All Core Duo and Core Solo Models
By Rafael Otto Coelho e Cássio Lima on March 31, 2009


Introduction

Core Duo (formerly known by its codename, Yonah) was the first dual-core Intel CPU targeted to the mobile market, i.e. inside it there are two complete CPUs. Curiously it was also the first Intel processor to be adopted by Apple Computer. In this tutorial we will present the main features of Core Duo and Core Solo and tables with all models released to date.

Watch out to not confuse Core Duo with Core 2 Duo. Core Duo is the commercial name for the Pentium M processor with two processing cores and manufactured under 65 nm process. Core 2 Duo on the other hand is the commercial name for the processor codenamed Merom (for laptops) or Conroe (for desktops), using the new Core microarchitecture, which is the same microarchitecture used by Pentium M but with more features added.

Core Duo is, in fact, a Pentium M with two cores and manufactured using 65-nm process (currently Pentium M is manufactured using 90 nm process). For an in-depth understanding of Core Duo, we suggest you to read our tutorials Intel Dual Core Technology and Inside Pentium M Architecture. Our tutorial All Pentium M Models is also a good read if you wish to compare Core Duo to Pentium M. And if you are interested in the internal architecture used by Core Duo, read our Inside Pentium M Architecture tutorial.

Even though it has two CPU cores inside the same package, Core Duo die size is almost the same of Pentium M’s (Dothan die). This means that the cost for manufacturing Core Duo is practically the same of Pentium M, which has just one core. Core Duo has 151.6 million transistors occupying an area of 90.3 mm2 (0.14 sq inch) while Pentium M based on Dothan die has 140 million transistors on an 87.66 mm2 (0.135 sq inch) area. Keep in mind that Core Duo is manufactured under 65-nm process while Pentium M is manufactured under 90 nm one.

Core Duo
click to enlarge
Figure 1: Core Duo die.

Core Duo’s L2 memory cache is of 2 MB shared between its cores (Intel calls this shared L2 implementation “Smart Cache”). On Pentium D 840, for instance, which is a dual-core CPU, its 2 MB L2 memory cache is split between the cores, so each core has access to only 1 MB each. I.e. on Pentium D there are two 1 MB L2 memory caches, one per core. On Core Duo there is only one 2 MB L2 memory cache, which is shared between the two cores. Core 2 Duo, by the way, uses this same architecture that was introduced with Core Duo.

With a shared memory cache, the amount of memory cache that each core uses isn’t fixed. With a 2 MB L2 memory cache one core may be using 1.5 MB and the other 512 KB (0.5 MB) at a given moment, for example. If on a dual-core CPU with separated L2 memory cache one of the cores run out of cache (i.e. its 1 MB is being fully used) it needs to go directly to the slow RAM memory to fetch the required data, slowing down the system performance. On CPUs with shared L2 memory cache, each core can simply resize the amount of L2 memory cache it is using.

Another advantage of shared L2 memory cache is that if one core fetched a data (or a instruction) and stored it on the L2 cache, the other core can use this same piece of information. In dual-core CPUs with separated memory caches the second core would have to grab this data (or instruction) thru the CPU local bus, i.e. “from outside”, using the local bus clock, which is far inferior than the processor internal clock, thus slowing down the system performance.

Core Duo main features are the following:

Core Sole is a Core Duo version with just one processing core. It keeps all other Core Duo technical specs, like 2 MB memory cache, 65 nm manufacturing process, virtualization technology, Execute Disable technology, Enhanced SpeedStep technology, SSE3 instruction set and 533- or 667 MHz external bus.

Core Duo and Core Solo are components from the Centrino platform. For complete details on the Centrino platform read our tutorial Everything You Need To Know About The Centrino Platform.

Core Duo Models

On the table below you will find all Core Duo models released so far. As you can see, the thermal dissipation (TDP, Thermal Design Power) of the models starting with a “T” if of 31 W, the thermal dissipation of the models starting with an “L” is of 15 W and the thermal dissipation of the models starting with a "U" is of only 9 W.

Just put Core Duo spec in perspective, Turion 64 ML-44 model, which this the AMD CPU targeted to the mobile market having just one core, has a TDP of 35 W.

Model

sSpec

Internal Clock

External Clock

TDP

Voltage

Max. Temp. (º C)

T2700

SL9JP

2.33 GHz

667 MHz

31 W

1.1625V - 1.30V

100

T2700

SL9K4

2.33 GHz

667 MHz

31 W

-

100

T2600

SL9JN

2.16 GHz

667 MHz

31 W

1.1625V - 1.30V

100

T2600

SL8VN

2.16 GHz

667 MHz

31 W

1.25V - 1.4V

100

T2600

SL8VS

2.16 GHz

667 MHz

31 W

-

100

T2600

SL9K3

2.16 GHz

667 MHz

31 W

1.1625V - 1.30V

100

T2500

SL9K2

2 GHz

667 MHz

31 W

1.1625V - 1.30V

100

T2500

SL9EH

2 GHz

667 MHz

31 W

1.1625V - 1.30V

100

T2500

SL8VT

2 GHz

667 MHz

31 W

1.1625V - 1.30V

100

T2500

SL8VP

2 GHz

667 MHz

31 W

1.1625V - 1.30V

100

T2450SLA4M2 GHz533 MHz31 W-100
T2350SL9JK1.86 GHz533 MHz31 W-100

T2400

SL8VU

1.83 GHz

667 MHz

31 W

-

100

T2400

SL9JM

1.83 GHz

667 MHz

31 W

1.1625V - 1.30V

100

T2400

SL9JZ

1.83 GHz

667 MHz

31 W

1.1625V - 1.30V

100

L2500

SL9JU

1.83 GHz

667 MHz

15 W

0.950V-1.175V

100

T2400

SL8VQ

1.83 GHz

667 MHz

31 W

1.25V - 1.4V

100

T2250SL9DV1.73 GHz533 MHz31 W-100

L2400

SL8VW

1.66 GHz

667 MHz

15 W

0.950V-1.175V

100

T2300

SL8VV

1.66 GHz

667 MHz

31 W

-

100

T2300

SL8VR

1.66 GHz

667 MHz

31 W

1.25V - 1.4V

100

T2300E

SL9DM

1.66 GHz

667 MHz

31 W

1.1625V - 1.30V

100

T2300E

SL9DN

1.66 GHz

667 MHz

31 W

1.1625V - 1.30V

100

T2300E

SL9JE

1.66 GHz

667 MHz

31 W

1.1625V - 1.30V

100

L2400

SL9JT

1.66 GHz

667 MHz

15 W

0.950V-1.175V

100

T2300

SL9JL

1.66 GHz

667 MHz

31 W

-

100

T2050SL9BN1.6 GHz533 MHz31 W-100

L2300

SL9JS

1.50 GHz

667 MHz

15 W

0.950V-1.175V

100

L2300

SL8VX

1.50 GHz

667 MHz

15 W

0.950V-1.175V

100

U2500

SL99V

1.20 GHz

533 MHz

9 W

0.9375V-1.175V

100

U2400

SL99W

1.06 GHz

533 MHz

9 W

0.9375V-1.175V

100

Core Solo Models

Core Sole is a Core Duo version with just one processing core. It keeps all other Core Duo technical specs, like 2 MB memory cache, 65 nm manufacturing process, virtualization technology, Execute Disable technology, Enhanced SpeedStep technology, SSE3 instruction set and 533- or 667 MHz external bus.

On the table below you will find all Core Solo models released so far. As you can see, the thermal dissipation (TDP, Thermal Design Power) of the models starting with a “T” if of 31 W, while the thermal dissipation of the models starting with a “U” is only 5.5 W.

Model

sSpec

Internal Clock

External Clock

TDP

Voltage

Max. Temp. (º C)

T1400

SL92X

1.83 GHz

667 MHz

31 W

1.1625V – 1.30V

100

T1400

SL92V

1.83 GHz

667 MHz

31 W

1.1625V – 1.30V

100

T1400

SL9L5

1.83 GHz

667 MHz

31 W

-

100

T1350SL99T1.86 GHz533 MHz31 W-100

T1300

SL8W3

1.66 GHz

667 MHz

31 W

-

100

T1300

SL8VY

1.66 GHz

667 MHz

31 W

1.25V-1.4V

100

T1300

SL9L4

1.66 GHz

667 MHz

31 W

-

100

U1500SL9LC1.33 GHz533 MHz5.5 W0.950 V - 0.975 V100

U1400

SL8W6

1.20 GHz

533 MHz

5.5 W

0.950 V - 0.975 V

100

U1300

SL8W7

1.06 GHz

533 MHz

5.5 W

0.950 V - 0.975 V

100

Originally at http://www.hardwaresecrets.com/article/311


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