During CeBIT 2009, ASUS showed a new motherboard concept called Marine Cool, with the aim of improving stability and cooling system on the motherboards. By doing this ASUS want to present and discuss the Marine Cool concept before implementing it on upcoming products.
As you can see on the pictures below, the conceptual Marine Cool motherboard has a futuristic design. Its heat-pipe system, in charge of cooling the main motherboard components, looks like a NASA robot. On the back part of the motherboard, where usually we find the solder side, there is a micro-porous ceramic backplate to provide a larger surface area (thus helping to effectively convey heat from the motherboard printed circuit board) and to protect terminals on the solder side of the board. According to ASUS this thermal design is up to 2 times better than standard solutions.
The conceptual Marine Cool motherboard has an on-board UPS using polymer battery that serves as an extra backup power supply that activates when a power failure is detected. This is a cool idea because it prevents damage on the on-board main components, loss of critical files and data corruption due to inconsistent and fluctuating power caused during unexpected blackouts.
This motherboard uses SO-DIMM memory modules (targeted to notebooks) instead of standard DDR-DIMM modules, which takes more space but are faster and stores more data than SO-DIMM modules. This board also features a built-in memory to help the system boot-up in the case of errors on the main memory system (this feature is called Failover Memory by ASUS).
So let’s see if ASUS will implement one of the Marine Cool concepts on upcoming products.
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Originally at http://www.hardwaresecrets.com/news/3708
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