Infineon announced a bunch of new high-density memory products for notebooks and graphics applications. Novelties in the first group consist of 2 GB dual-die based DDR2 SO-DIMMs with improved thermal condition and power consumption and 1 GB DDR2 Micro-DIMMs (with only 65% of the size of correspondent SO-DIMMs thanks to a new 214-pin “mezzanine connector”). On the graphics front, the company launched a 512 Mb GDDR3 memory – allowing production of cards with frame buffers of 512 MB and even 1 GB – and a 256 Mb DDR2 Graphics RAM.