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Home » News » Memory


[Apr 18, 2008] Corsair Releases Memory Line for Mac Pro
[Apr 15, 2008] Silicon-Power Releases New DDR3 1333
[Apr 11, 2008] OCZ Intros Flex II Memory Series
[Apr 09, 2008] Silicon Releases DDR3 1066
[Mar 27, 2008] PQI Launches Phoenix Series Turbo Immortality
[Mar 18, 2008] G.Skill Intros DDR3-1800 with Antazone Cooler
[Mar 18, 2008] Corsair Intros NVIDIA 790i Ultra SLI DDR3 Memory
[Mar 16, 2008] Corsair Releases Low-Latency Mac Memory
[Feb 25, 2008] PQI Releases DDR2-1066 4GB Dual Channel Kit
[Feb 22, 2008] OCZ Intros Reaper HPC DDR 3 Memory

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Corsair Releases Memory Line for Mac Pro
Author: Alessandra Carneiro Date: April 18, 2008 - 9:35 AM PST
Category: Memory
More Info: http://corsair.com/products/mac_memory.aspx

Corsair has announced the new Corsair high-density systems.  The new memory kits are buffered 667MHz solutions, available in 2 GB (2 x 1 GB modules) and 4 GB (2 x 2 GB modules) DIMM kits. They cost USD 165 (2 GB kit) and USD 225 (4 GB).


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Silicon-Power Releases New DDR3 1333
Author: Alessandra Carneiro Date: April 15, 2008 - 7:29 AM PST
Category: Memory
More Info: http://www.silicon-power.com/eng/dram.php

Silicon-Power today releases its DDR3 1333 SDRAM Unbuffered DIMM memory module, which uses the newest design of ASR (Automatic Self-Refresh) that reduces the refreshing frequency of memory modules, the temperature and power consumption. Each module has CL9 latencies and 1 GB of capacity.

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OCZ Intros Flex II Memory Series
Author: Alessandra Carneiro Date: April 11, 2008 - 10:27 AM PST
Category: Memory
More Info: http://www.ocztechnology.com/products/memory/ocz_ddr2_pc2_9200_flex_ii...

OCZ unveiled the Flex II memory series, which run at incredibly fast DDR2-1150 speeds for high-performance systems with integrated water-cooling. The new PC2-9200 Flex II Series combine a new heatspreader design with integrated liquid injection system and dedicated channels directly over the module’s ICs. The modules have latencies of 5-5-5-18 and they're are available in 4GB (2x2 GB) Dual Channel Kits.


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Silicon Releases DDR3 1066
Author: Alessandra Carneiro Date: April 9, 2008 - 9:06 AM PST
Category: Memory
More Info: http://www.silicon-power.com/eng/dram.php

Silicon-Power releases its DDR3 1066 memory modules. DDR3 supplies voltage has been decreased from 1.8V to 1.5V, hence reducing power consumption by 30% compared to the DDR2-800. It has capacity of 1GB and CL7.



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PQI Launches Phoenix Series Turbo Immortality
Author: Alessandra Carneiro Date: March 27, 2008 - 8:37 AM PST
Category: Memory
More Info: http://www.pqi.com.tw/product.asp?cate1=4

PQI announced Phoenix Series Turbo Immortality Edition DDR3-1600 4GB dual channel kit. The module operates at frequency of 1688MHz at 1.54V and 2GB capacity. When working in dual channel, a maximum theoretical bandwidth of 25.6GB/Sec can be reached. Utilizing Intel’s latest XMP (Extreme Memory Profiles) motherboards, the chipset will automatically overclock the modules to boost system performance.

It is equipped with heatsinks to increase heat dissipation area (effective up to removing 20% heat). It has frequency of 8-8-8-24.

pqi turbo memory
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G.Skill Intros DDR3-1800 with Antazone Cooler
Author: Alessandra Carneiro Date: March 18, 2008 - 11:15 AM PST
Category: Memory
More Info: http://newgskill.web-bi.net/bbs/zboard.php?&id=g_ddr3

G.Skill announced today the new DDR3-1800 CL7, which is equipped with the Antazone RamMod cooler to improve performance while operating under extreme overclocking conditions. G.Skill's DD3-1800 HZ Series comes with an 8000rpm silent micro blower fan with noise level of 20dBA. The modules feature clock speed of 1800MHz (PC3-14400), latencies of 7-7-7-18 and they are available in 2GB kit (2x1GB).


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Corsair Intros NVIDIA 790i Ultra SLI DDR3 Memory
Author: Alessandra Carneiro Date: March 18, 2008 - 11:00 AM PST
Category: Memory
More Info: http://www.corsair.com/products/xms3_dhx.aspx
Corsair announced their NVIDIA 790i Ultra SLI high-performance DDR3 partner memory offerings, including a record-breaking 2GHz module. All Corsair SLI-ready partner memory is pre-loaded with EPP2, designed to deliver an automatic memory performance boost for enthusiasts when used with the 790i Ultra SLI platform. Consumers can choose from the following EPP2-enabled DDR3 product offerings: DOMINATOR TW3X2G2000 2GB Kit, DOMINATOR TW3X2G1800    2GB Kit and XMS DHX TW3X2G1600 2GB Kit, a PC3-12800 with latencies of 9-9-9-24.
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Corsair Releases Low-Latency Mac Memory
Author: Alessandra Carneiro Date: March 16, 2008 - 7:09 PM PST
Category: Memory
More Info: http://www.corsair.com/products/notebook_memory.aspx

Corsair announced the world’s first high performance memory modules made especially for the Mac. The new Corsair Mac Memory modules are the industry’s first low latency modules specifically tuned for the new MacBook and MacBook Pro laptop computers, claims Corsair. The new PC2-5300 VSA4GSDSKIT667C4 modules has frequency of 4-4-4-12 and its available in 4GB kit for USD 159.99.

corsair mac memory
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PQI Releases DDR2-1066 4GB Dual Channel Kit
Author: Alessandra Carneiro Date: February 25, 2008 - 6:45 AM PST
Category: Memory
More Info: http://www.pqi.com.tw/product.asp?oid=77&CATE1=173

PQI announces 240-Pin DDR2-1066 4GB dual channel kit. The modules run at 1066MHz, have frequency of 5-5-5-15, operate at a low voltage of 1.92V and offer a maximum of 17GB/sec transfer rate. They also have diamond cut heat-spreaders with a phoenix graphic design.


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OCZ Intros Reaper HPC DDR 3 Memory
Author: Alessandra Carneiro Date: February 22, 2008 - 9:38 AM PST
Category: Memory
More Info: http://www.ocztechnology.com/products/memory/ocz_pc3_10666_reaper_hpc

OCZ releases two new Reaper HPC memory kits for enthusiasts upgrading to next generation of cutting-edge platforms. The PC3-10666 Reaper HPC Series is a DDR3 memory available in both 2GB and 4GB dual channel kits and offers support to the latest platforms and chipsets. It has latencies of 6-6-6-18 and runs at 1333 MHz. The Reaper HPC series uses heat pipe technology to remove heat from the main body of the modules. The addition of the extended fin array nearly doubles the total surface area available for heat dissipation, guarantees OCZ.

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