Introduction

The Core i7 is a CPU series manufactured by Intel aimed at high-end computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released so far.

Currently, there are two different generations of this CPU around, using a completely different internal microarchitecture. The 6xx, 7xx, 8xx, and 9xx models are based on the “Nehalem” microarchitecture and also known as “first generation,” while the 26xx, 27xx, 28xx, and 29xx models are based on the “Sandy Bridge” microarchitecture and also known as “second generation.”

In the past, Intel processors used an external memory controller located in the north bridge chip (also known as Memory Controller Hub, MCH). This means that with CPUs using this older architecture, the chipset (and therefore, the motherboard) is the component that sets the type and amount of memory you can install in the computer. With the Core i processor line, the memory controller is embedded in the CPU, and it is the processor (and not the chipset) that sets the memory type and amount you may have installed in your system. The motherboard, however, may have a limitation on the amount of memory you can install.

The memory controller integrated in the Core i7 accepts only DDR3 memories, supporting the now standard dual-channel (triple-channel on socket 1366 models) architecture up to 1.6 V. Memory modules which require voltages higher than this will not work and may even damage the processor. The speeds supported will depend on the CPU model, as we will present in the next pages.

Socket 1366 models use a triple-channel memory architecture, meaning that they access three memory modules at the same time. So, with these CPUs, you must install at least three memory modules in order to reach the maximum performance they can provide. This architecture provides a 50% bandwidth increase compared to the dual-channel architecture. For example, DDR3-1066 memories working in dual channel mode have a maximum theoretical transfer rate of 17 GB/s, while if working in triple channel they have a maximum theoretical transfer rate of 25.5 GB/s.

Core i7 CPUs (except socket 1366 models) also have an embedded PCI Express 2.0 controller, so with these processors, the video card is connected directly to the CPU, which in theory can improve the practical bandwidth achieved. These CPUs can access one video card at x16 transfer rate or two at x8 speed each. Because in these models the PCI Express 2.0 controller is integrated inside the CPU, Intel decided to use a lower-speed bus called DMI (Digital Media Interface), which operates at 1 GB/s (first-generation Core i7) or 2 GB/s (second-generation Core i7) in each direction, to connect the CPU to the chipset. This bus was used to connect the north bridge chip to the south bridge chip on previous chipsets from Intel. The lower bandwidth isn’t a problem, since a high-bandwidth bus is no longer needed given that the video card and memory are now connected directly to the CPU.

Socket 1366 models don’t have this embedded PCI Express 2.0 controller, and this component is located in the north bridge chip from the chipset. Because of that, it uses a high-speed bus called QuickPath Interface (QPI) to be connected to this chip. This bus works at 2.4 GHz (4.8 GB/s) on Core i7 and 3.2 GHz (6.4 GB/s) on Core i7 Extreme processors.

Some Core i7 models have an integrated video controller. On these models, the on-board video is controlled by the CPU and not by the motherboard chipset.

Core i7 CPUs have a base clock from which all other clocks are derived. The default base clock is 133 MHz for all first-generation models and 100 MHz for all second-generation models.

Core i7 processors have Turbo Boost technology, which is an automatic overclocking feature (i.e., the CPU increases its clock rate above the official number when it “feels” that the system is requiring more processing power).

The main technical features of Core i7 processors include:

• Nehalem (6xx, 7xx, 8xx, and 9xx) or Sandy Bridge (26xx, 27xx, 28xx, and 29xx) microarchitecture
• 64 KB L1 cache (32 KB data + 32 KB instruction) per core
• 256 KB L2 cache per core (renamed to “mid-level cache” or “MLC” in the Sandy Bridge microarchitecture)
• Between 4 MB and 12 MB shared L3 cache memory (renamed to “last-level cache” or “LLC” in the Sandy Bridge microarchitecture), depending on the model
• Dual-core, quad-core and six-core technology
• Socket 1156 or 1366 on Nehalem-based desktop models, socket 1155 on Sandy Bridge-based desktop models, socket 988 or 1288 on Nehalem-based mobile models, socket 988, 1023 and 1224 on Sandy Bridge-based mobile models
• DMI bus (1 GB/s per direction on Nehalem-based models or 2 GB/s per direction on Sandy Bridge-based models), except on socket 1366 models
• QPI bus on socket 1366 models
• Integrated memory controller supporting DDR3 memories in dual- or triple-channel architecture (see next pages for supported speeds)
• Integrated PCI Express 2.0 controller (one x16 lane or two x8 lanes), except socket 1366 models
• Integrated DirectX 10 (Nehalem-based models) or DirectX 10.1 (Sandy Bridge-based models) video processor
• Intel Turbo Boost Technology
• Virtualization technology
• Intel EM64T technology 
• Hyper-Threading (HT) technology
• SSE4.2 instruction set
• AES-NIS instruction set
• AVX (Advanced Vector Extensions) instruction set (Sandy Bridge models only)
• Execute Disable Technology
• Enhanced SpeedStep Technology
• 45-nm or 32-nm manufacturing process

For a more detailed explanation about the Core i7 processors with all the differences between the Nehalem microarchitecture and the Sandy Bridge microarchitecture, please read our “Inside the Intel Nehalem Microarchitecture” and “Inside the Intel Sandy Bridge Microarchitecture” tutorials.

Let’s now take a look at all Core i7 models launched so far.

First-Generation Core i7 Desktop Models

In the table below, we listed all first-generation Core i7 desktop CPU models, which are based on the Nehalem microarchitecture. Models based on the socket 1156 use dual-channel memory architecture, supporting DDR3 memories up to 1,333 MHz, while models based on the socket 1366 use triple-channel memory architecture supporting DDR3 memories up to 1,066 MHz.

Socket 1156 models also have an integrated PCI Express 2.0 controller, supporting one x16 lane, which can be split into two x8 lanes for accessing two discrete video cards. On these CPUs, communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction). Socket 1366 models don’t have an integrated PCI Express controller, and they talk to the chipset using a QPI bus working at 2.4 GHz (4.8 GB/s) on the “regular” models or at 3.2 GHz (6.4 GB/s) on the “Extreme” models, which are listed in a separate table below.

The first-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.

sSpec	Model	Internal Clock	Turbo Boost	Cores	HT	Video	L3 Cache	Tech.	TDP (W)	Max. Temp. (oC)	Socket
SLBYU	980	3.33 GHz	3.60 GHz	6	Yes	No	12 MB	32 nm	130	68.8	1366
SLBVF	970	3.20 GHz	3.46 GHz	6	Yes	No	12 MB	32 nm	130	67.9	1366
SLBEU	960	3.20 GHz	3.46 GHz	4	Yes	No	8 MB	45 nm	130	67.9	1366
SLBEN	950	3.06 GHz	3.32 GHz	4	Yes	No	8 MB	45 nm	130	67.9	1366
SLBCK	940	2.93 GHz	3.20 GHz	4	Yes	No	8 MB	45 nm	130	67.9	1366
SLBKP	930	2.80 GHz	3.06 GHz	4	Yes	No	8 MB	45 nm	130	67.9	1366
SLBEJ	920	2.66 GHz	2.93 GHz	4	Yes	No	8 MB	45 nm	130	67.9	1366
SLBCH	920	2.66 GHz	2.93 GHz	4	Yes	No	8 MB	45 nm	130	67.9	1366
SLBPS	880	3.06 GHz	3.74 GHz	4	Yes	No	8 MB	45 nm	95	72.7	1156
SLBS2	875K	2.93 GHz	3.60 GHz	4	Yes	No	8 MB	45 nm	95	72.7	1156
SLBQ7	870S	2.66 GHz	3.60 GHz	4	Yes	No	8 MB	45 nm	82	NA	1156
SLBJG	870	2.93 GHz	3.60 GHz	4	Yes	No	8 MB	45 nm	95	72.7	1156
SLBLG	860s	2.53 GHz	3.46 GHz	4	Yes	No	8 MB	45 nm	82	76.7	1156
SLBJJ	860	2.80 GHz	3.46 GHz	4	Yes	No	8 MB	45 nm	95	72.7	1156

In the table below, you will find all first-generation Core i7 Extreme models for desktops. These models have the QPI bus running at a higher clock rate (3.2 GHz, 6.4 GB/s) and come with their clock multiplier and Turbo Boost options unlocked, providing additional overclocking options.

sSpec	Model	Internal Clock	Turbo Boost	Cores	HT	Video	L3 Cache	Tech.	TDP (W)	Max. Temp. (oC)	Socket
SLBVZ	990X	3.46 GHz	3.73 GHz	6	Yes	No	12 MB	32 nm	130	67.9	1366
SLBUZ	980X	3.33 GHz	3.60 GHz	6	Yes	No	12 MB	32 nm	130	67.9	1366
SLBEQ	975	3.33 GHz	3.60 GHz	4	Yes	No	8 MB	45 nm	130	67.9	1366
SLBCJ	965	3.20 GHz	3.46 GHz	4	Yes	No	8 MB	45 nm	130	67.9	1366

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

First-Generation Core i7 Mobile Models

The first-generation Core i7 processors targeted to laptops can use two different pin-outs, PGA988 or BGA1288, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz or 1,366 MHz DDR3 memories. They have an integrated PCI Express 2.0 controller, supporting one device at x16 speed, and some of them have an integrated DirectX 10 video controller running at 166 MHz (18 W TDP models), 266 MHz (25 W TDP models) or 500 MHz (35 W TDP models). Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction).

First-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpec	Model	Internal Clock	Turbo Boost	Cores	HT	Video Clock	L3 Cache	Tech.	TDP (W)	Max. Temp. (oC)	Socket
SLBMP	840QM	1.86 MHz	3.20 GHz	4	Yes	No Video	8 MB	45 nm	45	100	PGA988
SLBLX	820QM	1.73 GHz	3.06 GHz	4	Yes	No Video	8 MB	45 nm	45	100	PGA988
SLBQG	740QM	1.73 GHz	2.93 GHz	4	Yes	No Video	6 MB	45 nm	45	100	PGA988
SLBLY	720QM	1.60 GHz	3.28 GHz	4	Yes	No Video	6 MB	45 nm	45	100	PGA988
SLBST	680UM	1.46 GHz	2.53 GHz	2	Yes	166 MHz	4 MB	32 nm	18	105	BGA1288
SLBSS	660UM	1.33 GHz	2.40 GHz	2	Yes	166 MHz	4 MB	32 nm	18	105	BGA1288
SLBWV	660UE	1.33 GHz	2.40 GHz	2	Yes	166 MHz	4 MB	32 nm	18	105	BGA1288
SLBMM	640UM	1.20 GHz	2.26 GHz	2	Yes	166 MHz	4 MB	32 nm	18	105	BGA1288
SLBMK	640LM	2.13 GHz	2.93 GHz	2	Yes	266 MHz	4 MB	32 nm	25	105	BGA1288
SLBTN	640M	2.80 GHz	3.46 GHz	2	Yes	500 MHz	4 MB	32 nm	35	105	PGA988
SLBZU	640M	2.80 GHz	3.46 GHz	2	Yes	500 MH	4 MB	32 nm	35	105	BGA1288
SLBML	620LM	2.00 GHz	2.80 GHz	2	Yes	266 MHz	4 MB	32 nm	25	105	BGA1288
SLBMN	620UM	1.06 GHz	2.13 GHz	2	Yes	166 MHz	4 MB	32 nm	18	105	BGA1288
SLBTQ	620M	2.66 GHz	3.33 GHz	2	Yes	500 MHz	4 MB	32 nm	35	105	PGA988
SLBPE	620M	2.66 GHz	3.33 GHz	2	Yes	500 MHz	4 MB	32 nm	35	105	BGA1288
SLBPD	620M	2.66 GHz	3.33 GHz	2	Yes	500 MHz	4 MB	32 nm	35	105	PGA988
SLBSU	620LM	2.00 GHz	3.33 GHz	2	Yes	500 MHz	4 MB	32 nm	35	105	BGA1288
SLBML	620LM	2.00 GHz	2.80 GHz	2	Yes	266 MHz	4 MB	32 nm	25	105	BGA1288
SLBXX	610E	2.53 GHz	3.20 GHz	2	Yes	500 MHz	4 MB	32 nm	35	105	BGA1288

In the table below, you will find all first-generation mobile Core i7 Extreme models. It comes with its clock multiplier and Turbo Boost options unlocked, adding more overclocking options for the enthusiast. 

sSpec	Model	Internal Clock	Turbo Boost	Cores	HT	Video	L3 Cache	Tech.	TDP (W)	Max. Temp. (oC)	Socket
SLBSC	940XM	2.13 GHz	3.33 GHz	4	Yes	No	8 MB	45 nm	55	100	PGA988
SLBLW	920XM	2.00 GHz	3.2 GHz	4	Yes	No	8 MB	45 nm	55	100	PGA988

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

Second-Generation Core i7 Desktop Models

In the table below, we listed all second-generation Core i7 desktop CPU models, which are based on the Sandy Bridge microarchitecture. All models are based on the socket 1155, and the integrated memory controller supports dual-channel architecture with 1,066 MHz or 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller, supporting one x16 lane, which can be split into two x8 lanes for accessing two discrete video cards. Communication with the motherboard chipset is done through a DMI bus (2 GB/s in each direction). All models have an integrated DirectX 10.1 video controller running at 850 MHz, with six (HD 2000) or 12 (HD 3000) processing cores.

All second-generation Core i7 desktop CPUs are quad-core processors, supporting Hyper-Threading technology, so the operating system recognizes them as eight-core models, but only half the recognized cores are “real;” the other half are simulated.

sSpec	Model	Internal Clock	Turbo Boost	Cores	HT	Video	L3 Cache	Tech.	TDP (W)	Max. Temp. (oC)	Socket
SR00E	2600S	2.80 GHz	3.80 GHz	4	Yes	HD 2000	8 MB	32 nm	65	69.1	1155
SR00C	2600K	3.40 GHz	3.80 GHz	4	Yes	HD 3000	8 MB	32 nm	95	72.6	1155
SR00B	2600	3.40 GHz	3.80 GHz	4	Yes	HD 2000	8 MB	32 nm	95	72.6	1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

Second-Generation Core i7 Mobile Models

The second-generation Core i7 processors targeted to laptops can use three different pin-outs, PGA988, BGA1023 or BGA1224, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz or 1,600 MHz DDR3 memories. They have an integrated PCI Express 2.0 controller, supporting one device at x16 speed, and an integrated DirectX 10.1 video controller running at 350 MHz or 650 MHz, with 12 processing cores (HD 3000 engine).

All second-generation Core i7 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs. 

sSpec	Model	Internal Clock	Turbo Boost	Cores	HT	L3 Cache	Video Clock	Tech.	TDP (W)	Max. Temp. (oC)	Socket
SR00U	2820QM	2.30 GHz	3.40 GHz	4	Yes	8 MB	650 MHz	32 nm	45	100	BGA1224
SR012	2820QM	2.30 GHz	3.40 GHz	4	Yes	8 MB	650 MHz	32 nm	45	100	PGA988
SR00W	2720QM	2.20 GHz	3.30 GHz	4	Yes	6 MB	650 MHz	32 nm	45	100	BGA1224
SR014	2720QM	2.20 GHz	3.30 GHz	4	Yes	6 MB	650 MHz	32 nm	45	100	PGA988
SR02T	2710QE	2.10 GHz	3.00 GHz	4	Yes	6 MB	650 MHz	32 nm	45	100	PGA988
SR0D2	2677M	1.80 GHz	2.90 GHz	2	Yes	4 MB	350 MHz	32 nm	17	100	BGA1023
SR03S	2657M	2.60 GHz	2.70 GHz	2	Yes	6 MB	350 MHz	32 nm	17	100	BGA1023
SR078	2655LE	2.20 GHz	2.90 GHz	2	Yes	4 MB	650 MHz	32 nm	25	100	BGA1023
SR04N	2649M	2.30 GHz	3.20 GHz	2	Yes	4 MB	350 MHz	32 nm	25	100	BGA1023
NA	2640M	2.80 GHz	3.50 GHz	2	Yes	4 MB	650 MHz	32 nm	35	100	BGA1023
SR0D3	2637M	1.70 GHz	2.80 GHz	2	Yes	4 MB	350 MHz	32 nm	17	100	BGA1023
SR030	2635QM	2.00 GHz	2.90 GHz	4	Yes	6 MB	650 MHz	32 nm	45	100	BGA1224
SR02Y	2630QM	2.00 GHz	2.90 GHz	4	Yes	6 MB	650 MHz	32 nm	45	100	PGA988
SR04D	2629M	2.10 GHz	3.00 GHz	2	Yes	4 MB	350 MHz	32 nm	25	100	BGA1023
SR03F	2620M	2.70 GHz	3.40 GHz	2	Yes	4 MB	650 MHz	32 nm	35	100	PGA988
SR041	2620M	2.70 GHz	3.40 GHz	2	Yes	4 MB	650 MHz	32 nm	35	100	BGA1023
SR03T	2617M	1.50 GHz	2.60 GHz	2	Yes	4 MB	350 MHz	32 nm	17	100	BGA1023

In the table below, you will find the only second-generation mobile Core i7 Extreme processor model released so far. It comes with its clock multiplier and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.

sSpec	Model	Internal Clock	Turbo Boost	Cores	HT	L3 Cache	Video Clock	Tech.	TDP (W)	Max. Temp. (oC)	Socket
SR02F	2960XM	2.70 GHz	3.70 GHz	4	Yes	8 MB	650 MHz	32 nm	55	100	PGA998
SR02E	2920XM	2.50 GHz	3.50 GHz	4	Yes	8 MB	650 MHz	32 nm	55	100	PGA988

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.