All Core i3 Models

Core i3-4xxx Models (Mobile)

As their desktop counterparts, the Core i3-4xxx models targeted to mobile computers are based on the Haswell microarchitecture and are also known as the fourth-generation Core i3 processors. They can use either the FCBGA1168 or the FCPGA946 pinout, which are not compatible with the pinout standard used by previous models.

Another difference is the support for AES-NI and AVX2 instructions, not available on previous models.

An important difference between the desktop and mobile models of the fourth-generation Core i3 is the PCI Express controller, which is 3.0 on desktop models, but 2.0 on mobile versions.

The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port (two-port on the 4005U model) SATA-600 controller. On these models, the PCI Express controller supports only one x4 connection or four x1 connections. On “M” models the PCI Express supports one x16 connection, two x8 connections, one x8 connection or two x4 connections.

Four graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 execution engines), HD 4400 (codenamed “GT2”, 20 execution engines), HD 4600 (also codenamed “GT2”, 20 execution engines) and Iris 5100 (codenamed “GT3”, 40 execution engines).

The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.

As mentioned earlier, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Cores HT Video Video Clock Vídeo Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SR18B 4158U 2.0 GHz 2 Sim Iris 5100 200 MHz 1.1 GHz 22 nm 3 MiB 28 100 FCBGA1168
NA 4100M 2.5 GHz 2 Sim HD 4600 400 MHz 1.1 GHz 22 nm 3 MiB 37 100 NA
SR1DC 4020Y 1.5 GHz 2 Sim HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168
NA 4012Y 1.5 GHz 2 Sim HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 NA
SR18F 4010Y 1.3 GHz 2 Sim HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168
SR16P 4010U 1.8 GHz 2 Sim HD 4400 200 MHz 1 GHz 22 nm 3 MiB 15 100 FCBGA1168
SR16Q 4010U 1.7 GHz 2 Sim HD 4400 200 MHz 1 GHz 22 nm 3 MiB 15 100 FCBGA1168
NA 4005U 1.7 GHz 2 Sim HD 4400 200 MHz 950 MHz 22 nm 3 MiB 15 100 NA
SR1HC 4000M 2.4 GHz 2 Sim HD 4600 400 MHz 1.1 GHz 22 nm 3 MiB 37 100 FCPGA946

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

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Author: Rafael Coelho

Rafael Otto Coelho is a physicist with a master's degree in Education, and is a college professor in Brazil.

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