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The Winn L. Rosch Hardware Bible, 6th Edition (2 Vol. Set)
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Home » CPU
All Xeon Models
Author: Gabriel Torres and Cássio Lima
Type: Tutorials Last Updated: January 21, 2008
Page: 10 of 10
Real-time pricing for Intel BX80570E3110.
Intel Xeon Processor - 3.0GHz 6MB Cache 1333MHz FSB Wolfdale Dual-Core Retail Socket 775 Processor with Fan E3110 BX80570E3110 BX80570E3110
CircuitCity: $209.99 Amazon: $179.99
CompUSA: $209.99 RitzCamera: $203.29

Xeon 33xx and 54xx Models (Quad-Core, 45 nm)

Xeon 33xx and 54xx processors, like 32xx, 53xx and 73xx models, are based on Core Microarchitecture, the same used by Core 2 Duo processors (to learn more about Core microarchitecture read our tutorial on this subject). The main difference between these models is the manufacturing process employed. While 32xx, 52xx and 73xx models use the 65 nm manufacturing process, 33xx and 54xx models use the new 45 nm process. This manufacturing process is also known by its codename Penryn. To learn more about this manufacturing process, read our Details on Intel’s Forthcoming 45 nm Manufacturing Technology and Penryn Core New Features articles. Notice that Penryn is the codename of the manufacturing process, not of the processor. The codename of Xeon 33xx processors is Yorkfield, while the codename of 52xx processors is Hapertown.

There are other differences between Xeon 33xx and 54xx and the other Xeon CPUs based on Core microarchitecture described on the previous page besides the manufacturing process: the new SSE4 instruction set and a larger L2 memory cache.

The four cores available on Xeon 33xx and 54xx processors are obtained from two dual-core dies, just like the models described on the previous page. Because of that the L2 memory cache from these processors isn’t shared between all cores: cores 1 and 2 share the same L2 cache, while cores 3 and 4 share another L2 cache. The announced L2 cache size is the total amount of L2 cache available. Read our Intel Quad-Core Overview and Roadmap article for a more detailed explanation on the architecture used by these CPUs.

All Xeon 33xx and 54xx processors have the following features:

Below you can find all Xeon 33xx and 54xx models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.

sSpec

Model

Internal Clock

External Clock

L2 Cache

TDP

Max. Temp. (ºC)

Socket

SLANZ

X5482

3.20 GHz

1,600 MHz

12 MB

150 W

70

771

SLANP

X5460

3.16 GHz

1,333 MHz

12 MB

120 W

70

771

SLANR

E5472

3 GHz

1,600 MHz

12 MB

80 W

67

771

SLANQ

E5450

3 GHz

1,333 MHz

12 MB

80 W

67

771

SLASA

X5472

3 GHz

1,600 MHz

12 MB

120 W

70

771

SLASB

X5450

3 GHz

1,333 MHz

12 MB

120 W

70

771

SLANS

E5440

2.83 GHz

1,333 MHz

12 MB

80 W

67

771

N/A

X3360

2.83 GHz

1,333 MHz

12 MB

95 W

N/A

775

SLANT

E5462

2.80 GHz

1,600 MHz

12 MB

80 W

67

771

SLANU

E5430

2.66 GHz

1,333 MHz

12 MB

80 W

67

771

N/A

X3350

2.66 GHz

1,333 MHz

12 MB

95 W

N/A

775

SLANV

E5420

2.50 GHz

1,333 MHz

12 MB

80 W

67

771

N/A

X3320

2.50 GHz

1,333 MHz

6 MB

95 W

N/A

775

SLANW

E5410

2.33 GHz

1,333 MHz

12 MB

80 W

67

771

SLAP2

E5405

2 GHz

1,333 MHz

12 MB

80 W

67

771

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