Kinpak Factory Tour
As we’ve explained, Kinpak is Kingmax’s sister company specialized in packing, i.e., cutting the memory wafer and adding a packing and pins to the memory silicon.
Memory packing process is divided into two big steps: front-end and back-end. In Figure 2, you can see the steps inside the front-end process, while in Figure 3 you can see the steps inside the back-end process.
The whole process isn’t fast. For BGA memory chips the front-end process takes 5 days, while the back-end process takes 4.5 or 5.5 days.
- 1. Introduction
- 2. Kinpak Factory Tour
- 3. Kinpak Factory Tour (Cont’d)
- 4. Chip Testing
- 5. Chip Testing (Cont’d)
- 6. Chip Labeling
- 7. Memory Module Manufacturing
- 8. Soldering the Components
- 9. Memory Module Testing