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CQFP

Author: Gabriel Torres Last Updated: June 30, 2005 Category: Packaging Ceramic Quad Flat Package Integrated circuit packaging standard very similar to LCC. Its terminals are soldered directly to the printed circuit board, not requiring a socket like LCC. It is soldered to the printed circuit board with a technique called SMT. The material used is ceramic. Related Terms: LCC PGA SMT Print Version | Send to Friend | Bookmark this Term

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