DIL

Author: Gabriel Torres Last Updated: October 17, 2005 Category: Packaging Dual In Line Package It is the most traditional integrated circuit packaging. It is the kind of packaging that makes integrated circuits to look like “black centipedes”. It uses two parallel terminal lines. Its miniature version is called SOP (Small Outline Package). This packing is also called DIP. Related Terms: DIL LCC QFP Print Version | Send to Friend

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