Core i3-4xxx Models (Mobile)
As their desktop counterparts, the Core i3-4xxx models targeted to mobile computers are based on the Haswell microarchitecture and are also known as the fourth-generation Core i3 processors. They can use either the FCBGA1168 or the FCPGA946 pinout, which are not compatible with the pinout standard used by previous models.
Another difference is the support for AES-NI and AVX2 instructions, not available on previous models.
An important difference between the desktop and mobile models of the fourth-generation Core i3 is the PCI Express controller, which is 3.0 on desktop models, but 2.0 on mobile versions.
The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port (two-port on the 4005U model) SATA-600 controller. On these models, the PCI Express controller supports only one x4 connection or four x1 connections. On “M” models the PCI Express supports one x16 connection, two x8 connections, one x8 connection or two x4 connections.
Four graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 execution engines), HD 4400 (codenamed “GT2”, 20 execution engines), HD 4600 (also codenamed “GT2”, 20 execution engines) and Iris 5100 (codenamed “GT3”, 40 execution engines).
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.
As mentioned earlier, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.
|sSpec||Model||Clock||Cores||HT||Video||Video Clock||Vídeo Boost||Tech.||L3 Cache||TDP (W)||Max. Temp. (°C)*||Package|
|SR18B||4158U||2.0 GHz||2||Sim||Iris 5100||200 MHz||1.1 GHz||22 nm||3 MiB||28||100||FCBGA1168|
|NA||4100M||2.5 GHz||2||Sim||HD 4600||400 MHz||1.1 GHz||22 nm||3 MiB||37||100||NA|
|SR1DC||4020Y||1.5 GHz||2||Sim||HD 4200||200 MHz||850 MHz||22 nm||3 MiB||11.5||100||FCBGA1168|
|NA||4012Y||1.5 GHz||2||Sim||HD 4200||200 MHz||850 MHz||22 nm||3 MiB||11.5||100||NA|
|SR18F||4010Y||1.3 GHz||2||Sim||HD 4200||200 MHz||850 MHz||22 nm||3 MiB||11.5||100||FCBGA1168|
|SR16P||4010U||1.8 GHz||2||Sim||HD 4400||200 MHz||1 GHz||22 nm||3 MiB||15||100||FCBGA1168|
|SR16Q||4010U||1.7 GHz||2||Sim||HD 4400||200 MHz||1 GHz||22 nm||3 MiB||15||100||FCBGA1168|
|NA||4005U||1.7 GHz||2||Sim||HD 4400||200 MHz||950 MHz||22 nm||3 MiB||15||100||NA|
|SR1HC||4000M||2.4 GHz||2||Sim||HD 4600||400 MHz||1.1 GHz||22 nm||3 MiB||37||100||FCPGA946|
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.