Kingmax has launched DDR3-2400 memory modules equipped with an 'invisible' heatsink. The module does not use a standard aluminum/copper heatsink to remove heat from the memory chips. Instead, it use a Nano Thermal Dissipation Technology that use a nano-sized thermal dissipation silicon compound that fills up invisible empty space on the memory chip surface to remove heat more quickly. The modules are available in 4 GB (2 GB x 2) kits, work at 2,400 MHz with CL10 timings and operate from 1.5 V to 1.8 V. No word on pricing and availability.