MSI launched so far five different socket LGA1156 motherboard models based on the new Intel P55 chipset. Today we are going to take a look at one of their high-end models, P55-GD80 (a.k.a. MS-7581), which comes with several overclocking features not found on competing products. Let’s take a look.

As you can see, P55-GD80 uses a cooling solution based on an 8-mm heat-pipe that, according to MSI, is to date the thickest heatpipe used on a motherboard (usually motherboards use 5-mm heat-pipes), which translates in a better cooling capability. It is interesting to note that the heatsink located on the left end of the heat-pipe in Figure 1 (i.e., the heatsink near the first x16 PCI Express slot) does not touch any component (there is no component below it), being used only to dissipate the heat produced by the voltage regulator circuit.

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Figure 1: MSI P55-GD80 motherboard.

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Figure 2: Cooling solution used on the voltage regulator circuit.