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QFP

Author: Gabriel Torres Last Updated: December 22, 2005 Category: Packaging Quad Flat Package Packaging standard similar to LCC. QFP chip terminals are soldered directly on the printed circuit board using a special technique called SMT, thus TQFP chips don’t use sockets to be installed on printed circuit boards. When it uses ceramic as its main material it is called CQFP, and when it uses plastic as its main material it is called PQFP. One packaging type derived from QFP is TQFP (Thin Plastic Quad Flat Package), which is a thinner QFP. Figure 1: QFP packaging. Related Terms: BGA LCC PGA SMT Print Version | Send to Friend | Bookmark This Term

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