| Inside AMD K10 Architecture |
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| K10 Server CPUs Roadmap |
You can see K10-based server CPUs roadmap on Figures 9 and 10.  click to enlarge Figure 9: K10 server CPUs roadmap.
 click to enlarge Figure 10: K10 server CPUs roadmap.
As expected the first CPU to be launched using the new K10 architecture will be a quad-core Opteron processor based on “Barcelona” core. On Figure 11 you can see the Opteron "Barcelona" models AMD plans to launch and below it a table containing all models released so far.  click to enlarge Figure 11: Clock rates and TDP that will be available for the quad-core Opteron “Barcelona”.
AMD Opteron 2300 Series | Model | Core Frequency | TDP | 2350 | 2.0 GHz | 95W | 2347 | 1.9 GHz | 95W | 2347 HE | 1.9 GHz | 68W | 2346 HE | 1.8 GHz | 68W | 2344 HE | 1.7 GHz | 68W |
AMD Opteron 8300 Series | Model | Core Frequency | TDP | 8350 | 2.0 GHz | 95W | 8347 | 1.9 GHz | 95W | 8347 HE | 1.9 GHz | 68W | 8346 HE | 1.8 GHz | 68W |
Here is a quick summary of the cores that will be launched for the server market based on K10 architecture: - Barcelona: quad- or dual-core Opteron on the 2000 and 8000 series, 512 KB L2 memory cache per core, 2 MB L3 memory cache, registered DDR2 memory, socket 1207 (socket F), HyperTransport 1.x, 65 nm manufacturing process.
- Budapest: dual-core Opteron on the 1000 series, 512 KB L2 memory cache per core, 2 MB L3 memory cache, conventional DDR2 memory, socket 1207 (socket F), HyperTransport 1.x or 3.0, 65 nm manufacturing process.
- Shanghai: quad- or dual-core Opteron on the 2000 and 8000 series, 512 KB L2 memory cache per core, 6 MB L3 memory cache, registered DDR2 memory, socket 1207 (socket F), HyperTransport 1.x, 45 nm manufacturing process.
- Montreal: octal- or quad-core Opteron on the 2000 and 8000 series, 1 MB L2 memory cache per core, 6 MB or 12 MB L3 memory cache, registered DDR3 memory, socket G3, HyperTransport 1.x, 45 nm manufacturing process.
- Suzuka: quad- or dual-core Opteron on the 1000 series, 512 KB L2 memory cache per core, 6 MB L3 memory cache, conventional DDR3 memory, socket AM3, HyperTransport 3.0, 45 nm manufacturing process.
Let’s now see the planned desktop models. |
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