Xeon 31xx and 52xx processors, like 30xx, 51xx and 72xx models, are based on Core Microarchitecture, the same used by Core 2 Duo processors (to learn more about Core microarchitecture read our tutorial on this subject). The main difference between these models is the manufacturing process employed. While 30xx, 51xx and 72xx models use the 65 nm manufacturing process, 31xx and 52xx models use the new 45 nm process. This manufacturing process is also known by its codename Penryn. To learn more about this manufacturing process, read our Details on Intel’s Forthcoming 45 nm Manufacturing Technology and Penryn Core New Features articles. Notice that Penryn is the codename of the manufacturing process, not of the processor. The codename of Xeon 31xx and 52xx processors is Wolfdale.

There are other differences between Xeon 31xx and 52xx and the other Xeon CPUs based on Core microarchitecture described in the previous page besides the manufacturing process: the new SSE4 instruction set and a larger L2 memory cache.

All Xeon 31xx and 52xx processors have the following features:

• Core microarchitecture
• Dual-core technology
• 45 nm manufacturing process
• Socket 771 (52xx models) or 775 (31xx models)
• SSE4 Instruction Set
• 32 KB L1 instruction cache and 32 KB L1 data cache per core.
• 6 MB L2 cache shared by the two cores
• Execute Disable technology
• EM64T technology
• Virtualization technology
• Demand-Based Switching (DBS) technology
• Enhanced SpeedStep technology

Below you can find all Xeon 31xx and 52xx models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.