Memory modules from XMS series have heatsink, so they need to be attached, of course. The process of attaching the heatsink to the XMS memory modules is quite interesting.

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Figure 12: XMS memory modules without the heatsink installed.

The heatsinks are inserted into a metal frame (see Figure 13), and then thermal paste is applied on them (see Figure 14). Then, the memory module is placed on the heatsink, and the other side of the heatsink is placed on top of the memory module, forming a ”sandwich“. A latch makes pressure in order to make both sides of the heatsink to stick on the memory module (see Figure 15). The metal frame is then inserted into an oven, where the thermal paste will melt, ”gluing“ the heatsink to the memory module. After that the modules are removed from the frame and sent to the labeling station.

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Figure 13: Heatsinks.

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Figure 14: Machine applying solder paste on the heatsinks.

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Figure 15: Installing the heatsink to the memory module.