| Kingmax Factory Tour in Hsin Chu, Taiwan | |
| By Gabriel Torres on June 3, 2005 | Page 2 of 9 |
Kinpak Factory Tour
Memory packing process is divided into two big steps: front-end and back-end. On Figure 2 you can see the steps inside the front-end process, while on Figure 3 you can see the steps inside the back-end process.
The whole process isn’t fast. For BGA memory chips the front-end process takes 5 days, while the back-end process takes 4.5 or 5.5 days.
| |
| Originally at http://www.hardwaresecrets.com/article/148/2 | Pages (9): 1 2 3 4 5 6 7 8 » ... Last » |
© 2004-8, Hardware Secrets, LLC. All Rights Reserved. Total or partial reproduction of the contents of this site, as well as that of the texts available for downloading, be this in the electronic media, in print, or any other form of distribution, is expressly forbidden. Those who do not comply with these copyright laws will be indicted and punished according to the International Copyrights Law. We do not take responsibility for material damage of any kind caused by the use of information contained in Hardware Secrets. | |