High-performance memory maker OCZ has launched a new line of products aimed at gamers. The Special Ops Edition features a camouflage motif over its XTC honeycomb heatspreaders. OCZ said the modules will have a low price tag but did not reveal prices. First products include DDR400 (2.5-3-3-8 latencies, 2.8 volts), DDR2-667 (4-4-4-12, 1.9 volt) and DDR2-800 (5-5-5-12, 2 volts) parts, available both as independent modules and dual channel kits.
After announcing the Enhanced Performance Profiles (EPP) standard along with Nvidia, Corsair today launched its first DDR2 products based on such specs, one of them setting a new memory speed record. The TWIN2X2048-8500C5 kit includes two 1 GB modules running at 1,066 MHz. The memory operates at 2.2 volts with low latencies of 5-5-5-15. Corsair also released 800 MHz TWIN2X2048-6400C4 kits with 4-4-4-12 latencies. Both series feature black XMS heat spreaders.
Intel, Micron, Sony, Hynix and other companies this week announced the formation of the Open NAND Flash Interface Working Group (ONFI), which aims do develop a standardized chip-level interface for the attachment of NAND flash memory to host systems. Among other things, the group wants to establish a common pin-out, a standard command set and a self identification mechanism. The specification is expected to be completed in the second half.
Standardization body JEDEC this week announced that it has formally approved the Fully Buffered Dual In-line Memory Module (FB-DIMM) specification. FB-DIMM provides greater bandwidth and a higher capacity per channel compared to current solutions. The standard is based on DDR2 memory and on-DIMM Advanced Memory Buffer (AMB). A fast serial bus channel between the memory and the host memory controller enables an easier routing for multiple channels across the motherboard. Future versions will scale up to the DDR3 generation now being standardized by JEDEC.
Taiwanese PQI will soon start shipping a tiny flash drive capable of holding up to 16 GB. The card-sized (85x54x3 mm or 3.3x2.1x1.2 in.) U510, featuring a retractable USB 2.0 connector, will be available in stylish silver, gray and a special edition soccer ball theme. Pricing is not yet known.
Kingmax has released a new 512 MB microSD card aimed at mobile phone users. The 15x11x11 mm device, which transfers data at up to 12.5 MB/s, also fit into standard SD slots with the use of a passive adapter. The company plans to launch a 1 GB model in the “near future”.
Taiwanese PQI has introduced a Secure Digital (SD) memory card equipped with USB interface. The Intelligent Stick Combo, thus, allows users to transfer data without a card reader. Compliant with USB 1.1 and 2.0, the device is the same size of a standard SD card, but has a detachable part which reveals the USB interface. DigiTimes reports that a 512 MB model will be released this week in Taiwan for the equivalent of USD 35.40. A 1 GB version is also planned.
OCZ has released a DDR2-667 memory with extremely low latencies of 3-3-3-15. The PC2-5400 Platinum Enhanced Latency XTC operates at 2.1 volts (guaranteed up to 2.2 volts even though DDR2’s standard supply is 1.8 volt). The memory, which features platinum mirrored XTC honeycomb heatspreaders, is available in 512 MB modules and 1 GB dual channel kits (2 x 512 MB).
Crucial and Shuttle are giving away three packages containing a Shuttle XPC SD11G5 desktop barebones system, 2 GB of DDR2-533 memory, a Crucial Radeon X1600 XT graphics card and Logitech’s cordless MX 5000 laser keyboard and mouse as well as Z-2300 speakers. The “Bad to the Bone” sweepstakes are open to U.S. residents with entries to be received until April 24. A random drawing on April 25 will indicate the three winners.
German Infineon Technologies today said that its memory spin-off will be called Qimonda. The new company will start operations on May 1 with current memory products business group head Kin Wah Loh as CEO. Qimonda will remain a wholly owned subsidiary of Infineon, but it will look at IPO opportunities. Infineon, meanwhile, will focus on producing semiconductors for automotive, industrial, security and communications electronics.
