All Core i5 Models
By Richard Vertrees e Rafael Coelho e Gabriel Torres on October 11, 2013


Introduction

The Core i5 is a CPU series manufactured by Intel aimed at mid-range computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.

By the way, the correct name of this line of processors is “Core i5,” not “Intel i5.”

Currently, there are four different generations of Core i5 processors available. In the table below, we describe the main differences between these generations.

Model

7xx

6xx

4xx and 5xx

2xxx

2xxx

Market

Desktop

Desktop

Mobile

Desktop

Mobile

Generation

First

First

First

Second

Second

Microarchitecture

Nehalem

Nehalem

Nehalem

Sandy Bridge

Sandy Bridge

Manufacturing Process

45 nm

32 nm

32 nm

32 nm

32 nm

Number of Cores

4

2

2

4†

2

Hyper-Threading

No

Yes

Yes

No†

Yes

L1 cache (per core)

32 kiB+32 kiB

32 kiB+32 kiB

32 kiB+32kB

32 kiB+32 kiB

32 kiB+32kB

L2 cache (per core)

256 kiB

256 kiB

256 kiB

256 kiB

256 kiB

L3 cache (total)

8 MiB

4 MiB

3 MiB

6 MiB†

3 MiB

DMI bus

1 GB/s

1 GB/s

1 GB/s

2 GB/s

2 GB/s

Memory (DDR3)

1066, 1333

1066, 1333

800, 1066

1066, 1333

1066, 1333, 1600 

DDR3L and DDR3L-RS

No

No

No

No

No

Graphics Engine

No

HD Graphics

HD Graphics

HD 2000 or HD 3000‡

HD 3000

DirectX

No

10

10

10.1‡

10.1

Graphics Processors

No

12

6

6 or 12‡

12

Graphics Base Clock

No

733 MHz or 900 MHz

166 MHz or 500 MHz

650 MHz or 850 MHz‡

350 MHz or 650 MHz

Graphics Boost Clock

No

No

500 MHz or 766 MHz

1.25 GHz or 1.1 GHz‡

1.2 GHz or 1.3 GHz

Displays Supported

None

2

2

2‡

2

PCIe Controller

2.0

2.0

2.0

2.0

2.0

PCIe Configuration

1x16, 2x8

1x16, 2x8

1x16

1x16, 2x8, 1x8, 2x4

1x16, 2x8, 1x8, 2x4

Turbo Boost

1.0

1.0

1.0

2.0

2.0

EM64T

Yes

Yes

Yes

Yes

Yes

Virtualization

Yes

Yes

Yes

Yes

Yes

SSE4.2

Yes

Yes

Yes

Yes

Yes

AES-NI

No

Yes

Yes

Yes

Yes

AVX

No

No

No

Yes

Yes

AVX2

No

No

No

No

No

Base Clock

133 MHz

133 MHz

133 MHz

100 MHz

100 MHz

Pinout

LGA1156

LGA1156

G1 or BGA1288

LGA1155

G2 or BGA1023

 

Model

3xxx

3xxx

4xxx

4xxx

Market

Desktop

Mobile

Desktop

Portátil

Generation

Third

Third

Quarta

Quarta

Microarchitecture

Ivy Bridge

Ivy Bridge

Haswell

Haswell

Manufacturing Process

22 nm

22 nm

22 nm

22 nm

Number of Cores

4

2

4*

2

Hyper-Threading

No

Yes

No*

Yes

L1 cache (per core)

32 kiB+32kB

32 kiB+32 kiB

32 kiB+32 kiB

32 kiB+32 kiB

L2 cache (per core)

256 kiB

256 kiB

256 kiB

256 kiB

L3 cache (total)

6 MiB

3 MiB

4 MiB or 6 MiB

3 MiB

DMI bus

2 GB/s

2 GB/s

2 GB/s

2 GB/s

Memory (DDR3)

1333, 1600

1333, 1600

1333, 1600

1333, 1600

DDR3L and DDR3L-RS

No

Yes

Yes

Yes

Graphics Engine

HD 2500 or HD 4000‡

HD 4000

HD 4600 or Iris Pro 5200

HD 4200, HD 4400, HD 4600, HD 5000 or Iris 5100

DirectX

11‡

11

11.1

11.1

Graphics Processors

6 or 12‡

12

20 or 40

10, 20 or 40

Graphics Base Clock

650 MHz‡

350 MHz or 650 MHz

200 MHz or 350 MHz

200 MHz or 400 MHz

Graphics Boost Clock

1.05 GHz, 1.1 GHz or 1.15 GHz‡

1.05 GHz, 1.15 GHz or 1.2 GHz

1,1 GHz, 1,15 GHz, 1,2 GHz ou 1,3 GHz

850 GHz, 1 GHz, 1,1 GHz, 1,15 GHz ou 1,25 GHz

Displays Supported

3‡

3

3

3

PCIe Controller

3.0

3.0

3.0

3.0

PCIe Configuration

1x16, 2x8, 1x8, 2x4

1x16, 2x8, 1x8, 2x4

1x16, 2x8, 1x8, 2x4

1x16, 2x8, 1x8, 2x4 ou 1x4, 4x1

Turbo Boost

2.0

2.0

2.0

2.0

EM64T

Yes

Yes

Yes

Yes

Virtualization

Yes

Yes

Yes

Yes

SSE4.2

Yes

Yes

Yes

Yes

AES-NI

Yes

Yes

Yes

Yes

AVX

Yes

Yes

Yes

Yes

AVX2

No

No

Yes

Yes

Base Clock

100 MHz

100 MHz

100 MHz

100 MHz

Pinout

LGA1155

G2 or BGA1023

LGA1150

FCPGA946, FCBGA1168 or FCBGA1364

 

† Except for the model 2390T, which has two cores, supports the Hyper-Threading technology, and has 3 MiB of cache L3.

‡ The 2550K model and models ending with a “P” don’t have integrated video.

* Except for the 4570T model, which has two cores and supports the Hyper-Threading technology.

Let’s now take a detailed look at all Core i5 models launched so far.

 

Core i5-6xx and 7xx Models (Desktop)

In the table below, we listed all Core i5 6xx and Core i5 7xx CPU models. These are desktop models based on the Nehalem microarchitecture and are also called first-generation Core i5 processors. These models use the socket LGA1156. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 datapath or two x8 datapaths. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s by Intel). All 6xx models have an integrated DirectX 10 video controller with 12 execution units running at 733 MHz or 900 MHz, using an engine that is known as “Intel HD Graphics,” a feature not present on the 7xx models. Models with integrated video support two video monitors.

The 7xx models are quad-core CPUs without the Hyper-Threading technology, while the 6xx models are dual-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having four cores. However, while on the 7xx models these cores are all “real,” on the 6xx models two of these cores are “real” and the other two are simulated. 

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Voltage (V)

SLBRP

760

2.80 GHz

3.46 GHz

4

No

No

No

8 MiB

45 nm

95

72.7

0.65 - 1.4

SLBLH

750S

2.40 GHz

3.20 GHz

4

No

No

No

8 MiB

45 nm

82

76.7

0.65 - 1.4

SLBLC

750

2.66 GHz

3.20 GHz

4

No

No

No

8 MiB

45 nm

95

72.7

0.65 - 1.4

SLBTM

680

3.60 GHz

3.86 GHz

2

Yes

HD Graphics

733 MHz

4 MiB

32 nm

73

72.6

0.65 - 1.4

SLBLT

670

3.56 GHz

3.73 GHz

2

Yes

HD Graphics

733 MHz

4 MiB

32 nm

73

72.6

0.65 - 1.4

SLBTB

661

3.33 GHz

3.60 GHz

2

Yes

HD Graphics

900 MHz

4 MiB

32 nm

87

69.8

0.65 - 1.4

SLBNE

661

3.33 GHz

3.60 GHz

2

Yes

HD Graphics

900 MHz

4 MiB

32 nm

87

69.8

0.65 - 1.4

SLBTK

660

3.33 GHz

3.60 GHz

2

Yes

HD Graphics

733 MHz

4 MiB

32 nm

73

72.6

0.65 - 1.4

SLBLV

660

3.33 GHz

3.60 GHz

2

Yes

HD Graphics

733 MHz

4 MiB

32 nm

73

72.6

0.65 - 1.4

SLBXL

655K

3.20 GHz

3.46 GHz

2

Yes

HD Graphics

733 MHz

4 MiB

32 nm

73

72.6

0.65 - 1.4

SLBTJ

650

3.20 GHz

3.46 GHz

2

Yes

HD Graphics

733 MHz

4 MiB

32 nm

73

72.6

0.65 - 1.4

SLBLK

650

3.20 GHz

3.46 GHz

2

Yes

HD Graphics

733 MHz

4 MiB

32 nm

73

72.6

0.65 - 1.4

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

Core i5-4xx and 5xx Models (Mobile)

The first-generation Core i5 targeted to laptops, named 4xx and 5xx, uses the Nehalem microarchitecture. They can use two different pinouts, BGA1288 or socket G1, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories. (“UM” models support only DDR3-800 memories.) They have an integrated PCI Express 2.0 controller supporting one x16 connection and an integrated DirectX 10 video controller running at 500 MHz with a 766 MHz “boost” clock (166 MHz with a 500 MHz “boost” clock in “UM” models). Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The models listed below support two video monitors.

All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

SLC28

580M

2.66 GHz

3.33 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

G1

SLC29

580M

2.66 GHz

3.33 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

BGA1288

SLBSN

560UM

1.33 GHz

2.13 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

18

105

BGA1288

SLBTS

560M

2.66 GHz

3.20 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

G1

SLBTT

560M

2.66 GHz

3.20 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

BGA1288

SLBUJ

540UM

1.20 GHz

2.00 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

18

105

BGA1288

SLBTV

540M

2.53 GHz

3.06 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

G1

SLBPF

540M

2.53 GHz

3.06 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

BGA1288

SLBPG

540M

2.53 GHz

3.06 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

G1

SLBU3

520M

2.40 GHz

2.93 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

G1

SLBNA

520M

2.40 GHz

2.93 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

BGA1288

SLBNB

520M

2.40 GHz

2.93 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

G1

SLBQP

520UM

1.06 GHz

1.86 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

18

105

BGA1288

SLC27

480M

2.66 GHz

2.93 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

G1

SLC26

480M

2.66 GHz

2.93 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

BGA1288

SLBXP

470UM

1.33 GHz

1.86 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

18

105

BGA1288

SLBZW

460M

2.53 GHz

2.80 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

G1

SLC22

460M

2.53 GHz

2.80 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

BGA1288

SLBTZ

450M

2.40 GHz

2.66 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

G1

SLBPM

430M

2.26 GHz

2.53 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

BGA1288

SLBPN

430M

2.26 GHz

2.53 GHz

2

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

35

105

G1

SLBVS

430UM

1.20 GHz

1.73 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

18

105

BGA1288

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Core i5-2xxx Models (Desktop)

In the table below, we listed all Core i5-2xxx desktop CPU models, which are based on the Sandy Bridge microarchitecture. They are also called second-generation Core i5 processors and use the socket LGA1155. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). All models (except the 2550K and the “P” models) have an integrated DirectX 10.1 video controller running at 650 MHz with a 1.25 GHz “boost” clock or 850 MHz with a 1.1 GHz “boost” clock, with six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays. 

Second-generation Core i5 desktop CPUs with four cores don’t support the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having four cores. However, while on quad-core models these cores are all “real,” on the dual-core model two of these cores are “real” and the other two are simulated.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Voltage (V)

SR0QH

2550K

3.4 GHz

3.8 GHz

4

No

No

No

No

6 MiB

32 nm

95

72.6

NA

SR00A

2500T

2.3 GHz

3.3 GHz

4

No

HD 2000

650 MHz

1.25 GHz

6 MiB

32 nm

45

69.8

NA

SR009

2500S

2.7 GHz

3.7 GHz

4

No

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

65

69.1

NA

SR008

2500K

3.3 GHz

3.7 GHz

4

No

HD 3000

850 MHz

1.1 GHz

6 MiB

32 nm

95

72.6

NA

SR00T

2500

3.3 GHz

3.7 GHz

4

No

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

95

72.6

NA

SR0G1

2450P

3.2 GHz

3.5 GHz

4

No

No

No

No

6 MiB

32 nm

95

72.6

NA

SR0BB

2405S

2.5 GHz

3.3 GHz

4

No

HD 3000

850 MHz

1.1 GHz

6 MiB

32 nm

65

69.1

NA

SR00S

2400S

2.5 GHz

3.3 GHz

4

No

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

65

69.1

NA

SR00Q

2400

3.1 GHz

3.4 GHz

4

No

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

95

72.6

NA

SR065

2390T

2.7 GHz

3.5 GHz

2

Yes

HD 2000

650 MHz

1.25 GHz

3 MiB

32 nm

35

65.0

NA

SR0G2

2380P

3.1 GHz

3.4 GHz

4

No

No

No

No

6 MiB

32 nm

95

72.6

NA

SR02L

2320

3.0 GHz

3.3 GHz

4

No

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

95

72.6

NA

SR02K

2310

2.9 GHz

3.2 GHz

4

No

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

95

72.6

NA

SR00D

2300

2.8 GHz

3.1 GHz

4

No

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

95

72.6

NA

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

Core i5-2xxx Models (Mobile)

The second-generation Core i5 targeted to laptops, which use the Sandy Bridge microarchitecture, can use two different pinouts, BGA1023 or socket G2, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz with a 1.2 GHz “boost” clock on models with a TDP of 17 W, or 650 MHz with a 1.3 GHz “boost” clock on models with a TDP of 35 W, all with 12 processing cores (HD 3000 graphics engine).

All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

SR0CS

2557M

1.7 GHz

2.7 GHz

2

Yes

HD 3000

350 MHz

1.2 GHz

32 nm

3 MiB

17

100

BGA1023

SR044

2540M

2.6 GHz

3.3 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

G2

SR046

2540M

2.6 GHz

3.3 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

BGA1023

SR03W

2537M

1.4 GHz

2.3 GHz

2

Yes

HD 3000

350 MHz

1.2 GHz

32 nm

3 MiB

17

100

BGA1023

SR048

2520M

2.5 GHz

3.2 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

G2

NA

2520M

2.5 GHz

3.2 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

BGA1023

SR02U

2510E

2.5 GHz

3.1 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

G2

SR0D6

2467M

1.6 GHz

2.3 GHz

2

Yes

HD 3000

350 MHz

1.2 GHz

32 nm

3 MiB

17

100

BGA1023

SR0CH

2450M

2.5 GHz

3.1 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

G2

SR06Z

2450M

2.5 GHz

3.1 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

BGA1023

SR04Z

2450M

2.5 GHz

3.1 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

BGA1023

NA

2435M

2.4 GHz

3 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

G2

NA

2435M

2.4 GHz

3 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

BGA1023

SR04W

2430M

2.4 GHz

3 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

G2

NA

2430M

2.4 GHz

3 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

BGA1023

SR04B

2410M

2.3 GHz

2.9 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

G2

SR04G

2410M

2.3 GHz

2.9 GHz

2

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

35

100

BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Core i5-3xxx Models (Desktop)

The Core i5-3xxx models are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They use the socket LGA1155, the same used by the second-generation Core i5 processors. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models (except the “P” models) have an integrated DirectX 11 video controller with six (Intel HD 2500 graphics) or 12 (Intel HD 4000 graphics) processing units, running at 650 MHz with a “boost” clock of 1.25 GHz on 35xx models, 1.1 GHz on 34xx models or 1.05 GHz on 33xx models. Models with integrated video support three displays (previous generations support two).

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Voltage (V)

SR0PM

3570K

3.4 GHz

3.8 GHz

4

No

HD 4000

650 MHz

1.15 GHz

22 nm

6 MiB

77

67.4

NA

SR0T7

3570

3.4 GHz

3.8 GHz

4

No

HD 2500

650 MHz

1.15 GHz

22 nm

6 MiB

77

67.4

NA

SR0P1

3570T

2.3 GHz

3.3 GHz

4

No

HD 2500

650 MHz

1.15 GHz

22 nm

6 MiB

45

69.8

NA

SR0T9

3570S

3.1 GHz

3.8 GHz

4

No

HD 2500

650 MHz

1.15 GHz

22 nm

6 MiB

65

69.1

NA

SR0P0

3550

3.3 GHz

3.7 GHz

4

No

HD 2500

650 MHz

1.15 GHz

22 nm

6 MiB

77

67.4

NA

SR0P3

3550S

3 GHz

3.7 GHz

4

No

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

65

69.1

NA

SR0PP

3475S

2.9 GHz

3.6 GHz

4

No

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

65

69.1

NA

SR0T8

3470

3.2 GHz

3.6 GHz

4

No

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

77

67.4

NA

SR0RJ

3470T

2.9 GHz

3.6 GHz

4

No

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

35

65.0

NA

SR0TA

3470S

2.9 GHz

3.6 GHz

4

No

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

65

69.1

NA

SR0PF

3450

3.1 GHz

3.5 GHz

4

No

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

77

67.4

NA

SR0P2

3450S

2.8 GHz

3.5 GHz

4

No

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

65

69.1

NA

SR0WS

3350P

3.1 GHz

3.3 GHz

4

No

No

No

1.05 GHz

22 nm

6 MiB

69

67.4

NA

SR0RQ

3330

3 GHz

3.2 GHz

4

No

HD 2500

650 MHz

1.05 GHz

22 nm

6 MiB

77

67.4

NA

SR0RR

3330S

2.7 GHz

3.2 GHz

4

No

HD 2500

650 MHz

1.05 GHz

22 nm

6 MiB

65

NA

NA

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

Core i5-3xxx Models (Mobile)

As their desktop counterparts, the Core i5-3xxx models targeted to mobile computers are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They can use either the BGA1023 pinout or the socket S2 pinout. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3, DDR3L, and DDR3L-RS memories. They also have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models have an integrated DirectX 11 video controller with 12 execution units (Intel HD 4000 graphics). This is one of the main differences between the mobile and the desktop models, since desktop models use the Intel HD 2500 graphics (six execution units). On “M” models, the graphics engine works at 650 MHz with 1.2 GHz at “boost” mode, while on “U” models, the graphics engine works at 350 MHz with a “boost” mode of 1.15 GHz on 34xx models or 1.05 GHz on 33xx models. All models support three displays (previous generations support two).

Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Turbo Boost

Cores

HT

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

SR0N7

3427U

1.8 GHz

2.8 GHz

2

Yes

HD 4000

350 MHz

1.15 GHz

22 nm

3 MiB

17

105

BGA1023

SR0MV

3360M

2.8 GHz

3.5 GHz

2

Yes

HD 4000 

650 MHz

1.2 GHz

22 nm

3 MiB

35

105

G2

SR0MW

3360M

2.8 GHz

3.5 GHz

2

Yes

HD 4000

650 MHz

1.2 GHz

22 nm

3 MiB

35

105

BGA1023

SR0MX

3320M

2.6 GHz

3.3 GHz

2

Yes

HD 4000

650 MHz

1.2 GHz

22 nm

3 MiB

35

105

G2

SR0MY

3320M

2.6 GHz

3.3 GHz

2

Yes

HD 4000

650 MHz

1.2 GHz

22 nm

3 MiB

35

105

BGA1023

SR0N8

3317U

1.7 GHz

2.6 GHz

2

Yes

HD 4000

350 MHz

1.05 GHz

22 nm

3 MiB

17

105

BGA1023

SR0MZ

3210M

2.5 GHz

3.1 GHz

2

Yes

HD 4000

650 MHz

1.2 GHz

22 nm

3 MiB

35

105

G2

NA 

3210M

2.5 GHz

3.1 GHz

2

Yes

HD 4000

650 MHz

1.2 GHz

22 nm

3 MiB

35

105

BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Core i5-4xxx Models (Desktop)

Core i5-4xxx models are based on the Haswell microarchitecture and are also known as the fourth-generation Core i5 processors. They use a new socket, LGA1150, which is not compatible with motherboards developed for previous models.

The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).

These processors support AVX2 instructions, not available on previous models.

All models have an integrated DirectX 11.1 video controller, and two engines are available at the moment: HD 4600 (codenamed “GT2”, 20 processing units) and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).

sSpec Model Clock Turbo Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)*
SR14D 4670 3.4 GHz 3.8 GHz 4 No HD 4600 350 MHz 1.2 GHz 22 nm 6 MiB 84 72.72
SR14A 4670K 3.4 GHz 3.8 GHz 4 No HD 4600 350 MHz 1.2 GHz 22 nm 6 MiB 84 72.72
SR14K 4670S 3.1 GHz 3.8 GHz 4 No HD 4600 350 MHz 1.2 GHz 22 nm 6 MiB 65 71.35
NA 4670R 3.0 GHz 3.7 GHz 4 No Iris Pro 5200 200 MHz 1.3 GHz 22 nm 4 MiB 65 71.35
SR14P 4670T 2.3 GHz 3.3 GHz 4 No HD 4600 350 MHz 1.2 GHz 22 nm 6 MiB 45 71.45
SR14E 4570 3.2 GHz 3.6 GHz 4 No HD 4600 350 MHz 1.15 GHz 22 nm 6 MiB 84 72.72
SR14J 4570S 2.9 GHz 3.6 GHz 4 No HD 4600 350 MHz 1.15 GHz 22 nm 6 MiB 65 71.35
SR1CA 4570T 2.9 GHz 3.6 GHz 2 Sim HD 4600 200 MHz 1.15 GHz 22 nm 4 MiB 35 66.35
NA 4570R 2.7 GHz 3.2 GHz 4 No Iris Pro 5200 200 MHz 1.15 GHz 22 nm 4 MiB 65 71.35
SR14F 4440 3.1 GHz 3.3 GHz 4 No HD 4600 350 MHz 1.1 GHz 22 nm 6 MiB 84 NA
SR14L 4440S 2.8 GHz 3.3 GHz 4 No HD 4600 350 MHz 1.1 GHz 22 nm 6 MiB 65 NA
SR14G 4430 3.0 GHz 3.2 GHz 4 No HD 4600 350 MHz 1.1 GHz 22 nm 6 MiB 84 72.72
SR14M 4430S 2.7 GHz 3.2 GHz 4 No HD 4600 350 MHz 1.1 GHz 22 nm 6 MiB 65 71.35

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

Core i5-4xxx Models (Mobile)

The fourth-generation Core i3 processors targeted to mobile computers are based on the Haswell microarchitecture.

These processors support AVX2 instructions, not available on previous models.

The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port SATA-600 controller. On these models, the PCI Express controller supports only one x4 connection or four x1 connections. On the other models, the PCI Express controller supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).

Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 processing units), HD 4400 (codenamed “GT2”, 20 processing units), HD 4600 (codenamed “GT2”, 20 processing units), HD 5000 (codenamed “GT3”, 40 processing units), and Iris 5100 (codenamed “GT3”, 40 processing units).

The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.

Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Turbo Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SR17Q 4402E 1.6 GHz 2.7 GHz 2 Yes HD 4600 NA NA 22 nm 3 MiB 25 100 FCBGA1364
SR17M 4400E 2.7 GHz 3.3 GHz 2 Yes HD 4600 400 MHz 1 GHz 22 nm 3 MiB 37 100 FCBGA1364
SR16L 4350U 1.4 GHz 2.9 GHz 2 Yes HD 5000 200 MHz 1.1 GHz 22 nm 3 MiB 15 100 FCBGA1168
NA 4330M 2.8 GHz 3.5 GHz 2 Yes HD 4600 400 MHz 1.25 GHz 22 nm 3 MiB 37 100 NA
NA 4302Y 1.6 GHz 2.3 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 NA
NA 4300M 2.6 GHz 3.3 GHz 2 Yes HD 4600 400 MHz 1.25 GHz 22 nm 3 MiB 37 100 NA
SR1ED 4300U 1.9 GHz 2.9 GHz 2 Yes HD 4400 200 MHz 1.1 GHz 22 nm 3 MiB 15 100 FCBGA1168
SR192 4300Y 1.6 GHz 2.3 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168
SR189 4288U 2.6 GHz 3.1 GHz 2 Yes Iris 5100 200 MHz 1.2 GHz 22 nm 3 MiB 28 100 FCBGA1168
SR18A 4358U 2.4 GHz 2.9 GHz 2 Yes Iris 5100 200 MHz 1.1 GHz 22 nm 3 MiB 28 100 FCBGA1168
SR16M 4250U 1.3 GHz 2.6 GHz 2 Yes HD 5000 200 MHz 1 GHz 22 nm 3 MiB 15 100 FCBGA1168
SR191 4210Y 1.5 GHz 1.9 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168
NA 4202Y 1.6 GHz 2.0 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 NA
SR15G 4200H 2.8 GHz 3.4 GHz 2 Yes HD 4600 400 MHz 1.15 GHz 22 nm 3 MiB 47 100 FCBGA1364
SR1HA 4200M 2.5 GHz 3.1 GHz 2 Yes HD 4600 400 MHz 1.15 GHz 22 nm 3 MiB 37 100 FCPGA946
SR170 4200U 1.6 GHz 2.6 GHz 2 Yes HD 4400 200 MHz 1 GHz 22 nm 3 MiB 15 100 FCBGA1168
SR18T 4200Y 1.4 GHz 1.9 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168 

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Originally at http://www.hardwaresecrets.com/article/All-Core-i5-Models/943


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