All Core i7 Models
By Richard Vertrees e Rafael Otto Coelho e Gabriel Torres on October 18, 2013


Introduction

The Core i7 is a CPU series manufactured by Intel aimed at high-range computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.

By the way, the correct name of this line of processors is “Core i7,” not “Intel i7.”

Currently, there are four different generations of Core i7 processors available. In the tables below, we describe the main differences between these generations and the model series within each generation.

Model

8xx

9xx

6xx

7xx

8xx and 9xx

Market

Desktop

Desktop

Mobile

Mobile

Mobile

Generation

First

First

First

First

First

Microarchitecture

Nehalem

Nehalem

Nehalem

Nehalem

Nehalem

Manufacturing Process

45 nm

45 nm or 32 nm

32 nm

45 nm

45 nm

Number of Cores

4

4 or 6

2

4

4

Hyper-Threading

Yes

Yes

Yes

Yes

Yes

L1 cache (per core)

32 kiB+32 kiB

32 kiB+32 kiB

32 kiB+32kB

32 kiB+32 kiB

32 kiB+32 kiB

L2 cache (per core)

256 kiB

256 kiB

256 kiB

256 kiB

256 kiB

L3 cache (total)

8 MiB

8 MiB or 12 MiB

4 MiB

6 MiB

8 MiB

DMI bus

1 GB/s

No

1 GB/s

1 GB/s

1 GB/s

Memory (DDR3)

1066, 1333

1066

800, 1066†

1066, 1333 

1066, 1333

Memory Channels

2

3

2

2

2

DDR3L and DDR3L-RS

No

No

No

No

No

Graphics Engine

No

No

HD Graphics

No

No

DirectX

No

No

10

No

No

Graphics Processors

No

No

6

No

No

Graphics Base Clock

No

No

166, 266 or 500 MHz

No

No

Graphics Boost Clock

No

No

500, 566 or 766 MHz

No

No

Displays Supported

None

None

2

None

None

PCIe Controller

2.0

No

2.0

2.0

2.0

PCIe Configuration

1x16, 2x8

NA

1x16

1x16

1x16

Turbo Boost

1.0

1.0

1.0

1.0

1.0

EM64T

Yes

Yes

Yes

Yes

Yes

Virtualization

Yes

Yes

Yes

Yes

Yes

SSE4.2

Yes

Yes

Yes

Yes

Yes

AES-NI

No

On 32 nm models

Yes

No

No

AVX

No

No

No

No

No

AVX2

No

No

No

No

No

Base Clock

133 MHz

133 MHz

133 MHz

133 MHz

133 MHz

Pinout

LGA1156

LGA1366

G1 or BGA1288

G1

G1

† Except for “UM” and “UE” models, which only support DDR3-800 memory.

Model

2xxx

38xx

39xx

2xxx

Market

Desktop

Desktop

Desktop

Mobile

Generation

Second

Second

Second

Second

Microarchitecture

Sandy Bridge

Sandy Bridge

Sandy Bridge

Sandy Bridge

Manufacturing Process

32 nm

32 nm

32 nm

32 nm

Number of Cores

4

4

6

2 or 4

Hyper-Threading

Yes

Yes

Yes

Yes

L1 cache (per core)

32 kiB+32 kiB

32 kiB+32 kiB

32 kiB+32 kiB

32 kiB+32kB

L2 cache (per core)

256 kiB

256 kiB

256 kiB

256 kiB

L3 cache (total)

8 MiB

10 MiB

12 MiB or 15 MiB

4 MiB, 6 MiB or 8 MiB

DMI bus

2 GB/s

2 GB/2

2 GB/s

2 GB/s

Memory (DDR3)

1066, 1333

1066, 1333, 1600

1066, 1333, 1600

1066, 1333, 1600 

Memory Channels

2

4

4

2

DDR3L and DDR3L-RS

No

No

No

No

Graphics Engine

HD 2000 or HD 3000

No

No

HD 3000

DirectX

10.1

No

No

10.1

Graphics Processors

6 or 12

No

No

12

Graphics Base Clock

850 MHz

No

No

350, 500 or 650 MHz

Graphics Boost Clock

1.35 GHz

No

No

950 MHz, 1 GHz, 1.1 GHz, 1.2 GHz or 1.3 GHz

Displays Supported

2

No

None

2

PCIe Controller

2.0

3.0

3.0

2.0

PCIe Configuration

1x16, 2x8

40 lanes‡

40 lanes‡

1x16, 2x8, 1x8, 2x4

Turbo Boost

2.0

2.0

2.0

2.0

EM64T

Yes

Yes

Yes

Yes

Virtualization

Yes

Yes

Yes

Yes

SSE4.2

Yes

Yes

Yes

Yes

AES-NI

Yes

Yes

Yes

Yes

AVX

Yes

Yes

Yes

Yes

AVX2

No

No

No

No

Base Clock

100 MHz

100 MHz

100 MHz

100 MHz

Pinout

LGA1155

LGA2011

LGA2011

G2, BGA1023 or BGA1224

‡ There are three ports, two of them supporting 1x16, 2x8, 4x4, 8x2, and 16x1 speeds, and one of them supporting 1x8, 4x2, and 8x1 speeds. The “best” configuration allowed is x16/x16/x8, however other configurations are supported, such as x8/x8/x8/x8/x8.

Model

37xx

3xxx

4xxx

4xxx

Market

Desktop

Mobile

Desktop

Mobile

Generation

Third

Third

Fourth

Fourth

Microarchitecture

Ivy Bridge

Ivy Bridge

Haswell

Haswell

Manufacturing Process

22 nm

22 nm

22 nm

22 mm

Number of Cores

4

2 or 4

4

2 or 4

Hyper-Threading

Yes

Yes

Yes

Yes

L1 cache (per core)

32 kiB+32kB

32 kiB+32 kiB

32 kiB+32 kiB

32 kiB+32 kiB

L2 cache (per core)

256 kiB

256 kiB

256 kiB

256 kiB

L3 cache (total)

8 MiB

4 MiB, 6 MiB or 8 MiB

8 MiB

4 MiB, 6 MiB or 8 MiB

DMI bus

2 GB/s

2 GB/s

2 GB/s

2 GB/s

Memory (DDR3)

1333, 1600

1333, 1600

1333, 1600

1333, 1600

Memory Channels

2

2

2

2

DDR3L and DDR3L-RS

No

Yes

Yes

Yes

Graphics Engine

HD 4000

HD 4000

HD 4600 or Iris Pro 5200 

HD 4200, HD 4400, HD 4600, HD 5000, Iris 5100 or Iris Pro 5200

DirectX

11

11

11.1

11.1

Graphics Processors

12

12

20 or 40

10, 20 or 40 

Graphics Base Clock

650 MHz

350 MHz or 650 MHz

200 or 350 MHz

200 or 400 MHz

Graphics Boost Clock

1.15 GHz

1.1, 1.2, 1.25, 1.3 or 1.35 GHz

1.2, 1.25 or 1.3 GHz

850 MHz, 1 GHz, 1.1 GHz, 1.15 GHz, 1.2 GHz or 1.3 GHz

Displays Supported

3

3

3

3

PCIe Controller

3.0

3.0*

3.0

2.0 or 3.0 

PCIe Configuration

1x16, 2x8, 1x8, 2x4

1x16, 2x8, 1x8, 2x4

1x16, 2x8, 1x8, 2x4

1x4, 4x1 or 1x16, 2x8, 1x8, 2x4

Turbo Boost

2.0

2.0

2.0

2.0

EM64T

Yes

Yes

Yes

Yes

Virtualization

Yes

Yes

Yes

Yes

SSE4.2

Yes

Yes

Yes

Yes

AES-NI

Yes

Yes

Yes

Yes

AVX

Yes

Yes

Yes

Yes

AVX2

No

No

Yes

Yes

Base Clock

100 MHz

100 MHz

100 MHz

100 MHz

Pinout

LGA1155

G2, BGA1023 or BGA1224

LGA1150

FCPGA946, FCBGA1168 or FCBGA1364 

* Except for “U” models, which have a PCI Express 2.0 controller.

Let’s now take a detailed look at all Core i7 models launched so far.

First-Generation Core i7 Desktop Models

In the table below, we listed all Core i7-8xx and Core i7-9xx CPU models. These are desktop models based on the Nehalem microarchitecture. They are also called first-generation Core i7 processors.

The 8xx models are based on socket LGA1156 and support 1,066 MHz and 1,333 MHz DDR3 memories under dual-channel architecture. These models have an integrated PCI Express 2.0 controller supporting one x16 datapath or two x8 datapaths. On these CPUs, communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s by Intel).

The 9xx models are based on socket LGA1366 and support 1,066 MHz memories under triple-channel architecture. These models don’t have an integrated PCI Express controller and they talk to the motherboard chipset using a QPI bus working at 2.4 GHz (4.8 GB/s) on the “regular” models or at 3.2 GHz (6.4 GB/s) on the “Extreme” models, which are listed in a separate table below.

The first-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Socket

SLBYU

980

3.33 GHz

3.60 GHz

6

Yes

No

12 MiB

32 nm

130

68.8

LGA1366

SLBVF

970

3.20 GHz

3.46 GHz

6

Yes

No

12 MiB

32 nm

130

67.9

LGA1366

SLBEU

960

3.20 GHz

3.46 GHz

4

Yes

No

8 MiB

45 nm

130

67.9

LGA1366

SLBEN

950

3.06 GHz

3.32 GHz

4

Yes

No

8 MiB

45 nm

130

67.9

LGA1366

SLBCK

940

2.93 GHz

3.20 GHz

4

Yes

No

8 MiB

45 nm

130

67.9

LGA1366

SLBKP

930

2.80 GHz

3.06 GHz

4

Yes

No

8 MiB

45 nm

130

67.9

LGA1366

SLBEJ

920

2.66 GHz

2.93 GHz

4

Yes

No

8 MiB

45 nm

130

67.9

LGA1366

SLBCH

920

2.66 GHz

2.93 GHz

4

Yes

No

8 MiB

45 nm

130

67.9

LGA1366

SLBPS

880

3.06 GHz

3.74 GHz

4

Yes

No

8 MiB

45 nm

95

72.7

LGA1156

SLBS2

875K

2.93 GHz

3.60 GHz

4

Yes

No

8 MiB

45 nm

95

72.7

LGA1156

SLBQ7

870S

2.66 GHz

3.60 GHz

4

Yes

No

8 MiB

45 nm

82

NA

LGA1156

SLBJG

870

2.93 GHz

3.60 GHz

4

Yes

No

8 MiB

45 nm

95

72.7

LGA1156

SLBLG

860s

2.53 GHz

3.46 GHz

4

Yes

No

8 MiB

45 nm

82

76.7

LGA1156

SLBJJ

860

2.80 GHz

3.46 GHz

4

Yes

No

8 MiB

45 nm

95

72.7

LGA1156

In the table below, you will find all first-generation Core i7 Extreme models for desktops. These models have the QPI bus running at a higher clock rate (3.2 GHz, 6.4 GB/s) and come with their clock multiplier and Turbo Boost options unlocked, providing additional overclocking options.

sSpec

Model

Internal Clock

Turbo Boost

Cores

HT

Video

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Socket

SLBVZ

990X

3.46 GHz

3.73 GHz

6

Yes

No

12 MiB

32 nm

130

67.9

LGA1366

SLBUZ

980X

3.33 GHz

3.60 GHz

6

Yes

No

12 MiB

32 nm

130

67.9

LGA1366

SLBEQ

975

3.33 GHz

3.60 GHz

4

Yes

No

8 MiB

45 nm

130

67.9

LGA1366

SLBCJ

965

3.20 GHz

3.46 GHz

4

Yes

No

8 MiB

45 nm

130

67.9

LGA1366

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

First-Generation Core i7 Mobile Models

The first-generation Core i7 processors targeted to laptops are based on the Nehalem microarchitecture. They can use two different pinouts, G1 or BGA1288, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories on models 6xx (except for models “UM” and “UE,” which only support DDR3-800 memories), and 1,066 MHz and 1,333 MHz DDR3 memories on models 7xx, 8xx, and 9xx. They have an integrated PCI Express 2.0 controller, supporting one x16 connection. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The 6xx models have an integrated DirectX 10 video controller running at 166 MHz with a 500 MHz “boost” clock on “UM” and “UE” models, 266 MHz with a 566 MHz “boost” clock on “LM” models, or 500 MHz with a 766 MHz “boost” clock on “M” and “E” models. This video controller uses an engine called “Intel HD Graphics,” and models with integrated video support two video monitors.

First-generation Core i7 mobile CPUs can have two (6xx models) or four (all other models) processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Pinout

SLBMP

840QM

1.86 MHz

3.20 GHz

4

Yes

No

No

No

8 MiB

45 nm

45

100

G1

SLBLX

820QM

1.73 GHz

3.06 GHz

4

Yes

No

No

No

8 MiB

45 nm

45

100

G1

SLBQG

740QM

1.73 GHz

2.93 GHz

4

Yes

No

No

No

6 MiB

45 nm

45

100

G1

SLBLY

720QM

1.60 GHz

2.80 GHz

4

Yes

No

No

No

6 MiB

45 nm

45

100

G1

SLBST

680UM

1.46 GHz

2.53 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

4 MiB

32 nm

18

105

BGA1288

SLBSS

660UM

1.33 GHz

2.40 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

4 MiB

32 nm

18

105

BGA1288

SLBWV

660UE

1.33 GHz

2.40 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

4 MiB

32 nm

18

105

BGA1288

SLBMM

640UM

1.20 GHz

2.26 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

4 MiB

32 nm

18

105

BGA1288

SLBMK

640LM

2.13 GHz

2.93 GHz

2

Yes

HD Graphics

266 MHz

566 MHz

4 MiB

32 nm

25

105

BGA1288

SLBTN

640M

2.80 GHz

3.46 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MiB

32 nm

35

105

G1

SLBZU

640M

2.80 GHz

3.46 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MiB

32 nm

35

105

BGA1288

SLBMN

620UM

1.06 GHz

2.13 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

4 MiB

32 nm

18

105

BGA1288

SLBTQ

620M

2.66 GHz

3.33 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MiB

32 nm

35

105

G1

SLBPE

620M

2.66 GHz

3.33 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MiB

32 nm

35

105

BGA1288

SLBPD

620M

2.66 GHz

3.33 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MiB

32 nm

35

105

G1

SLBSU

620LM

2.00 GHz

2.80 GHz

2

Yes

HD Graphics

266 MHz

566 MHz

4 MiB

32 nm

25

105

BGA1288

SLBML

620LM

2.00 GHz

2.80 GHz

2

Yes

HD Graphics

266 MHz

566 MHz

4 MiB

32 nm

25

105

BGA1288

SLBXX

610E

2.53 GHz

3.20 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

4 MiB

32 nm

35

105

BGA1288

In the table below, you will find all first-generation mobile Core i7 Extreme models. They come with their cock multipliers and Turbo Boost options unlocked, adding more overclocking options for the enthusiast. 

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Pinout

SLBSC

940XM

2.13 GHz

3.33 GHz

4

Yes

No

8 MiB

45 nm

55

100

G1

SLBLW

920XM

2.00 GHz

3.20 GHz

4

Yes

No

8 MiB

45 nm

55

100

G1

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Second-Generation Core i7 Desktop Models

In the table below, we listed all second-generation Core i7 desktop processors, which are based on the Sandy Bridge microarchitecture.

The 3xxx models are based on socket LGA2011 and have an integrated memory controller supporting four channels as well as 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller with 40 lanes, available through two x16 ports and one x8 port. This way, the CPU can be directly connected to two PCI Express 3.0 x16 slots and one PCI Express 3.0 x8 slot. Each port can be “broken down,” so the CPU also has direct support for five PCI Express 3.0 x8 slots, for example. These models don’t have integrated video. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).

The 2xxx models are based on socket LGA1155 and have a dual-channel memory controller supporting 1,066 MHz and 1,333 MHz DDR3 memories. They have an integrated PCI Express 2.0 controller supporting one x16 connection or two x8 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 10.1 video controller running at 850 MHz with a 1.35 GHz “boost” clock, with six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.

The second-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Socket

SR0KF

3960X

3.3 GHz

3.9 GHz

6

Yes

No

No

No

15 MiB

32 nm

130

66.8

LGA2011

SR0GW

3960X

3.3 GHz

3.9 GHz

6

Yes

No

No

No

15 MiB

32 nm

130

66.8

LGA2011

SR0KY

3930K

3.2 GHz

3.8 GHz

6

Yes

No

No

No

12 MiB

32 nm

130

66.8

LGA2011

SR0H9

3930K 

3.2 GHz 

3.8 GHz 

6

Yes

No

No

No

12 MiB

32 nm

130

66.8

LGA2011

SR0LD

3820

3.6 GHz

3.8 GHz

4

Yes

No

No

No

10 MiB

32 nm

130

66.8

LGA2011

SR0DG

2700K

3.5 GHz

3.9 GHz

4

Yes

HD 3000

850 MHz

1.35 GHz

8 MiB

32 nm

95

72.6

LGA1155

SR00E

2600S

2.80 GHz

3.80 GHz

4

Yes

HD 2000

850 MHz

1.35 GHz

8 MiB

32 nm

65

69.1

LGA1155

SR00C

2600K

3.40 GHz

3.80 GHz

4

Yes

HD 3000

850 MHz

1.35 GHz

8 MiB

32 nm

95

72.6

LGA1155

SR00B

2600

3.40 GHz

3.80 GHz

4

Yes

HD 2000

850 MHz

1.35 GHz

8 MiB

32 nm

95

72.6

LGA1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

Second-Generation Core i7 Mobile Models

The second-generation Core i7 processors targeted to laptops are based on the Sandy Bridge microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2. These processors have an integrated dual-channel DDR3 memory controller, supporting 1,066 MHz, 1,333 MHz and, on 27xx, 28xx, and 29xx models, 1,600 MHz memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz, 500 MHz or 650 MHz (see table below for specific clock rates), with 12 processing cores (HD 3000 graphics engine).

Second-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Pinout

SR02X

2860QM

2.5 GHz

3.6 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MiB

32 nm

45

100

G2

SR02Q

2860QM

2.5 GHz

3.6 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MiB

32 nm

45

100

BGA1224

SR00U

2820QM

2.3 GHz

3.40 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MiB

32 nm

45

100

BGA1224

SR012

2820QM

2.3 GHz

3.4 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MiB

32 nm

45

100

G2

SR02W

2760QM

2.4 GHz

3.5 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

6 MiB

32 nm

45

100

G2

SR02R

2760QM

2.4 GHz

3.5 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

6 MiB

32 nm

45

100

BGA1224

SR00W

2720QM

2.2 GHz

3.3 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

6 MiB

32 nm

45

100

BGA1224

SR014

2720QM

2.2 GHz

3.3 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

6 MiB

32 nm

45

100

G2

SR02T

2710QE

2.1 GHz

3.0 GHz

4

Yes

HD 3000

650 MHz

1.2 GHz

6 MiB

32 nm

45

100

G2

SR0D2

2677M

1.8 GHz

2.9 GHz

2

Yes

HD 3000

350 MHz

1.2 GHz

4 MiB

32 nm

17

100

BGA1023

SR02S

2675QM

2.2 GHz

3.1 GHz

4

Yes

HD 3000

650 MHz

1.2 GHz

6 MiB

32 nm

45

100

BGA1224

SR02N

2670QM

2.2 GHz

3.1 GHz

4

Yes

HD 3000

650 MHz

1.1 GHz

6 MiB

32 nm

45

100

G2

SR03S

2657M

2.6 GHz

2.7 GHz

2

Yes

HD 3000

350 MHz

1 GHz

6 MiB

32 nm

17

100

BGA1023

SR04N

2649M

2.3 GHz

3.2 GHz

2

Yes

HD 3000

500 MHz

1.1 GHz

4 MiB

32 nm

25

100

BGA1023

 SR043

2640M

2.8 GHz

3.5 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

4 MiB

32 nm

35

100

BGA1023

SR03R

2640M

2.8 GHz

3.5 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

4 MiB

32 nm

35

100

G2

 SR0D3

2637M

1.7 GHz

2.8 GHz

2

Yes

HD 3000

350 MHz

1.2 GHz

4 MiB

32 nm

17

100

BGA1023

SR030

2635QM

2.0 GHz

2.9 GHz

4

Yes

HD 3000

650 MHz

1.2 GHz

6 MiB

32 nm

45

100

BGA1224

SR02Y

2630QM

2.0 GHz

2.9 GHz

4

Yes

HD 3000

650 MHz

1.1 GHz

6 MiB

32 nm

45

100

G2

SR04D

2629M

2.1 GHz

3.0 GHz

2

Yes

HD 3000

500 MHz

1.1 GHz

4 MiB

32 nm

25

100

BGA1023

SR03F

2620M

2.7 GHz

3.4 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

4 MiB

32 nm

35

100

G2

SR041

2620M

2.7 GHz

3.4 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

4 MiB

32 nm

35

100

BGA1023

SR03T

2617M

1.5 GHz

2.6 GHz

2

Yes

HD 3000

350 MHz

950 MHz

4 MiB

32 nm

17

100

BGA1023

In the table below, you will find the only second-generation mobile Core i7 Extreme processor model released so far. It comes with its clock multiplier and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Pinout

SR02F

2960XM

2.70 GHz

3.70 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MiB

32 nm

55

100

G2

SR02E

2920XM

2.50 GHz

3.50 GHz

4

Yes

HD 3000

650 MHz

1.3 GHz

8 MiB

32 nm

55

100

G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Third-Generation Core i7 Desktop Models

In the table below, we listed all third-generation Core i7 desktop processors, which are based on the Ivy Bridge microarchitecture. The models released so far are based on socket LGA1155 and have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 11 video controller running at 650 MHz with a 1.15 GHz “boost” clock, with 12 (HD 4000) processing cores. All models support three displays (previous generations support two).

The third-generation Core i7 desktop models are quad- or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having either eight or twelve cores. However, only half the cores are “real;” the other half is simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Socket

SR1AS

4960X

3.6 GHz

4.0 GHz

6

Yes

No

-

-

15 MiB

22 nm

130

66.8

LGA2011

SR1AT

4930K

3.4 GHz

3.9 GHz

6

Yes

No

-

-

12 MiB

22 nm

130

66.8

LGA2011

SR1AU

4920K

3.7 GHz

3.9 GHz

4

Yes

No

-

-

10 MiB

22 nm

130

88.8

LGA2011

SR0PL

3770K

3.5 GHz

3.9 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

8 MiB

22 nm

77

67.4

LGA1155

SR0PK

3770

3.4 GHz

3.9 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

8 MiB

22 nm

77

67.4

LGA1155

SR0PN

3770S

3.1 GHz

3.9 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

8 MiB

22 nm

65

69.1

LGA1155

SR0PQ

3770T

2.5 GHz

3.7 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

8 MiB

22 nm

45

69.8

LGA1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

Third-Generation Core i7 Mobile Models

The third-generation Core i7 processors targeted to laptops are based on the Ivy Bridge microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2. These processors have an integrated dual-channel DDR3 memory controller, supporting 1,333 MHz and 1,600 MHz memories. They also have an integrated PCI Express 3.0 controller (in the “U” models, this controller is 2.0) supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 11 video controller running at 650 MHz (350 MHz on “U” models), with a “boost” clock that depends on the model (see table below for specific clock rates), all with 12 processing cores (HD 4000 graphics engine).

Third-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Pinout

NA

3840QM

2.8 GHz

3.8 GHz

4

Yes

HD 4000

650 MHz

1.3 GHz

8 MiB

22 nm

45

105

G2

NA

3840QM

2.8 GHz

3.8 GHz

4

Yes

HD 4000

650 MHz

1.3 GHz

8 MiB

22 nm

45

105

BGA1224

SR0MK

3820QM

2.7 GHz

3.7 GHz

4

Yes

HD 4000

650 MHz

1.25 GHz

8 MiB

22 nm

45

105

BGA1224

SR0MJ

3820QM

2.7 GHz

3.7 GHz

4

Yes

HD 4000

650 MHz

1.25 GHz

8 MiB

22 nm

45

105

G2

SR0UV

3740QM

2.7 GHz

3.7 GHz

4

Yes

HD 4000

650 MHz

1.3 GHz

6 MiB

22 nm

45

105

G2

SR0MM

3720QM

2.6 GHz

3.6 GHz

4

Yes

HD 4000

650 MHz

1.25 GHz

6 MiB

22 nm

45

105

BGA1224

SR0ML

3720QM

2.6 GHz

3.6 GHz

4

Yes

HD 4000

650 MHz

1.25 GHz

6 MiB

22 nm

45

105

G2

SR12R

3689Y

1.5 GHz

2.6 GHz

2

Yes

HD 4000

350 MHz

850 MHz

4 MiB

22 nm

13

105

BGA1023

SR0XH

3687U

2.1 GHz 3.3 GHz 2 Yes HD 4000 350 MHz 1.2 GHz 4 MiB 22 nm 17 105 BGA1023

SR0N5

3667U

2.0 GHz

3.2 GHz

2

Yes

HD 4000

350 MHz

1.15 GHz

4 MiB

22 nm

17

105

BGA1023

NA

3635QM

2.4 GHz

3.4 GHz

4

Yes

HD 4000

650 MHz

1.2 GHz

6 MiB

22 nm

45

105

BGA1224

SR0V0

3632QM

2.2 GHz

3.2 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

6 MiB

22 nm

35

105

G2

NA

3632QM

2.2 GHz 3.2 GHz 4 Yes HD 4000 650 MHz 1.15 GHz 6 MiB 22 nm 35 105 BGA1224

NA

3630QM

2.4 GHz

3.4 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

6 MiB

22 nm

45

105

G2

SR0MP

3615QM

2.3 GHz

3.3 GHz

4

Yes

HD 4000

650 MHz

1.2 GHz

6 MiB

22 nm

45

105

BGA1224

SR0MQ

3612QM

2.1 GHz

3.1 GHz

4

Yes

HD 4000

650 MHz

1.1 GHz

6 MiB

22 nm

45

105

G2

SR0MR

3612QM

2.1 GHz

3.1 GHz

4

Yes

HD 4000

650 MHz

1.1 GHz

6 MiB

22 nm

45

105

BGA1224

SR0MN

3610QM

2.3 GHz

3.3 GHz

4

Yes

HD 4000

650 MHz

1.1 GHz

6 MiB

22 nm

45

105

G2

SR0X8

3540M

3.0 GHz

3.7 GHz

2

Yes

HD 4000

650 MHz

1.3 GHz

4 MiB

22 nm

35

105

BGA1023

SR0X6

3540M

3.0 GHz

3.7 GHz

2

Yes

HD 4000

650 MHz

1.3 GHz

4 MiB

22 nm

35

105

G2

SR0XG

3537U

2.0 GHz

3.1 GHz

2

Yes

HD 4000

350 MHz

1.2 GHz

4 MiB

22 nm

17

105

BGA1023

SR0MU

3520M

2.9 GHz

3.6 GHz

2

Yes

HD 4000

650 MHz

1.25 GHz

4 MiB

22 nm

35

105

BGA1023

SR0MT

3520M

2.9 GHz

3.6 GHz

2

Yes

HD 4000

650 MHz

1.25 GHz

4 MiB

22 nm

35

105

G2

SR0N6

3517U

1.9 GHz

3.0 GHz

2

Yes

HD 4000

350 MHz

1.15 GHz

4 MiB

22 nm

17

105

BGA1023

In the table below, you will find all third-generation mobile Core i7 Extreme models. They come with their clock multipliers and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Pinout

SR0US

3940XM

3.0 GHz

3.9 GHz

4

Yes

HD 4000

650 MHz

1.35 GHz

8 MiB

22 nm

55

105

G2

SR0T2

3920XM

2.9 GHz

3.8 GHz

4

Yes

HD 4000

650 MHz

1.3 GHz

8 MiB

22 nm

55

105

G2

SR0MH

3920XM

2.9 GHz

3.8 GHz

4

Yes

HD 4000

650 MHz

1.3 GHz

8 MiB

22 nm

55

105

G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Fourth-Generation Core i7 Desktop Models

In the table below, we listed all fourth-generation Core i7 desktop processors, which are based on the Haswell microarchitecture. The models released so far are based on socket LGA1150 and, therefore, incompatible with motherboards designed for previous models.

These processors have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).

A new feature brought by these models is the support for AVX2 instructions.

All models have an integrated DirectX 11.1 video controller and two graphics engines are available at the moment: HD 4600 (codenamed “GT2”, 20 processing units), and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).

The fourth-generation Core i7 desktop models are quad-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight cores. However, only half the cores are “real;” the other half is simulated.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Socket
SR1BW 4771 3.5 GHz 3.9 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB 22 nm 84 72 LGA1150
SR147 4770K 3.4 GHz 3.9 GHz 4 Yes HD 4600 350 MHz 1.25 GHz 8 MiB 22 nm 84 72.72 LGA1150
SR149 4770 3.4 GHz 3.9 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB 22 nm 84 72.72 LGA1150
NA 4770R 3.2 GHz 3.9 GHz 4 Yes Iris Pro 5200 200 MHz 1.3 GHz 6 MiB 22 nm 65 66.45 LGA1150
SR14H 4770S 3.1 GHz 3.9 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB 22 nm 65 71.35 LGA1150
SR14N 4770T 2.5 GHz 3.7 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB 22 nm 45 71.45 LGA1150
SR14Q   4765T  2.0 GHz 3.0 GHz   4  Yes HD 4600 350 MHz 1.2 GHz 8 MiB 22 nm 35 66.35 LGA1150

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

Fourth-Generation Core i7 Mobile Models

The fourth-generation Core i7 processors targeted to laptops are based on the Haswell microarchitecture.

A new feature brought by these models is the support for AVX2 instructions.

The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port SATA-600 controller. On these models, the PCI Express controller is 2.0 and supports only one x4 connection or four x1 connections. On the other models, the PCI Express controller is 3.0 and supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).

Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 processing units), HD 4400 (codenamed “GT2”, 20 processing units), HD 4600 (codenamed “GT2”, 20 processing units), HD 5000 (codenamed “GT3”, 40 processing units), Iris 5100 (codenamed “GT3”, 40 processing units), and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).

The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.

Fourth-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated. 

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Package
NA 4960HQ 2.6 GH 3.8 GHz 4 Yes Iris Pro 5200 200 MHz 1.3 GHz 6 MiB 22 nm 47 100 NA
SR18G 4950HQ 2.4 GHz 3.6 GHz 4 Yes Iris Pro 5200 200 MHz 1.3 GHz 6 MiB 22 nm 47 100 FCBGA1364
SR15K 4900MQ 2.8 GHz 3.8 GHz 4 Yes HD 4600 400 MHz 1.3 GHz 8 MiB 22 nm 47 100 FCPGA946
SR18H 4850HQ 2.3 GHz 3.5 GHz 4 Yes Iris Pro 5200 200 MHz 1.2 GHz 6 MiB 22 nm 47 100 FCBGA1364
SR15L 4800MQ 2.7 GHz 3.7 GHz 4 Yes HD 4600 400 MHz 1.3 GHz 6 MiB 22 nm 47 100 FCPGA946
SR18J 4750HQ 2.0 GHz 3.2 GHz 4 Yes Iris Pro 5200 200 MHz 1.2 GHz 6 MiB 22 nm 47 100 FCBGA1364
SR15F 4702HQ 2.2 GHz 3.2 GHz 4 Yes HD 4600 400 MHz 1.15 GHz 6 MiB 22 nm 37 100 FCBGA1364
SR15J 4702MQ 2.2 GHz 3.2 GHz 4 Yes HD 4600 400 MHz 1.15 GHz 6 MiB 22 nm 37 100 FCPGA946
SR15E 4700HQ 2.4 GHz 3.4 GHz 4 Yes HD 4600 400 MHz 1.2 GHz 6 MiB 22 nm 47 100 FCBGA1364
SR15H 4700MQ 2.4 GHz 3.4 GHz 4 Yes HD 4600 400 MHz 1.15 GHz 6 MiB 22 nm 47 100 FCPGA946
SR17L 4700EQ 2.4 GHz 3.4 GHz 4 Yes HD 4600 400 MHz 1 GHz 6 MiB 22 nm 47 100 FCBGA1364
SR16H 4650U 1.7 GHz 3.3 GHz 2 Yes HD 5000 200 MHz 1.1 GHz 4 MiB 22 nm 15 100 FCBGA1168
NA 4610Y 1.7 GHz 2.9 GHz 2 Yes HD 4200 200 MHz 850 MHz 4 MiB 22 nm 11.5 100 NA
NA 4600M 2.9 GHz 3.6 GHz 2 Yes HD 4600 400 MHz 1.3 GHz 4 MiB 22 nm 37 100 NA
SR1EA 4600U 2.1 GHz 3.3 GHz 2 Yes HD 4400 200 MHz 1.1 GHz 4 MiB 22 nm 15 100 FCBGA1168
SR188 4558U 2.8 GHz 3.3 GHz 2 Yes Iris 5100 200 MHz 1.2 GHz 4 MiB 22 nm 28 100 FCBGA1168
SR16J 4550U 1.5 GHz 3.0 GHz 2 Yes HD 5000 200 MHz 1.1 GHz 4 MiB 22 nm 15 100 FCBGA1168
SR16Z 4500U 1.8 GHz 3.0 GHz 2 Yes HD 4400 200 MHz 1.1 GHz 4 MiB 22 nm 15 100 FCBGA1168

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Originally at http://www.hardwaresecrets.com/article/All-Core-i7-Models/708


© 2004-13, Hardware Secrets, LLC. All Rights Reserved.

Total or partial reproduction of the contents of this site, as well as that of the texts available for downloading, be this in the electronic media, in print, or any other form of distribution, is expressly forbidden. Those who do not comply with these copyright laws will be indicted and punished according to the International Copyrights Law.

We do not take responsibility for material damage of any kind caused by the use of information contained in Hardware Secrets.