UE” models, 266 MHz with a 566 MHz “boost” clock on “LM” models, or 500 MHz with a 766 MHz “boost” clock on “M” and “E” models. This video controller uses an engine called “Intel HD Graphics,” and models with integrated video support two video monitors.

First-generation Core i7 mobile CPUs can have two (6xx models) or four (all other models) processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (oC)*

Pinout

SLBMP

840QM

1.86 MHz

3.20 GHz

4

Yes

No

No

No

8 MB

45 nm

45

100

G1

SLBLX

820QM

1.73 GHz

3.06 GHz

4

Yes

No

No

No

8 MB

45 nm

45

100

G1

SLBQG

740QM

1.73 GHz

2.93 GHz

4

Yes

No

No

No

6 MB

45 nm

45

100

G1

SLBLY

720QM

1.60 GHz

3.28 GHz

4

Yes

No

No

No

6 MB

45 nm

45

100

G1

SLBST

680UM

1.46 GHz

2.53 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

4 MB

32 nm

18

105

BGA1288

SLBSS

660UM

1.33 GHz

2.40 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

4 MB

32 nm

18

105

BGA1288

SLBWV

660UE

1.33 GHz

2.40 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

4 MB

32 nm

18

105

BGA1288

SLBMM

640UM

1.20 GHz

2.26 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

4 MB

32 nm

18

105

BGA1288

SLBMK

640LM

2.13 GHz

2.93 GHz

2

Yes

HD Graphics

266 MHz

566 MHz

4 MB

32 nm

25

105

BGA1288

SLBTN

640M

2.80 GHz

3.46 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MB

32 nm

35

105

G1

SLBZU

640M

2.80 GHz

3.46 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MB

32 nm

35

105

BGA1288

SLBMN

620UM

1.06 GHz

2.13 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

4 MB

32 nm

18

105

BGA1288

SLBTQ

620M

2.66 GHz

3.33 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MB

32 nm

35

105

G1

SLBPE

620M

2.66 GHz

3.33 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MB

32 nm

35

105

BGA1288

SLBPD

620M

2.66 GHz

3.33 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MB

32 nm

35

105

G1

SLBSU

620LM

2.00 GHz

2.80 GHz

2

Yes

HD Graphics

266 MHz

566 MHz

4 MB

32 nm

25

105

BGA1288

SLBML

620LM

2.00 GHz

2.80 GHz

2

Yes

HD Graphics

266 MHz

566 MHz

4 MB

32 nm

25

105

BGA1288

SLBXX

610E

2.53 GHz

3.20 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MB

32 nm

35

105

BGA1288

In the table below, you will find all first-generation mobile Core i7 Extreme models. They come with their cock multipliers and Turbo Boost options unlocked, adding more overclocking options for the enthusiast. 

sSpec	Model	Clock	Turbo Boost	Cores	HT	Video	L3 Cache	Tech.	TDP (W)	Max. Temp. (oC)*	Pinout
SLBSC	940XM	2.13 GHz	3.33 GHz	4	Yes	No	8 MB	45 nm	55	100	G1
SLBLW	920XM	2.00 GHz	3.20 GHz	4	Yes	No	8 MB	45 nm	55	100	G1

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Second-Generation Core i7 Desktop Models

In the table below, we listed all second-generation Core i7 desktop processors, which are based on the Sandy Bridge microarchitecture.

The 3xxx models are based on socket LGA2011 and have an integrated memory controller supporting four channels as well as 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller with 40 lanes, available through two x16 ports and one x8 port. This way, the CPU can be directly connected to two PCI Express 3.0 x16 slots and one PCI Express 3.0 x8 slot. Each port can be “broken down,” so the CPU also has direct support for five PCI Express 3.0 x8 slots, for example. These models don’t have integrated video. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).

The 2xxx models are based on socket LGA1155 and have a dual-channel memory controller supporting 1,066 MHz and 1,333 MHz DDR3 memories. They have an integrated PCI Express 2.0 controller supporting one x16 connection or two x8 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 10.1 video controller running at 850 MHz with a 1.35 GHz “boost” clock, with six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.

The second-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (oC)*

Socket

SR0KF

3960X

3.3 GHz

3.9 GHz

6

Yes

No

No

No

15 MB

32 nm

130

66.8

LGA2011

SR0GW

3960X

3.3 GHz

3.9 GHz

6

Yes

No

No

No

15 MB

32 nm

130

66.8

LGA2011

SR0KY

3930K

3.2 GHz

3.8 GHz

6

Yes

No

No

No

12 MB

32 nm

130

66.8

LGA2011

SR0H9

3930K

3.2 GHz

3.8 GHz

6

Yes

No

No

No

12 MB

32 nm

130

66.8

LGA2011

SR0LD

3820

3.6 GHz

3.8 GHz

4

Yes

No

No

No

10 MB

32 nm

130

66.8

LGA2011

SR0DG

2700K

3.5 GHz

3.9 GHz

4

Yes

HD 3000

850 MHz

1.35 GHz

8 MB

32 nm

95

72.6

LGA1155

SR00E

2600S

2.80 GHz

3.80 GHz

4

Yes

HD 2000

850 MHz

1.35 GHz

8 MB

32 nm

65

69.1

LGA1155

SR00C

2600K

3.40 GHz

3.80 GHz

4

Yes

HD 3000

850 MHz

1.35 GHz

8 MB

32 nm

95

72.6

LGA1155

SR00B

2600

3.40 GHz

3.80 GHz

4

Yes

HD 2000

850 MHz

1.35 GHz

8 MB

32 nm

95

72.6

LGA1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

Second-Generation Core i7 Mobile Models

The second-generation Core i7 processors targeted to laptops are based on the Sandy Bridge microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2. These processors have an integrated dual-channel DDR3 memory controller, supporting 1,066 MHz, 1,333 MHz and, on 27xx, 28xx, and 29xx models, 1,600 MHz memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz, 500 MHz or 650 MHz (see table below for specific clock rates), with 12 processing cores (HD 3000 graphics engine).

Second-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (oC)*

Pinout

SR02X

2860QM

2.5 GHz

3.6 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MB

32 nm

45

100

G2

SR02Q

2860QM

2.5 GHz

3.6 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MB

32 nm

45

100

BGA1224

SR00U

2820QM

2.3 GHz

3.40 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MB

32 nm

45

100

BGA1224

SR012

2820QM

2.3 GHz

3.4 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MB

32 nm

45

100

G2

SR02W

2760QM

2.4 GHz

3.5 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

6 MB

32 nm

45

100

G2

SR02R

2760QM

2.4 GHz

3.5 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

6 MB

32 nm

45

100

BGA1224

SR00W

2720QM

2.2 GHz

3.3 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

6 MB

32 nm

45

100

BGA1224

SR014

2720QM

2.2 GHz

3.3 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

6 MB

32 nm

45

100

G2

SR02T

2710QE

2.1 GHz

3.0 GHz

4

Yes

HD 3000

650 MHz

1.2 GHz

6 MB

32 nm

45

100

G2

SR0D2

2677M

1.8 GHz

2.9 GHz

2

Yes

HD 3000

350 MHz

1.2 GHz

4 MB

32 nm

17

100

BGA1023

SR02S

2675QM

2.2 GHz

3.1 GHz

4

Yes

HD 3000

650 MHz

1.2 GHz

6 MB

32 nm

45

100

BGA1224

SR02N

2670QM

2.2 GHz

3.1 GHz

4

Yes

HD 3000

650 MHz

1.1 GHz

6 MB

32 nm

45

100

G2

SR03S

2657M

2.6 GHz

2.7 GHz

2

Yes

HD 3000

350 MHz

1 GHz

6 MB

32 nm

17

100

BGA1023

SR04N

2649M

2.3 GHz

3.2 GHz

2

Yes

HD 3000

500 MHz

1.1 GHz

4 MB

32 nm

25

100

BGA1023

SR043

2640M

2.8 GHz

3.5 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

4 MB

32 nm

35

100

BGA1023

SR03R

2640M

2.8 GHz

3.5 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

4 MB

32 nm

35

100

G2

SR0D3

2637M

1.7 GHz

2.8 GHz

2

Yes

HD 3000

350 MHz

1.2 GHz

4 MB

32 nm

17

100

BGA1023

SR030

2635QM

2.0 GHz

2.9 GHz

4

Yes

HD 3000

650 MHz

1.2 GHz

6 MB

32 nm

45

100

BGA1224

SR02Y

2630QM

2.0 GHz

2.9 GHz

4

Yes

HD 3000

650 MHz

1.1 GHz

6 MB

32 nm

45

100

G2

SR04D

2629M

2.1 GHz

3.0 GHz

2

Yes

HD 3000

500 MHz

1.1 GHz

4 MB

32 nm

25

100

BGA1023

SR03F

2620M

2.7 GHz

3.4 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

4 MB

32 nm

35

100

G2

SR041

2620M

2.7 GHz

3.4 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

4 MB

32 nm

35

100

BGA1023

SR03T

2617M

1.5 GHz

2.6 GHz

2

Yes

HD 3000

350 MHz

950 MHz

4 MB

32 nm

17

100

BGA1023

In the table below, you will find the only second-generation mobile Core i7 Extreme processor model released so far. It comes with its clock multiplier and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (oC)*

Pinout

SR02F

2960XM

2.70 GHz

3.70 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MB

32 nm

55

100

G2

SR02E

2920XM

2.50 GHz

3.50 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MB

32 nm

55

100

G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Third-Generation Core i7 Desktop Models

In the table below, we listed all third-generation Core i7 desktop processors, which are based on the Ivy Bridge microarchitecture. The models released so far are based on socket LGA1155 and have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 11 video controller running at 650 MHz with a 1.15 GHz “boost” clock, with 12 (HD 4000) processing cores. All models support three displays (previous generations support two).

The third-generation Core i7 desktop models are quad-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight cores. However, only half the cores are “real;” the other half is simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (oC)*

Socket

SR0PL

3770K

3.5 GHz

3.9 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

8 MB

22 nm

77

67.4

LGA1155

SR0PK

3770

3.4 GHz

3.9 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

8 MB

22 nm

77

67.4

LGA1155

SR0PN

3770S

3.1 GHz

3.9 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

8 MB

22 nm

65

69.1

LGA1155

SR0PQ

3770T

2.5 GHz

3.7 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

8 MB

22 nm

45

69.8

LGA1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

Third-Generation Core i7 Mobile Models

The third-generation Core i7 processors targeted to laptops are based on the Ivy Bridge microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2. These processors have an integrated dual-channel DDR3 memory controller, supporting 1,333 MHz and 1,600 MHz memories. They also have an integrated PCI Express 3.0 controller (in the “U” models, this controller is 2.0) supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 11 video controller running at 650 MHz (350 MHz on “U” models), with a “boost” clock that depends on the model (see table below for specific clock rates), all with 12 processing cores (HD 4000 graphics engine).

Third-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (oC)*

Pinout

NA

3840QM

2.8 GHz

3.8 GHz

4

Yes

HD 4000

650 MHz

1.3 GHz

8 MB

22 nm

45

105

G2

NA

3840QM

2.8 GHz

3.8 GHz

4

Yes

HD 4000

650 MHz

1.3 GHz

8 MB

22 nm

45

105

BGA1224

SR0MK

3820QM

2.7 GHz

3.7 GHz

4

Yes

HD 4000

650 MHz

1.25 GHz

8 MB

22 nm

45

105

BGA1224

SR0MJ

3820QM

2.7 GHz

3.7 GHz

4

Yes

HD 4000

650 MHz

1.25 GHz

8 MB

22 nm

45

105

G2

SR0UV

3740QM

2.7 GHz

3.7 GHz

4

Yes

HD 4000

650 MHz

1.3 GHz

6 MB

22 nm

45

105

G2

SR0MM

3720QM

2.6 GHz

3.6 GHz

4

Yes

HD 4000

650 MHz

1.25 GHz

6 MB

22 nm

45

105

BGA1224

SR0ML

3720QM

2.6 GHz

3.6 GHz

4

Yes

HD 4000

650 MHz

1.25 GHz

6 MB

22 nm

45

105

G2

SR0N5

3667U

2.0 GHz

3.2 GHz

2

Yes

HD 4000

350 MHz

1.15 GHz

4 MB

22 nm

17

105

BGA1023

NA

3635QM

2.4 GHz

3.4 GHz

4

Yes

HD 4000

650 MHz

1.2 GHz

6 MB

22 nm

45

105

BGA1224

NA

3630QM

2.4 GHz

3.4 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

6 MB

22 nm

45

105

G2

SR0MP

3615QM

2.3 GHz

3.3 GHz

4

Yes

HD 4000

650 MHz

1.2 GHz

6 MB

22 nm

45

105

BGA1224

SR0MQ

3612QM

2.1 GHz

3.1 GHz

4

Yes

HD 4000

650 MHz

1.1 GHz

6 MB

22 nm

45

105

G2

SR0MR

3612QM

2.1 GHz

3.1 GHz

4

Yes

HD 4000

650 MHz

1.1 GHz

6 MB

22 nm

45

105

BGA1224

SR0MN

3610QM

2.3 GHz

3.3 GHz

4

Yes

HD 4000

650 MHz

1.1 GHz

6 MB

22 nm

45

105

G2

SR0MU

3520M

2.9 GHz

3.6 GHz

2

Yes

HD 4000

650 MHz

1.25 GHz

4 MB

22 nm

35

105

BGA1023

SR0MT

3520M

2.9 GHz

3.6 GHz

2

Yes

HD 4000

650 MHz

1.25 GHz

4 MB

22 nm

35

105

G2

SR0N6

3517U

1.9 GHz

3.0 GHz

2

Yes

HD 4000

350 MHz

1.15 GHz

4 MB

22 nm

17

105

BGA1023

In the table below, you will find all third-generation mobile Core i7 Extreme models. They come with their clock multipliers and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (oC)*

Pinout

SR0US

3940XM

3.0 GHz

3.9 GHz

4

Yes

HD 4000

650 MHz

1.35 GHz

8 MB

22 nm

55

105

G2

SR0T2

3920XM

2.9 GHz

3.8 GHz

4

Yes

HD 4000

650 MHz

1.3 GHz

8 MB

22 nm

55

105

G2

SR0MH

3920XM

2.9 GHz

3.8 GHz

4

Yes

HD 4000

650 MHz

1.3 GHz

8 MB

22 nm

55

105

G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.