After applying solder paste, the panel enters into a SMD machine, process also known as ”pick-and-place“, where memory chips are picked by the machine and placed on the spots were they will be soldered. This machine also adds other components to the PCB, like small capacitors and the SPD chip.

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Figure 24: SMD machine.

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Figure 25: SMD machine adding components to the modules.

With the components added, the panel enters a big oven where the components will be soldered to the modules.

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Figure 26: Oven.

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Figure 27: Modules entering the oven.

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Figure 28: Modules exiting the oven.

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Figure 29: Quality control check.

Then the modules are cut from the panel and tested.