| Kingmax Releases Modules with 'Invisible' Heatsink |
| Author: Cássio Lima | Date: June 8, 2010 - 9:00 AM PST |
| Category: Memory
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| More Info: http://www.kingmax.com/en_02_news_content.asp?sn=197 |
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Kingmax has launched DDR3-2400 memory modules equipped with an 'invisible' heatsink. The module does not use a standard aluminum/copper heatsink to remove heat from the memory chips. Instead, it use a Nano Thermal Dissipation Technology that use a nano-sized thermal dissipation silicon compound that fills up invisible empty space on the memory chip surface to remove heat more quickly. The modules are available in 4 GB (2 GB x 2) kits, work at 2,400 MHz with CL10 timings and operate from 1.5 V to 1.8 V. No word on pricing and availability.
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