All Xeon Models | Hardware Secrets

Xeon 33xx and 54xx processors, like 32xx, 53xx and 73xx models, are based on Core Microarchitecture, the same used by Core 2 Duo processors (to learn more about Core microarchitecture read our tutorial on this subject). The main difference between these models is the manufacturing process employed. While 32xx, 52xx and 73xx models use the 65 nm manufacturing process, 33xx and 54xx models use the new 45 nm process. This manufacturing process is also known by its codename Penryn. To learn more about this manufacturing process, read our Details on Intel’s Forthcoming 45 nm Manufacturing Technology and Penryn Core New Features articles. Notice that Penryn is the codename of the manufacturing process, not of the processor. The codename of Xeon 33xx processors is Yorkfield, while the codename of 52xx processors is Hapertown.

There are other differences between Xeon 33xx and 54xx and the other Xeon CPUs based on Core microarchitecture described on the previous page besides the manufacturing process: the new SSE4 instruction set and a larger L2 memory cache.

The four cores available on Xeon 33xx and 54xx processors are obtained from two dual-core dies, just like the models described on the previous page. Because of that the L2 memory cache from these processors isn’t shared between all cores: cores 1 and 2 share the same L2 cache, while cores 3 and 4 share another L2 cache. The announced L2 cache size is the total amount of L2 cache available. Read our Intel Quad-Core Overview and Roadmap article for a more detailed explanation on the architecture used by these CPUs.

All Xeon 33xx and 54xx processors have the following features:

Core microarchitecture
Quad-core technology
45 nm manufacturing process
Socket 771 (54xx models) or 775 (33xx models)
SSE4 Instruction Set
32 KB L1 instruction cache and 32 KB L1 data cache per core.
6 MB or 12 MB L2 cache
Execute Disable technology
EM64T technology
Virtualization technology
Demand-Based Switching (DBS) technology
Enhanced SpeedStep technology

Below you can find all Xeon 33xx and 54xx models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.

sSpec	Model	Internal Clock	External Clock	L2 Cache	TDP	Max. Temp. (ºC)	Socket
SLANZ	X5482	3.20 GHz	1,600 MHz	12 MB	150 W	70	771
SLANP	X5460	3.16 GHz	1,333 MHz	12 MB	120 W	70	771
SLANR	E5472	3 GHz	1,600 MHz	12 MB	80 W	67	771
SLANQ	E5450	3 GHz	1,333 MHz	12 MB	80 W	67	771
SLASA	X5472	3 GHz	1,600 MHz	12 MB	120 W	70	771
SLASB	X5450	3 GHz	1,333 MHz	12 MB	120 W	70	771
SLANS	E5440	2.83 GHz	1,333 MHz	12 MB	80 W	67	771
N/A	X3360	2.83 GHz	1,333 MHz	12 MB	95 W	N/A	775
SLANT	E5462	2.80 GHz	1,600 MHz	12 MB	80 W	67	771
SLANU	E5430	2.66 GHz	1,333 MHz	12 MB	80 W	67	771
N/A	X3350	2.66 GHz	1,333 MHz	12 MB	95 W	N/A	775
SLANV	E5420	2.50 GHz	1,333 MHz	12 MB	80 W	67	771
N/A	X3320	2.50 GHz	1,333 MHz	6 MB	95 W	N/A	775
SLANW	E5410	2.33 GHz	1,333 MHz	12 MB	80 W	67	771
SLAP2	E5405	2 GHz	1,333 MHz	12 MB	80 W	67	771