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SEPP

Author: Gabriel Torres Last Updated: December 29, 2005 Category: Packaging Single Edge Processor Package SEPP is a packaging standard similar to SECC and SECC2 but without using a cartridge. The processor is soldered directly on a printed circuit board. It was used with the very first Celeron models. The edge contact used by SEPP processors has 242 pins and is called slot 1 or SC242. click to enlarge Figure 1: SEPP package, used by the very first Celeron processor models. Related Terms: SC242 SECC SECC2 Related Links: http://developer.intel.com/design/packtech/packbook.htm Print Version | Send to Friend | Bookmark this Term

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