STMicrolectronics claims to have developed a 4 Gb NAND flash capable of transmitting data at 36 MB/s. This rate, according to the company, is 50% better than the best results achieved to date. ST used an embedded error-correction processor that can detect and correct up to five errors per page employing a technique called BCH (Bose-Chaudhuri-Hocquenghem). The device was described at the International Solid State Circuits Conference (ISSCC).
Corsair has added a 2 GB kit to its DDR400 XPERT series featuring 2-3-3-6 timings. The modules, equipped with black cast aluminum heatspreaders, are tested to operate at 2.75 volts. The XPERT series uses an integrated microcontroller and embedded sensors to measure voltage, temperature and frequency and show it on a configurable alphanumeric display.
OCZ Technology has launched a new DDR2 memory clocked at 800 MHz and featuring its Xtreme Thermal Convection (XTC) heatspreader. The PC2-6400 EL Platinum XTC Edition brings latencies of 4-5-4-15 and operates at 2.1 volts (guaranteed up to 2.2 volts plus 5% withouth invalidating the warranty). The DDR2 memory is available in 512 MB modules and 1 GB dual channel kits (2 x 512 MB).
Mushkin has released new DDR2-667 modules as part os its Xtreme Performance series. The XP2-5300 has latencies of 3-3-3-10 and operates between 2.1 and 2.3 volts. The product, said to provide plenty of headroom for overclocking, includes a black heatspreader. The memory is available in 512 MB and 1 GB modules as well as 1 GB (2 x 512 MB) and 2 GB (2 x 1 GB) dual channel kits.
Lexar demonstrated at the Consumer Electronics Show (CES) a USB flash drive equipped with a storage capacity meter. To avoid excessive power consumption, the company used an electronic paper display from E Ink, instead of the traditional LCD. The bar meter is not as clear, but is completely readable. Actual launch dates were not disclosed by Lexar.
AMD has licensed a variety of patents from intellectual property firm Rambus. The USD 75 million deal comprises technology used in DDR2, DDR3, FB-DIMM and XDR controllers, among others. The agreement will last at least five years and, after this period, there is the possibility of renewal or extension. Specific terms, including financial details, were not disclosed. AMD might use Rambus’ DDR2 tech in its first processors supporting the standard to be released in the second quarter.
Pretec has released a new 8 GB USB drive as part of its i-Disk II lineup. The device, expected to be available this month for close to USD 600, is said to transfer data at up to 166x (25 MB/s). The 8 GB i-Disk II includes FlashMail, MobileLock and SecretZip software for data encryption, compression and write protection.
Unveiled last October, OCZ’s Xtreme Thermal Convection (XTC) heatspreaders, featuring an exclusive honeycomb design, are now available in DDR2 modules. The PC2-4200 and PC2-5400 Gold GX XTC have latencies of 3-3-3-12 and 4-4-4-12. Both operate at 1.9 volt, but are guaranteed up to 2.2 volts plus 5%. The DDR2 memories are available in 512 MB and 1 GB modules as well as 1 GB and 2 GB dual channel kits.
Imation has released, exclusively in Japan, a special line of USB drives in the shape of furry animals. The 128 MB devices measure 2.3x1.9x4.3 inches (6x5x11 cm) and are available in three options: crocodile, dog and hippopotamus. The connector is located inside the mouth of the animals. Suggested retail price is around USD 30.
Hynix has announced the availability of the world’s first 512 Mb GDDR4 devices. The new standard is said to improve data processing speed by close to two times that of GDDR3. Hynix’s 16Mx32 512 Mb GDDR4 operates at 2.9 Gbps. Mass production is expected to start in early 2006. Last October, Samsung announced the development of 256 Mb GDDR4 parts, slated to enter mass production in the second quarter of 2006.
Kingston has announced new 100x CompactFlash memory cards as part of its Ultimate series. According to the company, the devices are capable of reading at 18 MB/s and writing at 15 MB/s, which favor users of professional cameras. The card will be available in 4 GB (USD 289), 2 GB (USD 159) and 1 GB (USD 89) capacities. In September, TwinMOS announced a 140x CF card, but it did not specify release dates and pricing.
Freescale might be getting closer to an alternative for flash memory. The company has produced the first 24-megabit array based on silicon nanocrystals. Part of a category known as thin-film storage, the technology promises denser, faster and cheaper devices. The array was fabricated using 90-nm CMOS technology. Freescale said it plans to release nanocrystal flash memory, but gave no specific timetable.
Micron and Intel have agreed to form a joint-venture called IM Flash Technologies to produce NAND flash memory. Each company will initially contribute USD 1.2 billion to build plants in Idaho, Utah and Virginia. An additional USD 1.4 billion investment from each is expected over the next three years. Apple will pay IM USD 500 million as part of a broader strategy, which includes Hynix, Samsung and Toshiba, to secure NAND chips through 2010. The partnership should be finalized by the end of the year. Micron will have a majority stake of 51%.
OCZ has started shipping 1 GB PC-3200 and PC-4000 Gold GX XTC modules. Both use gold layered Xtreme Thermal Convection heatspreaders, which are said to allow increased ventilation and heat dissipation, thanks to an innovative honeycomb design. The PC-3200 (DDR400) device has latencies of 2-3-3-8, while values for the PC-4000 (DDR500) are 3-4-3-8. Modules are initially available in 2 GB dual channel kits.
Pretec plans to introduce a device supposed to be the world’s tiniest USB Flash drive. Measuring 1.06x0.74x0.47 inches (2.7x1.9x1.2 cm) and weighing only 0.3 ounce (1 gram), the iDisk Diamond is smaller than a standard USB connector. On the downside, it has a limited storage capacity of 128 MB. The card fits into the computer’s USB 2.0 port beneath the prong that goes inside a normal USB connector.
