All Core i3 Models

Core i3-3xx Models (Mobile)

The first-generation Core i3 targeted to laptops, named 3xx, uses the Nehalem microarchitecture. They can use two different pinouts, BGA1288 or socket G1, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories. (“UM” models support only DDR3-800 memories.) They have an integrated PCI Express 2.0 controller supporting one x16 connection, and an integrated DirectX 10 video controller running at 500 MHz with 667 MHz “boost” clock (166 MHz with 500 MHz “boost” clock in “UM” models). Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). These processors support two video monitors.

All Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SLC25 390M 2.66 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G1
SLC24 390M 2.66 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 105 BGA1288
SLBZX 380M 2.53 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G1
SLBSL 380UM 1.33 GHz 2 Yes HD Graphics 166 MHz 500 MHz 32 nm 3 MiB 18 105 BGA1288
SLBUK 370M 2.40 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G1
SLBU5 350M 2.26 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G1
SLBU6 350M 2.26 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 105 BGA1288
SLBPK 350M 2.26 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G2
SLBPL 350M 2.26 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 105 BGA1288
SLBNF 330M 2.13 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 105 BGA1288
SLBMD 330M 2.13 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G1
SLBUG 330UM 1.20 GHz 2 Yes HD Graphics 166 MHz 500 MHz 32 nm 3 MiB 18 105 BGA1288
SLBXW 330E 2.13 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 105 BGA1288

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

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Author: Rafael Coelho

Rafael Otto Coelho is a physicist with a master's degree in Education, and is a college professor in Brazil.

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